公开(公告)号：US20170226656A1

公开(公告)日：2017-08-10

申请号：US15426631

申请日：2017-02-07

Applicant: EBARA CORPORATION

Inventor： Chunhui DOU ,  Yoshitaka MUKAIYAMA ,  Yuji ARAKI ,  Masashi SHIMOYAMA ,  Jumpei FUJIKATA

IPC: C25D21/14 ,  C25D3/38 ,  C25D17/00 ,  C25D17/02 ,  C25D21/18

CPC classification number: C25D21/14 ,  C25D3/38 ,  C25D17/00 ,  C25D17/001 ,  C25D17/02 ,  C25D21/10 ,  C25D21/18

Abstract: An improved apparatus for adding powder comprising at least a metal, such as copper, to a plating solution, and supplying the plating solution to a plating tank is disclosed. The apparatus includes a hopper having an inlet which is connectable to a powder conduit of a powder container holding the powder therein, a feeder which communicates with a bottom opening of the hopper, a motor coupled to the feeder, and a plating-solution tank coupled to an outlet of the feeder and configured to dissolve the powder in the plating solution.