Method and assembly for characterizing a mask or a wafer for microlithography

    公开(公告)号:US11269260B2

    公开(公告)日:2022-03-08

    申请号:US17164747

    申请日:2021-02-01

    Abstract: A method includes using an illumination device to illuminate an object with electromagnetic radiation produced by a radiation source, and using a detector device to capture a respective intensity distribution in a diffraction image produced by the object in a plurality of measurement steps. The measurement steps differ from one another with respect to the illumination setting set by the illumination device. The method also includes determining at least one characteristic variable that is characteristic for the object on the basis of an iteratively performed comparison between the measurement values obtained within the scope of the measurement steps and model-based simulated values. The model-based simulated values are ascertained on the basis of a multiple layer model, in which the object is modeled by a multiple layer structure made of layers that are respectively separated from one another by an interface, wherein a location-dependent reflectivity is assigned to the interfaces.

    METHOD AND ASSEMBLY FOR CHARACTERIZING A MASK OR A WAFER FOR MICROLITHOGRAPHY

    公开(公告)号:US20210157243A1

    公开(公告)日:2021-05-27

    申请号:US17164747

    申请日:2021-02-01

    Abstract: A method includes using an illumination device to illuminate an object with electromagnetic radiation produced by a radiation source, and using a detector device to capture a respective intensity distribution in a diffraction image produced by the object in a plurality of measurement steps. The measurement steps differ from one another with respect to the illumination setting set by the illumination device. The method also includes determining at least one characteristic variable that is characteristic for the object on the basis of an iteratively performed comparison between the measurement values obtained within the scope of the measurement steps and model-based simulated values. The model-based simulated values are ascertained on the basis of a multiple layer model, in which the object is modeled by a multiple layer structure made of layers that are respectively separated from one another by an interface, wherein a location-dependent reflectivity is assigned to the interfaces.

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