-
公开(公告)号：US20240087919A1
公开(公告)日：2024-03-14
申请号：US18458866
申请日：2023-08-30
申请人： Ebara Corporation
发明人： Jumpei FUJIKATA
IPC分类号： H01L21/67 , H01L21/304
CPC分类号： H01L21/67092 , H01L21/304 , H01L21/67173 , H01L21/67219 , H01L21/67253 , H01L2221/6834
摘要： The present disclosure provides a substrate processing apparatus and a protective layer forming method that can protect surfaces of metal regions after a polishing process from oxidation and adhesion of cutting chips and particles caused in a process after polishing. The substrate processing apparatus according to the present disclosure includes a polishing device for polishing a semiconductor substrate, a protective layer forming device for forming a protective layer on a surface of the substrate using a silane coupling agent or a resin protective film agent, and a control device. The control device controls the polishing device and the protective layer forming device such that the protective layer forming device forms the protective layer on the substrate after the polishing device finishes polishing the substrate.
-
公开(公告)号：US20180105946A1
公开(公告)日：2018-04-19
申请号：US15728175
申请日：2017-10-09
申请人： EBARA CORPORATION
CPC分类号： C25D3/28 , C01G3/02 , C01P2004/61 , C01P2006/80 , C25D3/38 , C25D7/123 , C25D17/001 , C25D17/02 , C25D17/10 , C25D21/12 , C25D21/14 , C25D21/18
摘要： Soluble copper oxide powder capable of preventing a decrease in quality of a copper film formed by plating is disclosed. The copper oxide powder contains copper and impurities including sodium. A concentration of the sodium is not more than 20 ppm. The copper oxide powder is regularly supplied into a plating solution. A voltage is applied between an insoluble anode and a substrate immersed in the plating solution, thereby plating the substrate.
-
公开(公告)号：US20170356098A1
公开(公告)日：2017-12-14
申请号：US15618879
申请日：2017-06-09
申请人： EBARA CORPORATION
发明人： Jumpei FUJIKATA
IPC分类号： C25D17/00
摘要： There is provided a feeder capable of reducing deterioration of the contact state between the feeder and an anode more than the prior art as dissolution of the anode progresses. The feeder can supply power to the anode 5 for use in plating a substrate in a plating tank. The feeder includes a main body portion 1 which can be disposed on an outer periphery of the anode 5 and a spring 88 which is disposed in the main body portion 1 and can apply a first force 100 to the main body portion 1 in a direction from the main body portion 1 toward a region 80 surrounded by the main body portion 1.
-
公开(公告)号：US20170350033A1
公开(公告)日：2017-12-07
申请号：US15612863
申请日：2017-06-02
申请人： EBARA CORPORATION
发明人： Jumpei FUJIKATA
IPC分类号： C25D21/12 , C25D17/00 , C25D17/06 , H01L21/67 , C25D7/12 , H01L21/687 , H01L21/288 , H01L23/00 , H01L21/768
CPC分类号： C25D21/12 , C25D7/12 , C25D17/001 , C25D17/004 , C25D17/06 , H01L21/2885 , H01L21/67253 , H01L21/68785 , H01L21/76879 , H01L24/11 , H01L24/742 , H01L2224/11462 , H01L2224/117
摘要： Provided is a plating apparatus for plating a substrate by using a substrate holder including an elastic projection that seals a to-be-plated surface of the substrate, the plating apparatus comprising a measurement device configured to measure a deformed state of the elastic projection by measuring at least either one of a compression amount of the elastic projection and load applied to the elastic projection at a time when the substrate physically contacts the elastic projection of the substrate holder; and a controlling device configured to make a judgment on the basis of the measured deformed state as to whether sealing by the elastic projection is normal.
-
公开(公告)号：US20170159203A1
公开(公告)日：2017-06-08
申请号：US15437157
申请日：2017-02-20
申请人： EBARA CORPORATION
发明人： Yoshio MINAMI , Jumpei FUJIKATA , Takashi KISHI
CPC分类号： C25D17/06 , C25D17/001 , C25D17/004 , C25D21/12
摘要： A plating method includes holding a substrate with a substrate holder while bringing a sealing member into pressure contact with a peripheral portion of the substrate to form an enclosed internal space in the substrate holder; performing a first-stage leakage test of the substrate holder by producing a vacuum in the internal space and checking whether pressure in the internal space reaches a predetermined vacuum pressure within a certain period of time; and if the substrate holder has passed the first-stage leakage test, performing a second-stage leakage test of the substrate holder by closing off the internal space after producing the vacuum therein and checking whether a change in the pressure in the internal space reaches a predetermined value within a certain period of time.
-
公开(公告)号：US20160369422A1
公开(公告)日：2016-12-22
申请号：US15182469
申请日：2016-06-14
申请人： EBARA CORPORATION
发明人： Jumpei FUJIKATA , Masashi SHIMOYAMA , Yuji ARAKI , Mizuki NAGAI
CPC分类号： C25D21/12 , C25D5/00 , C25D7/12 , C25D17/001 , C25D17/007 , C25D17/008 , C25D17/06 , C25D17/12
摘要： There is provided a method of adjusting a plating apparatus and a measuring apparatus that can obtain position adjustment amounts/a position adjustment amount of a substrate holder, an anode holder, a regulation plate, and/or a paddle without carrying out plating treatment. There is provided the method of adjusting the plating apparatus that has a plating bath configured to be able to hold the substrate holder, the anode holder, and an electric field adjusting plate. The method of adjusting the plating apparatus has the steps of: installing a first jig at a position in the plating bath where the substrate holder is installed; installing a second jig at a position in the plating bath where the anode holder or the electric field adjusting plate is installed; measuring a positional relation between the first jig and the second jig installed in the plating bath using a sensor included in either of the first jig and the second jig; and adjusting an installation position of the substrate holder, the anode holder, or the electric field adjusting plate based on the measured positional relation.
摘要翻译： 提供了一种调整电镀装置和测量装置的方法，该电镀装置和测量装置可以在不进行电镀处理的情况下获得基板支架，阳极支架，调节板和/或板的位置调整量/位置调整量。 提供了一种调整电镀设备的方法，该电镀设备具有能够保持衬底保持器，阳极保持器和电场调节板的电镀槽。 调整电镀装置的方法具有以下步骤：将第一夹具安装在安装有基板保持架的电镀槽中的位置处; 在安装有阳极保持器或电场调节板的电镀槽中的位置安装第二夹具; 使用包括在所述第一夹具和所述第二夹具中的任一个中的传感器测量所述第一夹具和安装在所述镀浴中的所述第二夹具之间的位置关系; 并且基于所测量的位置关系来调整衬底保持器，阳极保持器或电场调节板的安装位置。
-
公开(公告)号：US20190249325A1
公开(公告)日：2019-08-15
申请号：US16391638
申请日：2019-04-23
申请人： EBARA CORPORATION
发明人： Yoshio MINAMI , Jumpei FUJIKATA , Takashi KISHI
CPC分类号： C25D17/06 , C25D17/001 , C25D17/004 , C25D21/12 , G01M3/26
摘要： A plating method includes holding a substrate with a substrate holder while bringing a sealing member into pressure contact with a peripheral portion of the substrate to form an enclosed internal space in the substrate holder; performing a first-stage leakage test of the substrate holder by producing a vacuum in the internal space and checking whether pressure in the internal space reaches a predetermined vacuum pressure within a certain period of time; and if the substrate holder has passed the first-stage leakage test, performing a second-stage leakage test of the substrate holder by closing off the internal space after producing the vacuum therein and checking whether a change in the pressure in the internal space reaches a predetermined value within a certain period of time.
-
公开(公告)号：US20190186039A1
公开(公告)日：2019-06-20
申请号：US16283611
申请日：2019-02-22
申请人： EBARA CORPORATION
发明人： Jumpei FUJIKATA
IPC分类号： C25D21/12 , H01L21/67 , H01L21/288 , C25D17/00 , C25D17/06 , H01L21/687 , C25D7/12
摘要： Provided is a plating apparatus for plating a substrate by using a substrate holder including an elastic projection that seals a to-be-plated surface of the substrate, the plating apparatus comprising a measurement device configured to measure a deformed state of the elastic projection by measuring at least either one of a compression amount of the elastic projection and load applied to the elastic projection at a time when the substrate physically contacts the elastic projection of the substrate holder; and a controlling device configured to make a judgment on the basis of the measured deformed state as to whether sealing by the elastic projection is normal.
-
公开(公告)号：US20180230620A1
公开(公告)日：2018-08-16
申请号：US15891917
申请日：2018-02-08
申请人： EBARA CORPORATION,
发明人： Jumpei FUJIKATA
IPC分类号： C25D17/00 , C25D17/06 , H01L21/3205 , C25D17/12
CPC分类号： C25D17/001 , C25D17/005 , C25D17/06 , C25D17/12 , H01L21/32051
摘要： A substrate holder includes: a first holding member having a surface configured to come into contact with the substrate; and a second holding member, between which and the first holding member the substrate is put and held. The second holding member includes a removal portion that is disposed along an outer circumference of the substrate and configured to come into contact with the substrate and remove an insulating material on the substrate when the substrate is put between the first holding member and the second holding member, and an electric contact portion that is disposed along the outer circumference of the substrate and configured to come into contact with a region on the substrate in which the removal portion has removed the insulating material when the substrate is put and held between the first holding member and the second holding member.
-
10.发明申请公开(公告)号：US20170226656A1
公开(公告)日：2017-08-10
申请号：US15426631
申请日：2017-02-07
申请人： EBARA CORPORATION
摘要： An improved apparatus for adding powder comprising at least a metal, such as copper, to a plating solution, and supplying the plating solution to a plating tank is disclosed. The apparatus includes a hopper having an inlet which is connectable to a powder conduit of a powder container holding the powder therein, a feeder which communicates with a bottom opening of the hopper, a motor coupled to the feeder, and a plating-solution tank coupled to an outlet of the feeder and configured to dissolve the powder in the plating solution.
-
-
-
-
-
-
-
-
-
搜索结果
38 条记录 (耗时 0.017 秒)
