Invention Grant
- Patent Title: Electromagnetic bandgap structure and circuit board
- Patent Title (中): 电磁带隙结构和电路板
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Application No.: US12568362Application Date: 2009-09-28
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Publication No.: US08289099B2Publication Date: 2012-10-16
- Inventor: Han Kim , Ja-Bu Koo , Dae-Hyun Park
- Applicant: Han Kim , Ja-Bu Koo , Dae-Hyun Park
- Applicant Address: KR Gyunggi-Do
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Gyunggi-Do
- Agency: McDermott Will & Emery LLP
- Priority: KR10-2008-0120949 20081202
- Main IPC: H03H7/00
- IPC: H03H7/00

Abstract:
An electromagnetic bandgap structure includes: first conductive plates, placed on a first planar surface, in which the first conductive plates are lined up in a first direction; second conductive plates, placed on a second planar surface and arranged at an area corresponding to an area in which the first conductive plates are disposed, in which the second conductive plates are lined up in the first direction; a first stitching via, electrically connecting any two adjacent conductive portions with each other and in which the two adjacent conductive portions are lined up in a direction that is different from the first direction on the first planar surface; and a second stitching via, electrically connecting any two adjacent conductive portions with each other and in which the two adjacent conductive portions are lined up in a direction that is different from the first direction on the second planar surface.
Public/Granted literature
- US20100134213A1 ELECTROMAGNETIC BANDGAP STRUCTURE AND CIRCUIT BOARD Public/Granted day:2010-06-03
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