公开(公告)号：US20130048248A1

公开(公告)日：2013-02-28

申请号：US13218424

申请日：2011-08-25

Applicant: Chun-Hung Lin ,  Han-Lin Chen ,  Chang-Yin Chen

Inventor： Chun-Hung Lin ,  Han-Lin Chen ,  Chang-Yin Chen

IPC: F28D15/04 ,  B21D53/02

CPC classification number: B21C37/154 ,  B21C37/16 ,  F28D15/0233 ,  F28D15/046 ,  Y10T29/49353

Abstract: A heat pipe includes a step pipe, a mesh, and a supporting component. The step pipe has an evaporating section and two condensing sections. The condensing sections are on the two ends of the step pipe, respectively. The evaporating section lies between the two condensing sections. The inner spaces of the two condensing sections and the evaporating section are interconnected. The peripheral dimension of the evaporating section is larger than the peripheral dimension of each of the condensing sections. The mesh is contained in the step pipe and located inside the evaporating section. The supporting component is contained in the step pipe and wrapped in the mesh. The combination of these structures increases air's flow rate inside the heat pipe and improves the heat pipe's heat conduction efficiency.

Abstract translation: 热管包括台阶管，网和支撑构件。 步进管具有蒸发段和两个冷凝段。 冷凝段分别位于台阶管的两端。 蒸发部分位于两个冷凝部分之间。 两个冷凝部分和蒸发部分的内部空间相互连接。 蒸发部分的周边尺寸大于每个冷凝部分的周边尺寸。 网状物包含在台阶管中，位于蒸发段内。 支撑部件包含在台阶管中并包裹在网中。 这些结构的组合增加了热管内空气的流量，提高了热管的热传导效率。

公开(公告)号：US20130037241A1

公开(公告)日：2013-02-14

申请号：US13206359

申请日：2011-08-09

Applicant: Chun-Hung LIN ,  Han-Lin Chen ,  Chang-Yin Chen

Inventor： Chun-Hung LIN ,  Han-Lin Chen ,  Chang-Yin Chen

IPC: F28D15/04

CPC classification number: F28D15/046 ,  F28D15/0233

Abstract: The heat pipe of the invention includes an evaporation section and two condensation sections. The evaporation section is located at a part of the heat pipe. The two condensation sections are separately located at two opposite sides of the evaporation section. The evaporation section and the two condensation sections communicate with each other, and a peripheral size of the evaporation section is larger than that of each of the condensation sections.

Abstract translation: 本发明的热管包括蒸发部和两个冷凝部。 蒸发段位于热管的一部分。 两个冷凝部分分别位于蒸发部分的相对两侧。 蒸发部和两个冷凝部彼此连通，蒸发部的周边尺寸大于各冷凝部的周长。

公开(公告)号：US20130048247A1

公开(公告)日：2013-02-28

申请号：US13218420

申请日：2011-08-25

Applicant: Chun-Hung LIN ,  Han-Lin Chen ,  Chang-Yin Chen

Inventor： Chun-Hung LIN ,  Han-Lin Chen ,  Chang-Yin Chen

IPC: F28D15/04 ,  B21D53/02

CPC classification number: B21C37/154 ,  B21C37/16 ,  F28D15/0233 ,  F28D15/046 ,  Y10T29/49353

Abstract: A heat pipe includes a step pipe, a mesh, and a supporting component. The step pipe has an evaporating section and two condensing sections. The condensing sections are on the two ends of the step pipe, respectively. The evaporating section lies between the two condensing sections. The inner spaces of the two condensing sections and the evaporating section are interconnected. The peripheral dimension of the evaporating section is larger than the peripheral dimension of each of the condensing sections. The mesh is contained in the step pipe and located inside the evaporating section and the condensing sections. The supporting component is contained in the step pipe and wrapped in the mesh. The combination of these structures increases air's flow rate inside the heat pipe and improves the heat pipe's heat conduction efficiency.

Abstract translation: 热管包括台阶管，网和支撑构件。 步进管具有蒸发段和两个冷凝段。 冷凝段分别位于台阶管的两端。 蒸发部分位于两个冷凝部分之间。 两个冷凝部分和蒸发部分的内部空间相互连接。 蒸发部分的周边尺寸大于每个冷凝部分的周边尺寸。 网状物包含在台阶管中，位于蒸发段和冷凝段内。 支撑部件包含在台阶管中并包裹在网中。 这些结构的组合增加了热管内空气的流量，提高了热管的热传导效率。

公开(公告)号：US20130048249A1

公开(公告)日：2013-02-28

申请号：US13218580

申请日：2011-08-26

Applicant: Chun-Hung LIN ,  Han-Lin Chen ,  Chang-Yin Chen

Inventor： Chun-Hung LIN ,  Han-Lin Chen ,  Chang-Yin Chen

IPC: F28D15/00 ,  B21D53/02 ,  F28D15/04

CPC classification number: F28D15/0233 ,  F28D15/046 ,  H01L21/4871 ,  H01L23/427 ,  H01L2924/0002 ,  Y10T29/49353 ,  H01L2924/00

Abstract: A heat pipe includes a step pipe and a sintered powder structure. The inner wall of the step pipe has a plurality of grooves. The step pipe has an evaporating section and two condensing sections. The condensing sections are on the two ends of the step pipe, respectively. The evaporating section lies between the two condensing sections. The inner spaces of the two condensing sections and the evaporating section are interconnected. The peripheral dimension of the evaporating section is larger than the peripheral dimension of each of the condensing sections. The sintered powder structure is bounded inside each of the condensing sections, improving the heat pipe's inner air flow rate and heat conduction efficiency.

Abstract translation: 热管包括台阶管和烧结粉末结构。 台阶管的内壁具有多个槽。 步进管具有蒸发段和两个冷凝段。 冷凝段分别位于台阶管的两端。 蒸发部分位于两个冷凝部分之间。 两个冷凝部分和蒸发部分的内部空间相互连接。 蒸发部分的周边尺寸大于每个冷凝部分的周边尺寸。 烧结粉末结构限制在每个冷凝段内，提高热管的内部空气流速和导热效率。

公开(公告)号：US09003658B2

公开(公告)日：2015-04-14

申请号：US13314181

申请日：2011-12-08

Applicant: Chang-Yin Chen ,  Lei-Lei Liu

Inventor： Chang-Yin Chen ,  Lei-Lei Liu

IPC: B21D53/06 ,  B21D39/04 ,  B21D41/04 ,  B23P11/00 ,  F28D15/02

CPC classification number: B21D39/04 ,  B21D41/04 ,  B21D53/06 ,  B23P11/005 ,  B23P2700/09 ,  F28D15/02 ,  F28F2275/127 ,  Y10T29/49353 ,  Y10T29/49361

Abstract: A method for enclosing a heat pipe with metal is disclosed. The method includes the steps of: a) providing a tube made of a metal; b) putting the heat pipe in a hollow of the tube; and c) stretching the tube to shrink an inner diameter of the tube for tightly enclosing the heat pipe.

Abstract translation: 公开了一种用金属封闭热管的方法。 该方法包括以下步骤：a）提供由金属制成的管; b）将热管放置在管的中空中; 以及c）拉伸管以收缩管的内径以紧紧地封闭热管。

公开(公告)号：US20130181262A1

公开(公告)日：2013-07-18

申请号：US13349969

申请日：2012-01-13

Applicant: Che-Cheng Chang ,  Po-Chi Wu ,  Chang-Yin Chen ,  Zhe-Hao Zhang ,  Yi-Chen Huang

Inventor： Che-Cheng Chang ,  Po-Chi Wu ,  Chang-Yin Chen ,  Zhe-Hao Zhang ,  Yi-Chen Huang

IPC: H01L29/78 ,  H01L21/336

CPC classification number: H01L29/66636 ,  H01L21/823807 ,  H01L21/823814 ,  H01L29/165 ,  H01L29/6659 ,  H01L29/7833 ,  H01L29/7834 ,  H01L29/7848

Abstract: A method includes forming a gate stack over a semiconductor substrate, wherein the gate stack includes a gate dielectric and a gate electrode over the gate dielectric. A portion of the semiconductor substrate adjacent to the gate stack is recessed to form a recess. A semiconductor region is epitaxially grown in the recess. The semiconductor region is implanted with a p-type impurity or an n-type impurity. A dry treatment is performed on the semiconductor region.

Abstract translation: 一种方法包括在半导体衬底上形成栅极堆叠，其中栅极堆叠包括栅极电介质和位于栅极电介质上的栅电极。 与栅叠层相邻的半导体衬底的一部分被凹入以形成凹部。 半导体区域在凹槽中外延生长。 半导体区域注入p型杂质或n型杂质。 在半导体区域进行干法处理。

公开(公告)号：US20130105131A1

公开(公告)日：2013-05-02

申请号：US13349813

申请日：2012-01-13

Applicant: Chang-Yin Chen ,  Lei-Lei Liu

Inventor： Chang-Yin Chen ,  Lei-Lei Liu

IPC: F28F1/00

CPC classification number: F28D15/0233 ,  F28D15/046 ,  H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

Abstract: The flattened heat pipe includes a flattened tube, a first wick structure, a second wick structure and a working fluid. The flattened tube has an annular wall and a chamber formed within the annular wall. The first wick structure is disposed on a portion of the annular wall. The second wick structure is disposed on another portion of the annular wall, and not overlapping with each other. The working fluid is filled in the chamber.

Abstract translation: 扁平的热管包括扁平管，第一芯结构，第二芯结构和工作流体。 扁平管具有形成在环形壁内的环形壁和室。 第一芯结构设置在环形壁的一部分上。 第二芯结构设置在环形壁的另一部分上，并且彼此不重叠。 工作流体填充在腔室中。

公开(公告)号：US08642435B2

公开(公告)日：2014-02-04

申请号：US13349969

申请日：2012-01-13

Applicant: Che-Cheng Chang ,  Po-Chi Wu ,  Chang-Yin Chen ,  Zhe-Hao Zhang ,  Yi-Chen Huang

Inventor： Che-Cheng Chang ,  Po-Chi Wu ,  Chang-Yin Chen ,  Zhe-Hao Zhang ,  Yi-Chen Huang

IPC: H01L21/336

CPC classification number: H01L29/66636 ,  H01L21/823807 ,  H01L21/823814 ,  H01L29/165 ,  H01L29/6659 ,  H01L29/7833 ,  H01L29/7834 ,  H01L29/7848

Abstract: A method includes forming a gate stack over a semiconductor substrate, wherein the gate stack includes a gate dielectric and a gate electrode over the gate dielectric. A portion of the semiconductor substrate adjacent to the gate stack is recessed to form a recess. A semiconductor region is epitaxially grown in the recess. The semiconductor region is implanted with a p-type impurity or an n-type impurity. A dry treatment is performed on the semiconductor region.

Abstract translation: 一种方法包括在半导体衬底上形成栅极堆叠，其中栅极堆叠包括栅极电介质和位于栅极电介质上的栅电极。 与栅叠层相邻的半导体衬底的一部分被凹入以形成凹部。 半导体区域在凹槽中外延生长。 半导体区域注入p型杂质或n型杂质。 在半导体区域进行干法处理。

公开(公告)号：US20120168435A1

公开(公告)日：2012-07-05

申请号：US12983981

申请日：2011-01-04

Applicant: Chang-Yin Chen ,  Lei-Lei Liu ,  Meng-Zhou Wang

Inventor： Chang-Yin Chen ,  Lei-Lei Liu ,  Meng-Zhou Wang

IPC: B65D6/00

CPC classification number: F28D15/0233 ,  F28D15/04

Abstract: A folding vapor chamber includes folding boards engaged and covered with one another, a folding edge formed between the adjacent folding boards and provided for connecting the folding boards integrally, and the adjacent folding boards being bent and folded by the corresponding folding edge and engaged with one another, and a capillary tissue installed at an internal surface between the folding boards. The casing is formed by the folding edge to reduce the length of the sealing edge of the vapor chamber, so as to achieve the effects of lowering the defective rate of the edge sealing operation, and preventing the sealing edge from being cracked easily.

Abstract translation: 折叠蒸气室包括彼此接合和覆盖的折叠板，折叠边缘，形成在相邻的折叠板之间并且设置成用于将折叠板一体地连接，并且相邻的折叠板由相应的折叠边缘弯曲和折叠并与一个 另一个和安装在折叠板之间的内表面的毛细管组织。 壳体由折边形成，以减小蒸气室的密封边缘的长度，从而实现降低边缘密封操作的缺陷率，并且防止密封边缘容易破裂的效果。