A three-dimensional touch device includes a flexible circuit board structure and an in-mold formed film. The flexible circuit board structure includes a flexible circuit substrate and touch electrodes disposed on the outer surface of the flexible circuit substrate. The flexible circuit substrate includes folded lines. At least two of the folded lines are not parallel to each other. A contour of the flexible circuit structure is formed by bending the flexible circuit substrate and is suitable for having a main body portion and bending portions. The bending portions are connected to the main body portion through the folded lines. The in-mold formed film encapsulates the inner surface, the outer surface and the touch electrodes. The in-mold formed film includes an exterior film layer covering the outer surface and the touch electrodes. The contour of the flexible circuit structure approaches to a part of contour of the exterior film layer.