Invention Grant
- Patent Title: EMI noise shield board including electromagnetic bandgap structure
- Patent Title (中): EMI噪声屏蔽板包括电磁带隙结构
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Application No.: US12984935Application Date: 2011-01-05
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Publication No.: US08699234B2Publication Date: 2014-04-15
- Inventor: Han Kim , Mi-Ja Han , Dae-Hyun Park , Hyo-Jic Jung , Kang-Wook Bong
- Applicant: Han Kim , Mi-Ja Han , Dae-Hyun Park , Hyo-Jic Jung , Kang-Wook Bong
- Applicant Address: KR Suwon
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Suwon
- Agency: McDermott Will & Emery LLP
- Priority: KR10-2010-0054057 20100608
- Main IPC: H05K1/18
- IPC: H05K1/18

Abstract:
An EMI noise shield board, in which an EBG structure is inserted, includes a first board portion and a second board portion. The first board portion has an upper surface, on which an electronic part is disposed, and a circuit for transferring a signal and power to the electronic part. The second board portion is located on a lower surface of the first board portion. The electromagnetic bandgap structure is inserted into the second board portion, and has a band stop frequency property such that an EMI noise transferred from the first board portion is shielded from being radiated to the outside of the EMI noise shield board.
Public/Granted literature
- US20110299264A1 EMI NOISE SHIELD BOARD INCLUDING ELECTROMAGNETIC BANDGAP STRUCTURE Public/Granted day:2011-12-08
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