公开(公告)号：US08853560B2

公开(公告)日：2014-10-07

申请号：US13411005

申请日：2012-03-02

申请人： Dae-Hyun Park ,  Han Kim ,  Mi-Ja Han ,  Ja-Bu Koo

发明人： Dae-Hyun Park ,  Han Kim ,  Mi-Ja Han ,  Ja-Bu Koo

IPC分类号： H05K1/11 ,  H05K1/02

CPC分类号： H05K1/0236 ,  H05K1/0219 ,  H05K1/0222 ,  H05K1/115 ,  H05K2201/09309 ,  H05K2201/09536 ,  H05K2201/09618 ,  H05K2201/09718 ,  H05K2201/09781 ,  Y10T29/4913 ,  Y10T29/49165 ,  Y10T428/12465

摘要： An electromagnetic bandgap structure and a printed circuit board that solve a mixed signal problem are disclosed. In accordance with embodiments of the present invention, the electromagnetic bandgap structure includes a first metal layer; a first dielectric layer, stacked in the first metal layer; a second metal layer, stacked in the first dielectric layer, and having a holed formed at a position of the second dielectric layer; a second dielectric layer, stacked in the second metal layer; a metal plate, stacked in the second dielectric layer; a first via, penetrating the hole formed in the second metal layer and connecting the first metal layer and the metal plate; a third dielectric layer, stacked in the metal plate and the second dielectric layer; a third metal layer, stacked in the third dielectric layer; and a second via, connecting the second metal layer to the third metal layer.

摘要翻译： 公开了一种解决混合信号问题的电磁带隙结构和印刷电路板。 根据本发明的实施例，电磁带隙结构包括第一金属层; 第一介电层，堆叠在第一金属层中; 第二金属层，堆叠在第一介电层中，并且具有形成在第二介电层的位置的孔; 第二介电层，堆叠在第二金属层中; 金属板，堆叠在第二介电层中; 穿过形成在第二金属层中的孔并连接第一金属层和金属板的第一通孔; 第三电介质层，堆叠在所述金属板和所述第二介电层中; 第三金属层，堆叠在第三介电层中; 以及将第二金属层连接到第三金属层的第二通孔。

公开(公告)号：US20120162934A1

公开(公告)日：2012-06-28

申请号：US13411005

申请日：2012-03-02

申请人： Dae-Hyun Park ,  Han Kim ,  Mi-Ja Han ,  Ja-Bu Koo

发明人： Dae-Hyun Park ,  Han Kim ,  Mi-Ja Han ,  Ja-Bu Koo

IPC分类号： H05K7/00

CPC分类号： H05K1/0236 ,  H05K1/0219 ,  H05K1/0222 ,  H05K1/115 ,  H05K2201/09309 ,  H05K2201/09536 ,  H05K2201/09618 ,  H05K2201/09718 ,  H05K2201/09781 ,  Y10T29/4913 ,  Y10T29/49165 ,  Y10T428/12465

摘要： An electromagnetic bandgap structure and a printed circuit board that solve a mixed signal problem are disclosed. In accordance with embodiments of the present invention, the electromagnetic bandgap structure includes a first metal layer; a first dielectric layer, stacked in the first metal layer; a second metal layer, stacked in the first dielectric layer, and having a holed formed at a position of the second dielectric layer; a second dielectric layer, stacked in the second metal layer; a metal plate, stacked in the second dielectric layer; a first via, penetrating the hole formed in the second metal layer and connecting the first metal layer and the metal plate; a third dielectric layer, stacked in the metal plate and the second dielectric layer; a third metal layer, stacked in the third dielectric layer; and a second via, connecting the second metal layer to the third metal layer.

摘要翻译： 公开了一种解决混合信号问题的电磁带隙结构和印刷电路板。 根据本发明的实施例，电磁带隙结构包括第一金属层; 第一介电层，堆叠在第一金属层中; 第二金属层，堆叠在第一介电层中，并且具有形成在第二介电层的位置的孔; 第二介电层，堆叠在第二金属层中; 金属板，堆叠在第二介电层中; 穿过形成在第二金属层中的孔并连接第一金属层和金属板的第一通孔; 第三电介质层，堆叠在所述金属板和所述第二介电层中; 第三金属层，堆叠在第三介电层中; 以及将第二金属层连接到第三金属层的第二通孔。

公开(公告)号：US08153907B2

公开(公告)日：2012-04-10

申请号：US12010437

申请日：2008-01-24

申请人： Dae-Hyun Park ,  Han Kim ,  Mi-Ja Han ,  Ja-Bu Koo

发明人： Dae-Hyun Park ,  Han Kim ,  Mi-Ja Han ,  Ja-Bu Koo

IPC分类号： H05K1/11

CPC分类号： H05K1/0236 ,  H05K1/0219 ,  H05K1/0222 ,  H05K1/115 ,  H05K2201/09309 ,  H05K2201/09536 ,  H05K2201/09618 ,  H05K2201/09718 ,  H05K2201/09781 ,  Y10T29/4913 ,  Y10T29/49165 ,  Y10T428/12465

摘要： An electromagnetic bandgap structure and a printed circuit board that solve a mixed signal problem are disclosed. In accordance with embodiments of the present invention, the electromagnetic bandgap structure includes a first metal layer; a first dielectric layer, stacked in the first metal layer; a second metal layer, stacked in the first dielectric layer, and having a holed formed at a position of the second dielectric layer; a second dielectric layer, stacked in the second metal layer; a metal plate, stacked in the second dielectric layer; a first via, penetrating the hole formed in the second metal layer and connecting the first metal layer and the metal plate; a third dielectric layer, stacked in the metal plate and the second dielectric layer; a third metal layer, stacked in the third dielectric layer; and a second via, connecting the second metal layer to the third metal layer.

摘要翻译： 公开了一种解决混合信号问题的电磁带隙结构和印刷电路板。 根据本发明的实施例，电磁带隙结构包括第一金属层; 第一介电层，堆叠在第一金属层中; 第二金属层，堆叠在第一介电层中，并且具有形成在第二介电层的位置的孔; 第二介电层，堆叠在第二金属层中; 金属板，堆叠在第二介电层中; 穿过形成在第二金属层中的孔并连接第一金属层和金属板的第一通孔; 第三电介质层，堆叠在所述金属板和所述第二介电层中; 第三金属层，堆叠在第三介电层中; 以及将第二金属层连接到第三金属层的第二通孔。

公开(公告)号：US20080264685A1

公开(公告)日：2008-10-30

申请号：US12010437

申请日：2008-01-24

申请人： Dae-Hyun Park ,  Han Kim ,  Mi-Ja Han ,  Ja-Bu Koo

发明人： Dae-Hyun Park ,  Han Kim ,  Mi-Ja Han ,  Ja-Bu Koo

IPC分类号： H05K1/11 ,  H01F1/00

CPC分类号： H05K1/0236 ,  H05K1/0219 ,  H05K1/0222 ,  H05K1/115 ,  H05K2201/09309 ,  H05K2201/09536 ,  H05K2201/09618 ,  H05K2201/09718 ,  H05K2201/09781 ,  Y10T29/4913 ,  Y10T29/49165 ,  Y10T428/12465

摘要： An electromagnetic bandgap structure and a printed circuit board that solve a mixed signal problem are disclosed. In accordance with embodiments of the present invention, the electromagnetic bandgap structure includes a first metal layer; a first dielectric layer, stacked in the first metal layer; a second metal layer, stacked in the first dielectric layer, and having a holed formed at a position of the second dielectric layer; a second dielectric layer, stacked in the second metal layer; a metal plate, stacked in the second dielectric layer; a first via, penetrating the hole formed in the second metal layer and connecting the first metal layer and the metal plate; a third dielectric layer, stacked in the metal plate and the second dielectric layer; a third metal layer, stacked in the third dielectric layer; and a second via, connecting the second metal layer to the third metal layer.

摘要翻译： 公开了一种解决混合信号问题的电磁带隙结构和印刷电路板。 根据本发明的实施例，电磁带隙结构包括第一金属层; 第一介电层，堆叠在第一金属层中; 第二金属层，堆叠在第一介电层中，并且具有形成在第二介电层的位置的孔; 第二介电层，堆叠在第二金属层中; 金属板，堆叠在第二介电层中; 穿过形成在第二金属层中的孔并连接第一金属层和金属板的第一通孔; 第三电介质层，堆叠在所述金属板和所述第二介电层中; 第三金属层，堆叠在第三介电层中; 以及将第二金属层连接到第三金属层的第二通孔。

公开(公告)号：US08289099B2

公开(公告)日：2012-10-16

申请号：US12568362

申请日：2009-09-28

申请人： Han Kim ,  Ja-Bu Koo ,  Dae-Hyun Park

发明人： Han Kim ,  Ja-Bu Koo ,  Dae-Hyun Park

IPC分类号： H03H7/00

CPC分类号： H01P1/2005 ,  H01P1/203 ,  H05K1/0236 ,  H05K2201/09309 ,  H05K2201/09627 ,  H05K2201/09681

摘要： An electromagnetic bandgap structure includes: first conductive plates, placed on a first planar surface, in which the first conductive plates are lined up in a first direction; second conductive plates, placed on a second planar surface and arranged at an area corresponding to an area in which the first conductive plates are disposed, in which the second conductive plates are lined up in the first direction; a first stitching via, electrically connecting any two adjacent conductive portions with each other and in which the two adjacent conductive portions are lined up in a direction that is different from the first direction on the first planar surface; and a second stitching via, electrically connecting any two adjacent conductive portions with each other and in which the two adjacent conductive portions are lined up in a direction that is different from the first direction on the second planar surface.

摘要翻译： 电磁带隙结构包括：第一导电板，放置在第一平面上，第一导电板沿第一方向排列; 第二导电板，放置在第二平坦表面上并且布置在与设置有第一导电板的区域相对应的区域中，其中第二导电板沿第一方向排列; 第一缝合通孔，将任何两个相邻的导电部分彼此电连接，并且其中两个相邻的导电部分沿与第一平坦表面上的第一方向不同的方向排列; 以及第二缝合通孔，将任何两个相邻的导电部彼此电连接，并且其中两个相邻的导电部分在与第二平面上的第一方向不同的方向上排列。

公开(公告)号：US08081052B2

公开(公告)日：2011-12-20

申请号：US12270403

申请日：2008-11-13

申请人： Han Kim ,  Ja-Bu Koo ,  Dae-Hyun Park

发明人： Han Kim ,  Ja-Bu Koo ,  Dae-Hyun Park

IPC分类号： H01P3/08

CPC分类号： H01P1/20345 ,  H01P1/2005 ,  H05K1/0236 ,  H05K3/429 ,  H05K2201/09309 ,  H05K2201/09518 ,  H05K2201/09627 ,  H05K2201/09681

摘要： An electromagnetic bandgap structure and a printed circuit board having the same are disclosed. In accordance with an embodiment of the present invention, the electromagnetic bandgap structure can include a plurality of conductive layers, placed between two conductive layers; and a stitching via, configured to make an electrical connection between any two conductive layers of the conductive layers. Here, the stitching via can include a first via, one end part of the first via configured to any one of the two conductive plates; a second via, one end part of the second via configured to the other of the two conductive plates; and a connection pattern, placed on a planar surface that is different from the conductive plates, between the two conductive layers and configured to make an electrical connection between the other end part of the first via and the other end part of the second via. Any one of the first via and the second via can be formed to penetrate a same planar surface as at least one of the two conductive layers.

摘要翻译： 公开了一种电磁带隙结构及其印刷电路板。 根据本发明的实施例，电磁带隙结构可以包括放置在两个导电层之间的多个导电层; 以及缝合通孔，其经配置以在所述导电层的任何两个导电层之间形成电连接。 这里，缝合通孔可以包括第一通孔，第一通孔的一个端部构造成两个导电板中的任何一个; 第二通孔，所述第二通孔的一端部被配置为所述两个导电板中的另一个; 以及在两个导电层之间放置在与导电板不同的平面上的连接图案，并且被配置为在第一通孔的另一端部和第二通孔的另一端部之间形成电连接。 可以形成第一通孔和第二通孔中的任何一个以穿透与两个导电层中的至少一个相同的平面表面。

公开(公告)号：US20100134213A1

公开(公告)日：2010-06-03

申请号：US12568362

申请日：2009-09-28

申请人： Han KIM ,  Ja-Bu Koo ,  Dae-Hyun Park

发明人： Han KIM ,  Ja-Bu Koo ,  Dae-Hyun Park

IPC分类号： H01P1/20

CPC分类号： H01P1/2005 ,  H01P1/203 ,  H05K1/0236 ,  H05K2201/09309 ,  H05K2201/09627 ,  H05K2201/09681

摘要： An electromagnetic bandgap structure includes: first conductive plates, placed on a first planar surface, in which the first conductive plates are lined up in a first direction; second conductive plates, placed on a second planar surface and arranged at an area corresponding to an area in which the first conductive plates are disposed, in which the second conductive plates are lined up in the first direction; a first stitching via, electrically connecting any two adjacent conductive portions with each other and in which the two adjacent conductive portions are lined up in a direction that is different from the first direction on the first planar surface; and a second stitching via, electrically connecting any two adjacent conductive portions with each other and in which the two adjacent conductive portions are lined up in a direction that is different from the first direction on the second planar surface.

摘要翻译： 电磁带隙结构包括：第一导电板，放置在第一平面上，第一导电板沿第一方向排列; 第二导电板，放置在第二平坦表面上并且布置在与设置有第一导电板的区域相对应的区域中，其中第二导电板沿第一方向排列; 第一缝合通孔，将任何两个相邻的导电部分彼此电连接，并且其中两个相邻的导电部分沿与第一平坦表面上的第一方向不同的方向排列; 以及第二缝合通孔，将任何两个相邻的导电部彼此电连接，并且其中两个相邻的导电部分在与第二平面上的第一方向不同的方向上排列。

公开(公告)号：US20090322450A1

公开(公告)日：2009-12-31

申请号：US12270403

申请日：2008-11-13

申请人： Han Kim ,  Ja-Bu Koo ,  Dae-Hyun Park

发明人： Han Kim ,  Ja-Bu Koo ,  Dae-Hyun Park

IPC分类号： H01P1/203 ,  H01P3/08

CPC分类号： H01P1/20345 ,  H01P1/2005 ,  H05K1/0236 ,  H05K3/429 ,  H05K2201/09309 ,  H05K2201/09518 ,  H05K2201/09627 ,  H05K2201/09681

摘要： An electromagnetic bandgap structure and a printed circuit board having the same are disclosed. In accordance with an embodiment of the present invention, the electromagnetic bandgap structure can include a plurality of conductive layers, placed between two conductive layers; and a stitching via, configured to make an electrical connection between any two conductive layers of the conductive layers. Here, the stitching via can include a first via, one end part of the first via configured to any one of the two conductive plates; a second via, one end part of the second via configured to the other of the two conductive plates; and a connection pattern, placed on a planar surface that is different from the conductive plates, between the two conductive layers and configured to make an electrical connection between the other end part of the first via and the other end part of the second via. Any one of the first via and the second via can be formed to penetrate a same planar surface as at least one of the two conductive layers.

摘要翻译： 公开了一种电磁带隙结构及其印刷电路板。 根据本发明的实施例，电磁带隙结构可以包括放置在两个导电层之间的多个导电层; 以及缝合通孔，其经配置以在所述导电层的任何两个导电层之间形成电连接。 这里，缝合通孔可以包括第一通孔，第一通孔的一个端部构造成两个导电板中的任何一个; 第二通孔，所述第二通孔的一端部被配置为所述两个导电板中的另一个; 以及在两个导电层之间放置在与导电板不同的平面上的连接图案，并且被配置为在第一通孔的另一端部和第二通孔的另一端部之间形成电连接。 可以形成第一通孔和第二通孔中的任何一个以穿透与两个导电层中的至少一个相同的平面表面。

公开(公告)号：US08699234B2

公开(公告)日：2014-04-15

申请号：US12984935

申请日：2011-01-05

申请人： Han Kim ,  Mi-Ja Han ,  Dae-Hyun Park ,  Hyo-Jic Jung ,  Kang-Wook Bong

发明人： Han Kim ,  Mi-Ja Han ,  Dae-Hyun Park ,  Hyo-Jic Jung ,  Kang-Wook Bong

IPC分类号： H05K1/18

CPC分类号： H05K1/0236 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2924/15313 ,  H01L2924/16251 ,  H01L2924/3025 ,  H05K3/4694

摘要： An EMI noise shield board, in which an EBG structure is inserted, includes a first board portion and a second board portion. The first board portion has an upper surface, on which an electronic part is disposed, and a circuit for transferring a signal and power to the electronic part. The second board portion is located on a lower surface of the first board portion. The electromagnetic bandgap structure is inserted into the second board portion, and has a band stop frequency property such that an EMI noise transferred from the first board portion is shielded from being radiated to the outside of the EMI noise shield board.

摘要翻译： 其中插入有EBG结构的EMI噪声屏蔽板包括第一板部分和第二板部分。 第一板部分具有设置有电子部件的上表面和用于将信号和电力传送到电子部件的电路。 第二板部分位于第一板部分的下表面上。 电磁带隙结构被插入到第二板部分中，并且具有阻挡频率特性，使得从第一板部分传送的EMI噪声被屏蔽而不被辐射到EMI噪声屏蔽板的外部。

公开(公告)号：US20110067914A1

公开(公告)日：2011-03-24

申请号：US12654361

申请日：2009-12-17

申请人： Hyo-Jic Jung ,  Han Kim ,  Mi-Ja Han ,  Kang-Wook Bong ,  Dae-Hyun Park

发明人： Hyo-Jic Jung ,  Han Kim ,  Mi-Ja Han ,  Kang-Wook Bong ,  Dae-Hyun Park

IPC分类号： H05K9/00 ,  H05K1/11

CPC分类号： H05K1/0236 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H05K2201/09309 ,  H05K2201/09627 ,  H01L2924/00014

摘要： Disclosed is a printed circuit board into which an electromagnetic bandgap structure for blocking a noise is inserted. The electromagnetic bandgap structure can include a first conductor and a second conductor arranged on different planar surfaces, a third conductor arranged on a same planar surface that is different from a planar surface where the second conductor is arranged, and a first stitching via unit configured to connect the first conductor to the third connector through the planar surface where the second conductor is arranged and being electrically separated from the second conductor. The first conductor can include a first plate, a second plate spaced from the first plate, and a second stitching unit configured to electrically connect the first plate to the second plate through a planar surface that is different from a planar surface where the first plate and the second plate are arranged.

摘要翻译： 公开了一种印刷电路板，其中插入用于阻挡噪声的电磁带隙结构。 电磁带隙结构可以包括布置在不同平面上的第一导体和第二导体，布置在与布置第二导体的平面不同的相同平面上的第三导体，以及第一缝合通孔单元， 通过布置第二导体的平面表面将第一导体连接到第三连接器，并与第二导体电分离。 第一导体可以包括第一板，与第一板间隔开的第二板，以及第二缝合单元，其被配置为通过与第一板和第二板的平坦表面不同的平面表面将第一板电连接到第二板 布置第二板。