发明申请
- 专利标题: ELECTROMAGNETIC BANDGAP STRUCTURE AND PRINTED CIRCUIT BOARD
- 专利标题(中): 电磁带结构和印刷电路板
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申请号: US13411005申请日: 2012-03-02
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公开(公告)号: US20120162934A1公开(公告)日: 2012-06-28
- 发明人: Dae-Hyun Park , Han Kim , Mi-Ja Han , Ja-Bu Koo
- 申请人: Dae-Hyun Park , Han Kim , Mi-Ja Han , Ja-Bu Koo
- 申请人地址: KR Suwon
- 专利权人: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人地址: KR Suwon
- 优先权: KR10-2007-0041993 20070430
- 主分类号: H05K7/00
- IPC分类号: H05K7/00
摘要:
An electromagnetic bandgap structure and a printed circuit board that solve a mixed signal problem are disclosed. In accordance with embodiments of the present invention, the electromagnetic bandgap structure includes a first metal layer; a first dielectric layer, stacked in the first metal layer; a second metal layer, stacked in the first dielectric layer, and having a holed formed at a position of the second dielectric layer; a second dielectric layer, stacked in the second metal layer; a metal plate, stacked in the second dielectric layer; a first via, penetrating the hole formed in the second metal layer and connecting the first metal layer and the metal plate; a third dielectric layer, stacked in the metal plate and the second dielectric layer; a third metal layer, stacked in the third dielectric layer; and a second via, connecting the second metal layer to the third metal layer.
公开/授权文献
- US08853560B2 Electromagnetic bandgap structure and printed circuit board 公开/授权日:2014-10-07
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