公开(公告)号：US20190249325A1

公开(公告)日：2019-08-15

申请号：US16391638

申请日：2019-04-23

申请人： EBARA CORPORATION

发明人： Yoshio MINAMI ,  Jumpei FUJIKATA ,  Takashi KISHI

IPC分类号： C25D17/06 ,  C25D21/12 ,  C25D17/00 ,  G01M3/26

CPC分类号： C25D17/06 ,  C25D17/001 ,  C25D17/004 ,  C25D21/12 ,  G01M3/26

摘要： A plating method includes holding a substrate with a substrate holder while bringing a sealing member into pressure contact with a peripheral portion of the substrate to form an enclosed internal space in the substrate holder; performing a first-stage leakage test of the substrate holder by producing a vacuum in the internal space and checking whether pressure in the internal space reaches a predetermined vacuum pressure within a certain period of time; and if the substrate holder has passed the first-stage leakage test, performing a second-stage leakage test of the substrate holder by closing off the internal space after producing the vacuum therein and checking whether a change in the pressure in the internal space reaches a predetermined value within a certain period of time.

公开(公告)号：US20160222540A1

公开(公告)日：2016-08-04

申请号：US15096972

申请日：2016-04-12

申请人： EBARA CORPORATION

发明人： Yoshio MINAMI ,  Jumpei FUJIKATA ,  Takashi KISHI

IPC分类号： C25D17/06

CPC分类号： C25D17/06 ,  C25D17/001 ,  C25D17/004 ,  C25D21/12

摘要： A plating method includes holding a substrate with a substrate holder while bringing a sealing member into pressure contact with a peripheral portion of the substrate to form an enclosed internal space in the substrate holder; performing a first-stage leakage test of the substrate holder by producing a vacuum in the internal space and checking whether pressure in the internal space reaches a predetermined vacuum pressure within a certain period of time; and if the substrate holder has passed the first-stage leakage test, performing a second-stage leakage test of the substrate holder by closing off the internal space after producing the vacuum therein and checking whether a change in the pressure in the internal space reaches a predetermined value within a certain period of time.

公开(公告)号：US20180105946A1

公开(公告)日：2018-04-19

申请号：US15728175

申请日：2017-10-09

申请人： EBARA CORPORATION

发明人： Masashi SHIMOYAMA ,  Jumpei FUJIKATA ,  Fumitoshi NISHIURA ,  Takashi KISHI

IPC分类号： C25D3/28 ,  C25D17/02 ,  C25D17/10 ,  C25D21/12 ,  C01G3/02

CPC分类号： C25D3/28 ,  C01G3/02 ,  C01P2004/61 ,  C01P2006/80 ,  C25D3/38 ,  C25D7/123 ,  C25D17/001 ,  C25D17/02 ,  C25D17/10 ,  C25D21/12 ,  C25D21/14 ,  C25D21/18

摘要： Soluble copper oxide powder capable of preventing a decrease in quality of a copper film formed by plating is disclosed. The copper oxide powder contains copper and impurities including sodium. A concentration of the sodium is not more than 20 ppm. The copper oxide powder is regularly supplied into a plating solution. A voltage is applied between an insoluble anode and a substrate immersed in the plating solution, thereby plating the substrate.

公开(公告)号：US20170159203A1

公开(公告)日：2017-06-08

申请号：US15437157

申请日：2017-02-20

申请人： EBARA CORPORATION

发明人： Yoshio MINAMI ,  Jumpei FUJIKATA ,  Takashi KISHI

IPC分类号： C25D17/06 ,  C25D17/00

CPC分类号： C25D17/06 ,  C25D17/001 ,  C25D17/004 ,  C25D21/12

摘要： A plating method includes holding a substrate with a substrate holder while bringing a sealing member into pressure contact with a peripheral portion of the substrate to form an enclosed internal space in the substrate holder; performing a first-stage leakage test of the substrate holder by producing a vacuum in the internal space and checking whether pressure in the internal space reaches a predetermined vacuum pressure within a certain period of time; and if the substrate holder has passed the first-stage leakage test, performing a second-stage leakage test of the substrate holder by closing off the internal space after producing the vacuum therein and checking whether a change in the pressure in the internal space reaches a predetermined value within a certain period of time.

公开(公告)号：US20230201991A1

公开(公告)日：2023-06-29

申请号：US18086200

申请日：2022-12-21

申请人： EBARA CORPORATION

发明人： Masaki KINOSHITA ,  Takashi KISHI ,  Toshiki MIYAKAWA

IPC分类号： B24B37/04

CPC分类号： B24B37/042

摘要： A polishing apparatus capable of preventing condensation on an inner surface of a transparent window provided in a polishing pad and capable of achieving accurate measuring of a film thickness is disclosed. The polishing apparatus includes: a polishing pad having a polishing surface; a polishing head configured to press a workpiece against the polishing surface; a transparent window disposed in the polishing pad; a polishing table configured to support the polishing pad; an optical sensor head located below the transparent window and configured to direct light to the workpiece through the transparent window and receive reflected light from the workpiece through the transparent window; and a cooling device configured to cool a space between the transparent window and the optical sensor head.

公开(公告)号：US20210040641A1

公开(公告)日：2021-02-11

申请号：US16081687

申请日：2017-03-02

申请人： EBARA CORPORATION

发明人： Mizuki NAGAI ,  Masashi SHIMOYAMA ,  Takashi KISHI ,  Fumitoshi NISHIURA

IPC分类号： C25D17/06 ,  C25D7/12 ,  C25D5/34 ,  C25D17/00

摘要： Provided is a plating apparatus for plating a substrate, which prevents deterioration of uniformity of plating film thickness caused by an oxide film created at an edge section of the substrate and/or an organic substance attached to the edge section of the substrate. The plating apparatus includes a plating bath for applying a voltage to the substrate set in a substrate holder to plate the substrate; and an edge section washing device that locally removes at least either of the organic substance and the oxide film present at the edge section of the substrate before the substrate is set in the substrate holder.

公开(公告)号：US20130255360A1

公开(公告)日：2013-10-03

申请号：US13849178

申请日：2013-03-22

申请人： EBARA CORPORATION

发明人： Yoshio MINAMI ,  Jumpei FUJIKATA ,  Takashi KISHI

IPC分类号： C25D17/00

CPC分类号： C25D17/06 ,  C25D17/001 ,  C25D17/004 ,  C25D21/12

摘要： A plating method includes holding a substrate with a substrate holder while bringing a sealing member into pressure contact with a peripheral portion of the substrate to form an enclosed internal space in the substrate holder; performing a first-stage leakage test of the substrate holder by producing a vacuum in the internal space and checking whether pressure in the internal space reaches a predetermined vacuum pressure within a certain period of time; and if the substrate holder has passed the first-stage leakage test, performing a second-stage leakage test of the substrate holder by closing off the internal space after producing the vacuum therein and checking whether a change in the pressure in the internal space reaches a predetermined value within a certain period of time.

摘要翻译： 一种电镀方法，包括：在使基板保持器的基板与基板的周边部分压力接触的同时保持基板，同时在所述基板支架内形成封闭的内部空间; 通过在内部空间中产生真空并检查内部空间中的压力是否在一定时间内达到预定的真空压力来进行基板保持器的第一级泄漏测试; 并且如果衬底保持器已经通过了第一级泄漏测试，则通过在其中产生真空之后关闭内部空间来进行衬底保持器的第二级泄漏测试，并且检查内部空间中的压力变化是否达到 一定时间内的预定值。

公开(公告)号：US20180209062A1

公开(公告)日：2018-07-26

申请号：US15878267

申请日：2018-01-23

申请人： EBARA CORPORATION

发明人： Mizuki NAGAI ,  Kazuhito TSUJI ,  Takashi KISHI ,  Toshiki MIYAKAWA ,  Masashi SHIMOYAMA ,  Jumpei FUJIKATA

IPC分类号： C25D17/08 ,  C25D17/00 ,  C25D21/12 ,  H01L21/687

摘要： A resistance measuring module for measuring electric resistance of a substrate holder is provided. The substrate holder has an electric contact configured to feed a current to a held substrate and contactable with the substrate. The substrate holder is able to hold a testing substrate for measurement of electric resistance of the substrate holder, and is configured such that the electric contact comes into contact with the testing substrate in a state where the testing substrate is held. The resistance measuring module includes: a test probe contactable with the testing substrate held in the substrate holder; and a resistance measuring instrument for measurement of a resistance value between the electric contact and the probe via the testing substrate.