公开(公告)号：US11946950B2

公开(公告)日：2024-04-02

申请号：US17062954

申请日：2020-10-05

Applicant: Carl Zeiss SMT GmbH

Inventor： Philipp Huebner ,  Stefan Richter

IPC: G01R1/07 ,  G01R1/073 ,  G01R31/311 ,  G02B6/26 ,  G02B26/08

CPC classification number: G01R1/071 ,  G01R1/073 ,  G01R31/311 ,  G02B6/26 ,  G02B26/0816

Abstract: An electro-optical circuit board can provide probe card functionality. The electro-optical circuit board includes at least one electrical conductor track and at least one optical beam path.

公开(公告)号：US20200166852A1

公开(公告)日：2020-05-28

申请号：US16778359

申请日：2020-01-31

Applicant: Carl Zeiss SMT GmbH

Inventor： Stefan Richter ,  Enrico Geissler ,  Dirk Doering ,  Lakshmanan Senthil Kumar ,  Guenter Rudolph ,  Martin Voelcker ,  Markus Deguenther

IPC: G03F7/20 ,  G02B26/12 ,  G02B6/42 ,  B23K26/06

Abstract: The disclosure relates to a lithography apparatus for writing to substrate wafers. The apparatus includes: a light generating device including one or a plurality of light sources for generating light; a writing device; a light transferring device including a number of optical waveguides for transferring the light from the light generating device to a writing device, the writing device including a plurality of individually controllable write heads for projecting the light from the one or the plurality of light sources in different regions of a substrate wafer; a transport device for moving the substrate wafer relative to the writing device in a predefined transport direction; and a control device for controlling the writing process on the substrate wafer.

公开(公告)号：US20190339327A1

公开(公告)日：2019-11-07

申请号：US16516400

申请日：2019-07-19

Applicant: Carl Zeiss SMT GmbH

Inventor： Philipp Huebner ,  Stefan Richter

IPC: G01R31/317 ,  G02B6/34

Abstract: Methods and apparatuses for testing a photonic integrated circuit and a corresponding sample holder and a photonic integrated circuit are provided. Here, a location for an illumination light beam can be selected by way of a scanning device, with the result that targeted coupling of the illumination light into the photonic integrated circuit is made possible.

公开(公告)号：US20220004107A1

公开(公告)日：2022-01-06

申请号：US17480800

申请日：2021-09-21

Applicant: Carl Zeiss SMT GmbH

Inventor： Jan Horn ,  Stefan Richter

IPC: G03F7/20 ,  G02B5/08

Abstract: An optical arrangement for a lithography apparatus has a microsystem with a mirror array. A respective mirror of the mirror array is set up to reflect working light of the lithography apparatus on its front side and also a measuring beam on its rear side. One or more radiation sources, which are provided outside the microsystem, are set up to provide the respective measuring beam. One or more sensor units are set up to sense a tilting angle of a respective mirror in dependence on the respectively reflected measuring beam.

公开(公告)号：US20210033643A1

公开(公告)日：2021-02-04

申请号：US17062954

申请日：2020-10-05

Applicant: Carl Zeiss SMT GmbH

Inventor： Philipp Huebner ,  Stefan Richter

IPC: G01R1/07 ,  G02B6/26 ,  G01R1/073 ,  G02B26/08 ,  G01R31/311

Abstract: An electro-optical circuit board can provide probe card functionality. The electro-optical circuit board includes at least one electrical conductor track and at least one optical beam path.

公开(公告)号：US20240402038A1

公开(公告)日：2024-12-05

申请号：US18799060

申请日：2024-08-09

Applicant: Carl Zeiss SMT GmbH

Inventor： Heiner Zwickel ,  Stefan Richter ,  Tobias Harter

IPC: G01M11/02

Abstract: Apparatuses and test cards for testing photonic integrated circuits, corresponding systems and methods, and photonic integrated circuits are provided. A test card can be imaged via an optical unit onto a photonic integrated circuit to be tested. Parallel illumination of the photonic integrated circuit at different locations is possible in this way.

公开(公告)号：US11003090B2

公开(公告)日：2021-05-11

申请号：US16778359

申请日：2020-01-31

Applicant: Carl Zeiss SMT GmbH

Inventor： Stefan Richter ,  Enrico Geissler ,  Dirk Doering ,  Lakshmanan Senthil Kumar ,  Guenter Rudolph ,  Martin Voelcker ,  Markus Deguenther

IPC: G03F7/20

Abstract: The disclosure relates to a lithography apparatus for writing to substrate wafers. The apparatus includes: a light generating device including one or a plurality of light sources for generating light; a writing device; a light transferring device including a number of optical waveguides for transferring the light from the light generating device to a writing device, the writing device including a plurality of individually controllable write heads for projecting the light from the one or the plurality of light sources in different regions of a substrate wafer; a transport device for moving the substrate wafer relative to the writing device in a predefined transport direction; and a control device for controlling the writing process on the substrate wafer.

公开(公告)号：US11782088B2

公开(公告)日：2023-10-10

申请号：US16516400

申请日：2019-07-19

Applicant: Carl Zeiss SMT GmbH

Inventor： Philipp Huebner ,  Stefan Richter

IPC: G01R31/00 ,  G01R31/317 ,  G02B6/34

CPC classification number: G01R31/31728 ,  G02B6/34

Abstract: Methods and apparatuses for testing a photonic integrated circuit and a corresponding sample holder and a photonic integrated circuit are provided. Here, a location for an illumination light beam can be selected by way of a scanning device, with the result that targeted coupling of the illumination light into the photonic integrated circuit is made possible.

公开(公告)号：US20170255110A1

公开(公告)日：2017-09-07

申请号：US15600898

申请日：2017-05-22

Applicant: Carl Zeiss SMT GmbH

Inventor： Stefan Richter ,  Enrico Geissler ,  Dirk Doering ,  Lakshmanan Senthil Kumar ,  Guenter Rudolph ,  Martin Voelcker ,  Markus Deguenther

IPC: G03F7/20 ,  B23K26/06 ,  G02B6/42 ,  G02B26/12

CPC classification number: G03F7/70383 ,  B23K26/0604 ,  G02B6/4206 ,  G02B26/123 ,  G03F7/70791 ,  G03F7/7085

Abstract: The disclosure relates to a lithography apparatus for writing to substrate wafers. The apparatus includes: a light generating device including one or a plurality of light sources for generating light; a writing device; a light transferring device including a number of optical waveguides for transferring the light from the light generating device to a writing device, the writing device including a plurality of individually controllable write heads for projecting the light from the one or the plurality of light sources in different regions of a substrate wafer; a transport device for moving the substrate wafer relative to the writing device in a predefined transport direction; and a control device for controlling the writing process on the substrate wafer.