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    PHOTONIC INTEGRATION PLATFORM
    1.
    发明申请
    PHOTONIC INTEGRATION PLATFORM 审中-公开

    公开(公告)号：US20180341064A1

    公开(公告)日：2018-11-29

    申请号：US16052524

    申请日：2018-08-01

    Applicant: Cisco Technology, Inc.

    Inventor： Mark WEBSTER ,  Ravi Sekhar TUMMIDI

    IPC: G02B6/30 ,  G02B6/12 ,  G02B6/122 ,  G02B6/14 ,  G02B6/10 ,  G02B6/132 ,  G02B6/43

    Abstract: A SOI device may include a waveguide adapter that couples light between an external light source—e.g., a fiber optic cable or laser—and a silicon waveguide on the silicon surface layer of the SOI device. In one embodiment, the waveguide adapter is embedded into the insulator layer. Doing so may enable the waveguide adapter to be formed before the surface layer components are added onto the SOI device. Accordingly, fabrication techniques that use high-temperatures may be used without harming other components in the SOI device—e.g., the waveguide adapter is formed before heat-sensitive components are added to the silicon surface layer.

    MULTILAYER PHOTONIC ADAPTER
    2.
    发明申请
    MULTILAYER PHOTONIC ADAPTER 有权
    多层光电适配器

    公开(公告)号：US20160266321A1

    公开(公告)日：2016-09-15

    申请号：US14658220

    申请日：2015-03-15

    Applicant: Cisco Technology, Inc.

    Inventor： Ravi Sekhar TUMMIDI ,  Mark WEBSTER ,  Vipulkumar PATEL

    IPC: G02B6/30 ,  G02B6/10 ,  G02B6/122 ,  G02B6/12

    CPC classification number: G02B6/30 ,  G02B6/107 ,  G02B6/12004 ,  G02B6/122 ,  G02B6/1228 ,  G02B6/136 ,  G02B2006/12061 ,  G02B2006/121 ,  G02B2006/12142

    Abstract: Embodiments herein describe disposing a waveguide adapter onto an SOI device after the components on a silicon surface layer have been formed. That is, the waveguide adapter is disposed above optical components (e.g., optical modulators, detectors, waveguides, etc) formed in a surface layer. In one embodiment, a waveguide in a bottom layer of the waveguide adapter overlaps a silicon waveguide in the surface layer such that the silicon waveguide and the waveguide in the bottom layer are optically coupled. The waveguide adapter also includes other layers above the bottom layer (e.g., middle and top layers) that also contain waveguides which form an adiabatic optical system for transmitting an optical signal. At least one of the waveguides in the multi-layer adapter is exposed at an optical interface of the SOI device, thereby permitting the SOI device to transmit optical signals to, or receive optical signals from, an external optical component.

    Abstract translation: 本文的实施例描述了在形成硅表面层上的组分之后将波导适配器设置在SOI器件上。 也就是说，波导适配器设置在形成在表面层中的光学部件（例如，光学调制器，检测器，波导等）之上。 在一个实施例中，波导适配器的底层中的波导与表面层中的硅波导重叠，使得硅波导和底层中的波导光学耦合。 波导适配器还包括底层（例如，中层和顶层）之上的其它层，其也包含形成用于传输光信号的绝热光学系统的波导。 多层适配器中的至少一个波导在SOI器件的光学接口处露出，从而允许SOI器件将光信号传输到外部光学部件或从外部光学部件接收光信号。

    PHOTONIC INTEGRATION PLATFORM
    3.
    发明申请
    PHOTONIC INTEGRATION PLATFORM 审中-公开

    公开(公告)号：US20200088946A1

    公开(公告)日：2020-03-19

    申请号：US16690574

    申请日：2019-11-21

    Applicant: Cisco Technology, Inc.

    Inventor： Mark WEBSTER ,  Ravi Sekhar TUMMIDI

    IPC: G02B6/30 ,  G02B6/122 ,  G02B6/12 ,  G02B6/14

    Abstract: A SOI device may include a waveguide adapter that couples light between an external light source—e.g., a fiber optic cable or laser—and a silicon waveguide on the silicon surface layer of the SOI device. In one embodiment, the waveguide adapter is embedded into the insulator layer. Doing so may enable the waveguide adapter to be formed before the surface layer components are added onto the SOI device. Accordingly, fabrication techniques that use high-temperatures may be used without harming other components in the SOI device—e.g., the waveguide adapter is formed before heat-sensitive components are added to the silicon surface layer.

    PASSIVE PLACEMENT OF A LASER ON A PHOTONIC CHIP
    5.
    发明申请
    PASSIVE PLACEMENT OF A LASER ON A PHOTONIC CHIP 审中-公开
    激光在光子芯片上的被动放置

    公开(公告)号：US20170003463A1

    公开(公告)日：2017-01-05

    申请号：US14790925

    申请日：2015-07-02

    Applicant: Cisco Technology, Inc.

    Inventor： Mary NADEAU ,  Thomas DAUGHERTY ,  Ravi Sekhar TUMMIDI ,  Vipulkumar PATEL

    IPC: G02B6/42 ,  H01S5/022 ,  H01S5/02 ,  G02B6/13

    CPC classification number: H01S5/02272 ,  G02B6/4231 ,  G02B6/4238 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01S5/0224 ,  H01S5/02252 ,  H01L2924/00014

    Abstract: Embodiments disclosed herein generally relate to a method for manufacturing a photonic device that facilitates precise alignment of a laser with a waveguide. The method generally includes disposing the laser on a support member on a substrate such that the laser contacts the support member. The support member may extend in a direction perpendicular to a base plane of the substrate, and solder may be disposed on the base plane such that a height of the solder in the direction perpendicular to the base plane is less than a height of the support member so that a gap is created between the solder and the laser. Once the laser has been properly aligned with the waveguide, the solder may be heated (e.g., reflowed) so that the solder contacts the laser.

    Abstract translation: 本文公开的实施例一般涉及一种用于制造有助于激光与波导的精确对准的光子器件的方法。 该方法通常包括将激光器设置在基板上的支撑构件上，使得激光器接触支撑构件。 支撑构件可以在垂直于基底的基面的方向上延伸，并且焊料可以设置在基面上，使得焊料在垂直于基面的方向上的高度小于支撑构件的高度 从而在焊料和激光之间产生间隙。 一旦激光器已经正确地对准波导，则焊料可以被加热（例如回流），使得焊料接触激光器。

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