公开(公告)号：US20140318615A1

公开(公告)日：2014-10-30

申请号：US14325203

申请日：2014-07-07

Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE

Inventor： Soo Young OH ,  Yong Sung EOM ,  Jong Tae MOON ,  Kwang Seong CHOI

IPC: H01L31/0224

CPC classification number: H01L31/022425 ,  H01B1/22 ,  H01L31/02168 ,  Y02E10/50

Abstract: A conductive composition for a front electrode busbar of a silicon solar cell includes a metallic powder, a solder powder, a curable resin, a reducing agent, and a curing agent. A method of manufacturing a front electrode busbar of a silicon solar cell includes applying the composition to the front surface of the silicon solar cell wherein its front electrode finger line is formed. A substrate includes a front electrode busbar of a silicon solar cell, formed with a conductive composition. A silicon solar cell includes one or more electrodes containing a conductive composition including a conductive powder, a curable resin, a reducing agent, and a curing agent. A method of manufacturing the silicon solar cell includes forming a first electrode array with a first conductive composition, forming a second electrode, and forming a third electrode with a third conductive composition.

Abstract translation: 硅太阳能电池的前电极汇流条的导电组合物包括金属粉末，焊料粉末，固化树脂，还原剂和固化剂。 制造硅太阳能电池的前电极汇流条的方法包括将该组合物涂布在其前电极指线形成的硅太阳能电池的正面上。 基板包括由导电组合物形成的硅太阳能电池的前电极母线。 硅太阳能电池包括一个或多个包含导电组合物的电极，所述导电组合物包括导电粉末，可固化树脂，还原剂和固化剂。 制造硅太阳能电池的方法包括：用第一导电组合物形成第一电极阵列，形成第二电极，并用第三导电组合物形成第三电极。

公开(公告)号：US20150364445A1

公开(公告)日：2015-12-17

申请号：US14685400

申请日：2015-04-13

Applicant: Electronics and Telecommunications Research Institute

Inventor： Kwang Seong CHOI ,  Hyun Cheol BAE ,  Yong Sung EOM ,  Haksun LEE

IPC: H01L25/065 ,  H01L23/66 ,  H01L23/367 ,  H01L23/498

CPC classification number: H01L23/66 ,  H01L23/13 ,  H01L23/367 ,  H01L23/49811 ,  H01L23/5384 ,  H01L23/5385 ,  H01L24/97 ,  H01L25/0655 ,  H01L25/105 ,  H01L2223/6611 ,  H01L2223/6622 ,  H01L2224/04042 ,  H01L2224/05571 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48101 ,  H01L2224/48105 ,  H01L2224/48159 ,  H01L2224/48227 ,  H01L2224/48229 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/107 ,  H01L2225/1094 ,  H01L2924/10157 ,  H01L2924/1421 ,  H01L2924/14215 ,  H01L2924/15153 ,  H01L2924/15159 ,  H01L2924/15331 ,  H01L2924/157 ,  H01L2924/15787 ,  H01L2924/1627 ,  H01L2924/3011 ,  H01L2924/37001 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2224/85 ,  H01L2924/00

Abstract: Provided is a stack module package including: a first substrate where a first device is mounted, and a second substrate where a second device is mounted. The second substrate has a greater thickness than the first substrate, and the second device has a greater thickness than the first device. The first and second devices are vertically connected to each other. In the stack module package, vertical signal loss between the first and second substrates having different characteristics may be minimized

Abstract translation: 提供了一种堆叠模块封装，包括：安装第一器件的第一衬底和安装第二器件的第二衬底。 第二衬底具有比第一衬底更大的厚度，并且第二器件具有比第一器件更大的厚度。 第一和第二装置彼此垂直连接。 在堆叠模块封装中，可以使具有不同特性的第一和第二基板之间的垂直信号损失最小化