ELECTRONIC DEVICE AND METHOD TO PRODUCE ELECTRONIC DEVICE

    公开(公告)号:US20240389244A1

    公开(公告)日:2024-11-21

    申请号:US18393747

    申请日:2023-12-22

    Abstract: An electronic device includes a substrate and a plastic layer. The substrate has a first surface and a second surface opposite to each other; at least one of the first surface and the second surface is provided with an electronic assembly and a conducting wire; the conducting wire is electrically connected to the electronic assembly; the substrate further has a plurality of perforated holes; and the perforated holes extend to the second surface from the first surface. The plastic layer covers the first surface and the second surface, and fills in the perforated holes. Therefore, the electronic assemblies and the conducting wires can be arranged on both surfaces of the substrate, and the electronic assemblies on the first surface and the second surface both are protected by the plastic layer. In addition, also provided is a method to produce the electronic device.

    THREE-DIMENSIONAL TOUCH DEVICE AND MANUFACTURING METHOD THEREOF

    公开(公告)号:US20240336135A1

    公开(公告)日:2024-10-10

    申请号:US18379175

    申请日:2023-10-12

    Abstract: A three-dimensional touch device includes a flexible circuit board structure and an in-mold formed film. The flexible circuit board structure includes a flexible circuit substrate and touch electrodes disposed on the outer surface of the flexible circuit substrate. The flexible circuit substrate includes folded lines. At least two of the folded lines are not parallel to each other. A contour of the flexible circuit structure is formed by bending the flexible circuit substrate and is suitable for having a main body portion and bending portions. The bending portions are connected to the main body portion through the folded lines. The in-mold formed film encapsulates the inner surface, the outer surface and the touch electrodes. The in-mold formed film includes an exterior film layer covering the outer surface and the touch electrodes. The contour of the flexible circuit structure approaches to a part of contour of the exterior film layer.

    ELECTRONIC DEVICE
    4.
    发明公开
    ELECTRONIC DEVICE 审中-公开

    公开(公告)号:US20240341036A1

    公开(公告)日:2024-10-10

    申请号:US18372062

    申请日:2023-09-23

    Abstract: An electronic device includes a substrate, conductive circuit lines, an anisotropic conductive block, and a plastic layer. The substrate has an arrangement surface having a mounting area and a coverage area, and the coverage area surrounds the mounting area. The conductive circuit lines are arranged in the coverage area. Each of the conductive circuit lines partially passes through the mounting area. The anisotropic conductive block includes an anisotropic conductive layer. The anisotropic conductive layer has a first conductive surface, a second conductive surface, and a side surface. The first conductive surface is opposite to the second conductive surface. The side surface is connected between the first conductive surface and the second conductive surface and surrounds the first conductive surface and the second conductive surface. The anisotropic conductive block covers the mounting area through the first conductive surface. The plastic layer surrounds the side surface and covers the coverage area.

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