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公开(公告)号：US10751912B2
公开(公告)日：2020-08-25
申请号：US15765931
申请日：2016-10-11
发明人： Hiroaki Ota , Takeshi Miyakawa , Yosuke Ishihara
IPC分类号： B22F7/02 , B28B19/00 , C22C26/00 , C22C21/00 , C04B41/88 , C04B41/00 , H01L21/48 , C04B41/51 , B22D21/00 , C22C1/10 , C22C21/04 , B22F7/04 , B28B11/24 , C09K5/14 , F28F21/08 , H01L23/373 , C22C21/02
摘要： The present invention provides an aluminum-diamond composite which combines high thermal conductivity and a coefficient of thermal expansion close to a semiconductor element, and in which the difference between the thicknesses of both surfaces is reduced so as to be suitable for use as a heat sink etc. for a semiconductor element. Provided is a flat plate-shaped aluminum-diamond composite that has an aluminum-diamond composite part and a surface layer that coats both surfaces of the composite part and includes a metal that has aluminum as a principal component, wherein: the composite part is composed of a composite material that is composed of an aluminum or aluminum alloy matrix and diamond particles dispersed in said matrix; the composite material is composed of a diamond powder in which diamond particles having a particle size of 1-20 μm, inclusive, make up 10-40 vol % of the diamond particles and diamond particles having a particle size of 100-250 μm, inclusive, make up 50-80 vol %, said powder not containing diamond particles having a particle size of less than 1 μm or diamond particles having a particle size of more than 250 μm; and the average value for the differences in in-plane thickness per 50 mm×50 mm is 100 μm or less.
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公开(公告)号：US10541189B2
公开(公告)日：2020-01-21
申请号：US16474690
申请日：2017-11-24
IPC分类号： H01L23/373 , C23C18/32 , C25D7/12 , C22C26/00
摘要： A sheet-shaped aluminum-diamond composite containing a prescribed amount of a diamond powder wherein a first and second peak in a volumetric distribution of particle sizes occurs at 5-25 μm and 55-195 μm, and a ratio between an area of a volumetric distribution of particle sizes of 1-35 μm and 45-205 μm is from 1:9 to 4:6, the composite including an aluminum-containing metal as the balance, wherein the composite is covered, on both main surfaces, with a surface layer having prescribed film thicknesses and containing 80 vol % or more of an aluminum-containing metal, two or more Ni-containing layers are formed on at least the surface layer, the Ni-containing layers being such that a first and second layer from the surface layer side are amorphous Ni alloy layers having prescribed thicknesses, and an Au layer having a prescribed thickness is formed as an outermost layer.
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公开(公告)号：US12069837B2
公开(公告)日：2024-08-20
申请号：US17425541
申请日：2020-01-29
发明人： Daisuke Goto , Hiroaki Ota
IPC分类号： H05K7/20 , B28B3/02 , C04B35/575 , C04B41/45 , C04B41/51 , C04B41/88 , C09K5/14 , F28F21/04 , F28F21/08
CPC分类号： H05K7/2039 , B28B3/025 , C04B35/575 , C04B41/4523 , C04B41/5155 , C04B41/88 , C09K5/14 , F28F21/04 , F28F21/089 , C04B2235/3418 , C04B2235/3826 , F28F2215/04 , F28F2215/10
摘要： Among two main surfaces of a heat dissipation member, one main surface is curved to be convex in an outward direction and the other convex in an inward direction. When a straight line passing through both endpoints P1 and P2 of the curve is l1, a point at which a distance to l1 on the curve is maximum is Pmax, an intersection point between l1 and a perpendicular drawn from Pmax to l1 is P3, a middle point of a line segment P1P3 is P4, an intersection point between the curve and a straight line that passes through P4 and is perpendicular to l1 is Pmid, a length of the line segment P1P3 is L, a length of a line segment P3Pmax is H, and a length of a line segment P4Pmax is h, (2 h/L)/(H/L) is 1.1 or more.
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公开(公告)号：US12084390B2
公开(公告)日：2024-09-10
申请号：US18023226
申请日：2022-02-16
发明人： Daisuke Goto , Hiroaki Ota
IPC分类号： C04B35/565 , B28B5/02 , B28B11/12 , C04B35/622 , C04B41/51 , C04B41/88
CPC分类号： C04B41/5155 , B28B5/021 , B28B11/12 , C04B35/565 , C04B35/62236 , C04B41/88 , C04B2235/3826 , C04B2235/402 , C04B2235/5224 , C04B2235/602 , C04B2235/616 , C04B2235/96
摘要： A molded article having a small difference in thermal conductivities between a central section and a section located at an outer peripheral surface side; and a method for producing the same; wherein, a plate-shaped molded article includes an aluminum-silicon carbide composited section in which a metal including aluminum was impregnated into a silicon carbide porous body, wherein a difference in the densities, by Archimedes' principle, of a central section of the aluminum-silicon carbide composited section and of at least a portion of an outer side section located further toward the outside peripheral surface side than the central section is 3% or less.
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公开(公告)号：US11983586B2
公开(公告)日：2024-05-14
申请号：US17791971
申请日：2021-03-25
发明人： Daisuke Goto , Hiroaki Ota
IPC分类号： G06K19/02 , B32B3/30 , B32B7/08 , B32B7/12 , B32B15/01 , B32B15/04 , B32B18/00 , G06K19/06 , H01L23/498 , H01L23/544 , H05K1/02 , H05K7/20
CPC分类号： G06K19/02 , B32B3/30 , B32B15/016 , B32B15/043 , G06K19/06037 , H01L23/544 , H05K1/0269 , H05K7/205 , B32B7/08 , B32B7/12 , B32B18/00 , B32B2255/06 , B32B2255/205 , B32B2264/108 , B32B2307/302 , B32B2307/538 , B32B2457/08 , H01L23/49838 , H01L2223/54406 , H01L2223/54413 , H05K1/0204
摘要： A ceramic circuit board includes a ceramic base material, a metal layer (first metal layer), and a marker portion. The marker portion is formed on the surface of the first metal layer. The surface of the metal layer (first metal layer) may be plated. When the surface of the metal layer (first metal layer) is plated, the marker portion may be formed on the plating.
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公开(公告)号：US11912489B2
公开(公告)日：2024-02-27
申请号：US17292473
申请日：2019-11-06
发明人： Hiroaki Ota , Yosuke Ishihara , Daisuke Goto
CPC分类号： B65D81/268 , B65D57/004 , B65D81/203
摘要： A plurality of heat dissipation substrates stacked on each other, intermediate sheets disposed under a lowermost heat dissipation substrate, on an uppermost heat dissipation substrate, and between heat dissipation substrates adjacent to each other, a drying agent disposed over or under the plurality of heat dissipation substrates, and a bag that seals the plurality of heat dissipation substrates, the plurality of intermediate sheets, and the drying agent.
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