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    Positioning Guidance for Increasing Reliability of Near-Field Communications
    3.
    发明申请
    Positioning Guidance for Increasing Reliability of Near-Field Communications 有权
    提高近场通信可靠性的定位指导

    公开(公告)号：US20130084801A1

    公开(公告)日：2013-04-04

    申请号：US13250093

    申请日：2011-09-30

    Applicant: Philip Stewart ROYSTON ,  David COX

    Inventor： Philip Stewart ROYSTON ,  David COX

    IPC: H04B5/00

    CPC classification number: H04B5/0031 ,  G06K7/015 ,  G06K7/10118 ,  G06K7/10336 ,  G06K7/10356 ,  H04B5/0043

    Abstract: To promote ease of use, as well as a reduction in bit error rates during extended data exchange between a coupled NFC tag/reader pair, signal strength is measured from a plurality of NFC tag antennas each positioned differently with respect to a common reader field, and differences in signal strength are used to determine an optimum positioning of the tag, or tag emulator, with respect to the reader. Alternative embodiments may include signal time of flight for determining orientation of the NFC antennas within the reader field. Information is generated by the tag, or tag emulator, and output by the tag, or tag emulator, such that a user may direct the positioning of the tag, or tag emulator, for improved communication with the reader.

    Abstract translation: 为了促进易用性，以及在耦合的NFC标签/读取器对之间的扩展数据交换期间减少位错误率，从相对于公共读取器字段不同定位的多个NFC标签天线测量信号强度， 并且使用信号强度的差异来确定标签或标签仿真器相对于读取器的最佳定位。 替代实施例可以包括用于确定读取器领域内的NFC天线的定向的信号飞行时间。 信息由标签或标签仿真器生成，并由标签或标签仿真器输出，以便用户可以指示标签或标签仿真器的定位，以改善与读取器的通信。

    Microfluidic Device and Material Manipulating Method Using Same
    4.
    发明申请
    Microfluidic Device and Material Manipulating Method Using Same 有权
    微流体装置和材料操作方法使用相同

    公开(公告)号：US20080142455A1

    公开(公告)日：2008-06-19

    申请号：US12028887

    申请日：2008-02-11

    Applicant: David COX

    Inventor： David COX

    IPC: B01D24/28

    CPC classification number: B01L3/502738 ,  B01L3/502753 ,  B01L2300/0806 ,  B01L2400/0409 ,  B01L2400/0683 ,  Y10T436/11 ,  Y10T436/113332 ,  Y10T436/25 ,  Y10T436/25375 ,  Y10T436/255 ,  Y10T436/2575

    Abstract: Microfluidic devices for manipulating relatively dense materials, such as colloidal rod particles, are provided. Microfluidic devices for separating a denser first material from a less-dense second material are provided. Methods of manipulating a relatively dense first material, for example, colloidal rod particles, and separating the first material from a less-dense second material, are provided. Methods of marking samples or sample components with relatively dense materials, are also provided.

    Abstract translation: 提供用于操作相对致密材料的微流体装置，例如胶体棒颗粒。 提供用于从较不密集的第二材料分离更致密的第一材料的微流体装置。 提供了操作相对致密的第一材料（例如胶体棒粒子）以及将第一材料与较不密集的第二材料分离的方法。 还提供了用相对致密的材料标记样品或样品组分的方法。

    MACHINING OF MICROSTRUCTURES
    5.
    发明申请
    MACHINING OF MICROSTRUCTURES 审中-公开
    加工微结构

    公开(公告)号：US20080067440A1

    公开(公告)日：2008-03-20

    申请号：US11748609

    申请日：2007-05-15

    Applicant: David COX

    Inventor： David COX

    IPC: H01J37/08

    CPC classification number: G01R33/0354 ,  H01J37/3056 ,  H01L35/34

    Abstract: There are disclosed methods for machining components, such as thermocouples 280 or SQUIDs 330, using ion beam milling. Ion beam milling is performed on a material 200 to expose a sliver 240. A sharp probe 161 is then attached to the sliver 240, for example by deposition of a tungsten weld 250. Further ion beam milling 261, 262, 263 is then performed to separate the sliver 240 from the material 200. The sliver 240 is then ion beam milled to produce the device 280, 330. In some embodiments, the thermocouple 280 is mounted to a substrate such as a silicon wafer having integrated signal conditioning circuitry. The invention allows small components (of the order of 1 μm) to be accurately manufactured without being constrained by typical lithographic constraints.

    Abstract translation: 公开了使用离子束铣削加工诸如热电偶280或SQUID 330的部件的方法。 在材料200上进行离子束研磨以暴露纱条240。 然后，例如通过沉积钨焊接件250将尖锐的探针161附接到条子240。 然后执行另外的离子束铣削261,262,263以将纱条240与材料200分离。 然后将条子240离子束研磨以产生装置280,330。 在一些实施例中，热电偶280安装到诸如具有集成信号调节电路的硅晶片的衬底。 本发明允许在不受典型光刻约束的约束的情况下精确地制造小成分（大约1um的数量级）。

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