公开(公告)号：US20170158807A1

公开(公告)日：2017-06-08

申请号：US15321628

申请日：2015-07-01

Applicant: DIC CORPORATION

Inventor： Yasuyo YOSHIMOTO ,  Hiroshi KINOSHITA

IPC: C08G59/32 ,  C09J163/00 ,  C08K9/08 ,  C08K3/36 ,  C08K3/22 ,  H01L23/00 ,  C08K7/02 ,  H05K1/02 ,  H05K1/03 ,  H01L23/29 ,  H01L23/373 ,  C08G59/50 ,  C09J11/04

CPC classification number: C08G59/3218 ,  C08G59/245 ,  C08G59/32 ,  C08G59/5073 ,  C08K3/00 ,  C08K3/22 ,  C08K3/36 ,  C08K7/02 ,  C08K9/08 ,  C08K2003/2227 ,  C08K2201/001 ,  C08L63/00 ,  C09J9/00 ,  C09J11/04 ,  C09J163/00 ,  H01L23/295 ,  H01L23/3737 ,  H01L24/29 ,  H01L2224/2919 ,  H01L2924/01006 ,  H01L2924/04541 ,  H01L2924/0463 ,  H01L2924/04642 ,  H01L2924/0503 ,  H01L2924/05032 ,  H01L2924/05042 ,  H01L2924/0532 ,  H01L2924/0542 ,  H01L2924/05432 ,  H01L2924/05442 ,  H01L2924/0665 ,  H01L2924/186 ,  H05K1/0203 ,  H05K1/0373 ,  H05K2201/0104

Abstract: An epoxy resin composition for electronic material, containing a polyfunctional biphenyl type epoxy resin that is a triglycidyloxybiphenyl or a tetraglycidyloxybiphenyl and at least one of a curing agent and a curing accelerator is provided. Furthermore, the epoxy resin composition for electronic material, further containing a filler, in particular, a thermal conductive filler, is provided. Furthermore, a cured product obtained by curing the epoxy resin composition for electronic material, and an electronic component containing the cured product are provided.

公开(公告)号：US20160311967A1

公开(公告)日：2016-10-27

申请号：US15105176

申请日：2014-12-16

Applicant: DIC Corporation

Inventor： Yasuyo YOSHIMOTO ,  Hiroshi KINOSHITA

IPC: C08G59/32 ,  C08L63/00

CPC classification number: C08G59/3218 ,  C08G59/063 ,  C08L63/00

Abstract: The present invention relates to an epoxy resin containing a biphenyl skeleton, a method for producing the epoxy resin, an epoxy resin composition containing a biphenyl skeleton, and a cured product thereof. More particularly, the present invention relates to an epoxy resin being a compound having a 3,3′,5,5′-tetraglycidyloxy biphenyl skeleton, and to an epoxy resin composition containing the epoxy resin. The present invention also relates to a method for producing an epoxy resin including causing a compound having a 3,3′,5,5′-tetrahydroxy biphenyl skeleton to react with epihalohydrin, and to an epoxy resin obtained by the production method.

Abstract translation: 本发明涉及含有联苯骨架的环氧树脂，环氧树脂的制造方法，含有联苯骨架的环氧树脂组合物及其固化物。 更具体地说，本发明涉及作为具有3,3'，5,5'-四缩水甘油氧基联苯骨架的化合物的环氧树脂以及含有环氧树脂的环氧树脂组合物。 本发明还涉及一种环氧树脂的制造方法，其包括使具有3,3'，5,5'-四羟基联苯骨架的化合物与表卤代醇反应，以及通过该制造方法得到的环氧树脂。