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公开(公告)号:US20220186098A1
公开(公告)日:2022-06-16
申请号:US17436515
申请日:2020-03-04
Applicant: Dow Global Technologies LLC , Rohm and Haas Company
Inventor: Tuoqi Li , Joseph J. Zupancic , Matthew M. Yonkey , Paul G. Clark , Thorsten Schmidt , Ken Kawamoto , Wenwen Li
IPC: C09J175/12 , B32B7/12 , B32B15/085 , B32B27/32 , B32B27/36 , B32B27/08 , B32B15/20
Abstract: The present disclosure provides a two-component solvent-based adhesive composition. The two-component solvent-based adhesive composition contains the reaction product of (A) an isocyanate component; (B) a polyol component containing a polyester-amide polycarbonate polyol; and (C) a solvent. The present disclosure also provides a method of forming the two-component solvent-based adhesive composition.
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公开(公告)号:US20220169901A1
公开(公告)日:2022-06-02
申请号:US17436434
申请日:2020-03-04
Applicant: Dow Global Technologies LLC , Rohm and Haas Company
Inventor: Tuoqi Li , Joseph J. Zupancic , Matthew M. Yonkey , Paul G. Clark , Thorsten Schmidt , Ken Kawamoto , Wenwen Li
IPC: C09J175/06 , C08G18/38 , C08G18/46 , C08G18/12 , B32B7/12 , B32B15/085 , B32B27/08 , B32B27/36 , B32B27/32
Abstract: The present disclosure provides a two-component solvent-less adhesive composition. The two-component solvent-less adhesive composition contains the reaction product of (A) an isocyanate component and (B) a polyol component containing a poly-ester-amide polycarbonate polyol. The present disclosure also provides a method of forming a two-component solvent-less adhesive composition.
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公开(公告)号:US12054652B2
公开(公告)日:2024-08-06
申请号:US17436434
申请日:2020-03-04
Applicant: Dow Global Technologies LLC , Rohm and Haas Company
Inventor: Tuoqi Li , Joseph J. Zupancic , Matthew M. Yonkey , Paul G. Clark , Thorsten Schmidt , Ken Kawamoto , Wenwen Li
IPC: C08G18/46 , B32B7/12 , B32B15/085 , B32B27/08 , B32B27/32 , B32B27/36 , C08G18/12 , C08G18/38 , C09J175/06 , C09J175/12
CPC classification number: C09J175/06 , B32B7/12 , B32B15/085 , B32B27/08 , B32B27/32 , B32B27/36 , C08G18/12 , C08G18/3885 , C08G18/4615
Abstract: The present disclosure provides a two-component solvent-less adhesive composition. The two-component solvent-less adhesive composition contains the reaction product of (A) an isocyanate component and (B) a polyol component containing a poly-ester-amide polycarbonate polyol. The present disclosure also provides a method of forming a two-component solvent-less adhesive composition.
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公开(公告)号:US11746267B2
公开(公告)日:2023-09-05
申请号:US17436515
申请日:2020-03-04
Applicant: Dow Global Technologies LLC , Rohm and Haas Company
Inventor: Tuoqi Li , Joseph J. Zupancic , Matthew M. Yonkey , Paul G. Clark , Thorsten Schmidt , Ken Kawamoto , Wenwen Li
IPC: C09J175/12 , B32B7/12 , B32B15/085 , B32B15/20 , B32B27/08 , B32B27/32 , B32B27/36
CPC classification number: C09J175/12 , B32B7/12 , B32B15/085 , B32B15/20 , B32B27/08 , B32B27/32 , B32B27/36
Abstract: The present disclosure provides a two-component solvent-based adhesive composition. The two-component solvent-based adhesive composition contains the reaction product of (A) an isocyanate component; (B) a polyol component containing a polyester-amide polycarbonate polyol; and (C) a solvent. The present disclosure also provides a method of forming the two-component solvent-based adhesive composition.
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公开(公告)号:US20230279165A1
公开(公告)日:2023-09-07
申请号:US18013224
申请日:2021-06-23
Applicant: Dow Global Technologies LLC , Dow Silicones Corporation
Inventor: Jordan C. Reddel , Mark F. Sonnenschein , David S. Laitar , Andrew B. Shah , Bethany M. Neilson , Colin LiPi Shan , David D. Devore , Jozef J. I. Van Dun , Philip D. Hustad , Zhanjie Li , Zachary S. Kean , Ken Kawamoto
IPC: C08F210/02
CPC classification number: C08F210/02 , C08F2420/02
Abstract: A process to form a crosslinked composition comprising thermally treating a composition at a temperature ≥ 25° C., in the presence of moisture, and wherein the composition comprises the following components: a) an olefin/silane interpolymer, b) a cure catalyst selected from the following: i) a metal alkoxide, ii) a metal carboxylate, iii) a metal sulfonate, iv) an aryl sulfonic acid, v) a tris-aryl borane, vi) any combination of two or more from i)-v). Also, a composition comprising the following components a and b, as described above. A process to form an olefin/alkoxysilane interpolymer, and the corresponding composition, said process comprising thermally treating a composition comprising the following components: a) an olefin/silane interpolymer, b) an alcohol, and c) a Lewis acid.
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公开(公告)号:US11332583B2
公开(公告)日:2022-05-17
申请号:US16976665
申请日:2019-02-22
Applicant: Dow Silicones Corporation , Dow Global Technologies LLC
Inventor: Steven Swier , Phillip Hustad , David Devore , Zachary Kean , Liam Spencer , Jordan Reddel , Bethany Neilson , John Bernard Horstman , Ken Kawamoto , Jerzy Klosin
IPC: C08G77/442
Abstract: A polyolefin-polydiorganosiloxane block copolymer may be prepared by hydrosilylation reaction.
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公开(公告)号:US20210002431A1
公开(公告)日:2021-01-07
申请号:US16976665
申请日:2019-02-22
Applicant: Dow Silicones Corporation , Dow Global Technologies LLC
Inventor: Steven Swier , Phillip Hustad , David Devore , Zachary Kean , Liam Spencer , Jordan Reddel , Bethany Neilson , John Bernard Horstman , Ken Kawamoto , Jerzy Klosin
IPC: C08G77/442
Abstract: A polyolefin-polydiorganosiloxane block copolymer may be prepared by hydrosilylation reaction.
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公开(公告)号:US12037462B2
公开(公告)日:2024-07-16
申请号:US16975736
申请日:2019-02-22
Applicant: Dow Silicones Corporation , Dow Global Technologies LLC
Inventor: Steven Swier , Phillip Hustad , David Devore , Zachary Kean , Liam Spencer , Jordan Reddel , Bethany Neilson , John Bernard Horstman , Ken Kawamoto
IPC: C08G77/442 , C08F8/00 , C08F8/22 , C08F8/42 , C08F110/02 , C08F210/16 , C08F299/08 , C08G77/08 , C08G77/12 , C08G77/20 , C08G77/38 , C08G77/42
CPC classification number: C08G77/442 , C08F8/22 , C08F110/02 , C08F210/16 , C08G77/08 , C08G77/12 , C08F2810/40
Abstract: A polyolefin-polydiorganosiloxane block copolymer may be prepared by Piers-Rubinsztajn reaction.
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公开(公告)号:US20210017195A1
公开(公告)日:2021-01-21
申请号:US16982490
申请日:2019-03-18
Applicant: Dow Global Technologies LLC , Dow Silicones Corporation
Inventor: Jordan Reddel , Robert David Grigg , Phillip Dene Hustad , Sukrit Mukhopadhyay , Steven Swier , Ken Kawamoto
Abstract: A process to functionalize organo-zinc compounds with halosilane electrophiles employs a basic additive. The process includes combining the organo-zinc compound, a halosilanes, and a nitrogen containing heterocycle as the basic additive. The presence of the basic additive facilitates successful substitution. Functionalized silanes and silyl-terminated polyolefins can be prepared using this process. The functionalized silanes may be useful as endblockers for polyorganosiloxanes having SiH and/or silicon bonded aliphatically unsaturated groups capable of undergoing hydrosilylation.
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