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公开(公告)号：US11785706B2
公开(公告)日：2023-10-10
申请号：US17335591
申请日：2021-06-01
Applicant: Cisco Technology, Inc.
Inventor： Shadi Ebrahimi Asl , Stephen Aubrey Scearce , Quinn Gaumer , Linda W. Scott
CPC classification number: H05K1/0218 , H05K1/0298 , H05K1/115 , H05K1/181 , H05K3/0047 , H05K3/303 , H05K3/42 , H05K1/0219 , H05K1/0231 , H05K1/0245 , H05K2201/10015
Abstract: A multilayer printed circuit board having a stackup including an upper half of the stackup and a lower half of the stackup, the multilayer printed circuit board having a top exposed surface and a bottom exposed surface, a first trace and via structure, having one portion disposed on the top exposed surface and another portion disposed within the upper half of the stackup, a second trace and via structure, having one portion disposed on the top exposed surface and another portion disposed within the upper half of the stackup, and first electrical components and second electrical components disposed on the top exposed surface of the multilayer printed circuit board and associated, respectively, with the first trace and via structure and the second trace and via structure, wherein the first electrical components are mounted orthogonally with respect to the second electrical components.
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公开(公告)号：US20240381526A1
公开(公告)日：2024-11-14
申请号：US18313910
申请日：2023-05-08
Applicant: Cisco Technology, Inc.
Inventor： Shadi Ebrahimi Asl , Stephen Aubrey Scearce , Linda W. Scott
Abstract: A method of manufacturing a printed circuit board (PCB) includes arranging a first trace segment of a trace on a substrate of the PCB, the substrate being composed of fiber glass strands that define a fiber glass weave pattern, and arranging a second trace segment of the trace on the substrate at a position that is fractionally offset from the first trace segment along an axis by a distance that is less than a ball grid array (BGA) pitch of a BGA based on the fiber glass weave pattern. The BGA pitch is a separation distance along the axis between a center of a first via of the BGA of the PCB and a center of a second via of the BGA.
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公开(公告)号：US20230371169A1
公开(公告)日：2023-11-16
申请号：US18357440
申请日：2023-07-24
Applicant: Cisco Technology, Inc.
Inventor： Shadi Ebrahimi Asl , Stephen Aubrey Scearce , Quinn Gaumer , Linda W. Scott
CPC classification number: H05K1/0218 , H05K3/0047 , H05K1/115 , H05K1/0298 , H05K1/181 , H05K3/42 , H05K3/303 , H05K1/0219 , H05K2201/10015 , H05K1/0245 , H05K1/0231
Abstract: A multilayer printed circuit board having a stackup including an upper half of the stackup and a lower half of the stackup, the multilayer printed circuit board having a top exposed surface and a bottom exposed surface, a first trace and via structure, having one portion disposed on the top exposed surface and another portion disposed within the upper half of the stackup, a second trace and via structure, having one portion disposed on the top exposed surface and another portion disposed within the upper half of the stackup, and first electrical components and second electrical components disposed on the top exposed surface of the multilayer printed circuit board and associated, respectively, with the first trace and via structure and the second trace and via structure, wherein the first electrical components are mounted orthogonally with respect to the second electrical components.
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公开(公告)号：US20230337390A1
公开(公告)日：2023-10-19
申请号：US17720055
申请日：2022-04-13
Applicant: Cisco Technology, Inc.
Inventor： Phong Hoang Ho , Niels-Peder M. Jensen , Stephen Aubrey Scearce , Robert Vincent Grimes , Lauren Ashleigh Buck
CPC classification number: H05K7/20172 , G06F1/203 , G01H1/003 , G05D23/015
Abstract: An air mover may be provided. The air mover may comprise an air mover motor shaft, a bearing, a bearing housing, a circuit board, an accelerometer device, a temperature sensing device, and a controller. The air mover motor shaft may be associated with a motor. The bearing housing may support the bearing that supports rotation of the air mover motor shaft. The circuit board may be attached to the bearing housing. The accelerometer device may be disposed on the circuit board. The temperature sensing device may be disposed on the circuit board wherein the temperature sensing device may be located on the circuit board in order to obtain a temperature of the bearing housing. The controller may be disposed on the circuit board and may be operative to control the motor, collect vibration data from the accelerometer device, and collect temperature data from the temperature sensing device.
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Patent Agency Ranking
公开(公告)号：US12022640B1
公开(公告)日：2024-06-25
申请号：US17840268
申请日：2022-06-14
Applicant: Cisco Technology, Inc.
Inventor： Phong Hoang Ho , Stephen Aubrey Scearce
CPC classification number: H05K9/0022 , H05K7/2049 , H05K7/2039 , H05K7/20454
Abstract: A multi-column graphite-over-foam (GOF) assembly includes a plurality of foam columns wherein each foam column of the plurality of foam columns are individually wrapped in a graphite sheet. A graphite layer surrounds the plurality of foam columns and an electrically conductive outer layer surrounding the graphite layer. The graphite layer is configured to thermally couple the electrically conductive outer layer to the plurality of foam columns, and the electrically conductive outer layer is configured to absorb electromagnetic interference (EMI).
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公开(公告)号：US20220223522A1
公开(公告)日：2022-07-14
申请号：US17145871
申请日：2021-01-11
Applicant: CISCO TECHNOLOGY, INC.
Inventor： Stephen Aubrey Scearce , Louis Smidt , Kadin Stephens , Victor Liu , Joel Richard Goergen
IPC: H01L23/528 , H01L23/50 , H01L23/538 , H01L23/367
Abstract: In one embodiment, an apparatus includes a connecting member configured for positioning on an upper surface of an integrated circuit package and a cable comprising a first end attached to the connecting member and a second end configured for electrically coupling with a power supply component. The connecting member is operable to position the cable for connection to the upper surface of the integrated circuit package to deliver power from the power supply component to the integrated circuit package with the power supply component and the integrated circuit package mounted on an upper surface of a printed circuit board. A method is also disclosed herein.
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公开(公告)号：US12225658B2
公开(公告)日：2025-02-11
申请号：US18357440
申请日：2023-07-24
Applicant: Cisco Technology, Inc.
Inventor： Shadi Ebrahimi Asl , Stephen Aubrey Scearce , Quinn Gaumer , Linda W. Scott
Abstract: A multilayer printed circuit board having a stackup including an upper half of the stackup and a lower half of the stackup, the multilayer printed circuit board having a top exposed surface and a bottom exposed surface, a first trace and via structure, having one portion disposed on the top exposed surface and another portion disposed within the upper half of the stackup, a second trace and via structure, having one portion disposed on the top exposed surface and another portion disposed within the upper half of the stackup, and first electrical components and second electrical components disposed on the top exposed surface of the multilayer printed circuit board and associated, respectively, with the first trace and via structure and the second trace and via structure, wherein the first electrical components are mounted orthogonally with respect to the second electrical components.
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公开(公告)号：US12107047B2
公开(公告)日：2024-10-01
申请号：US17145871
申请日：2021-01-11
Applicant: CISCO TECHNOLOGY, INC.
Inventor： Stephen Aubrey Scearce , Louis Smidt , Kadin Stephens , Victor Liu , Joel Richard Goergen
IPC: H01L23/528 , H01L23/367 , H01L23/50 , H01L23/538
CPC classification number: H01L23/5286 , H01L23/367 , H01L23/50 , H01L23/5386
Abstract: In one embodiment, an apparatus includes a connecting member configured for positioning on an upper surface of an integrated circuit package and a cable comprising a first end attached to the connecting member and a second end configured for electrically coupling with a power supply component. The connecting member is operable to position the cable for connection to the upper surface of the integrated circuit package to deliver power from the power supply component to the integrated circuit package with the power supply component and the integrated circuit package mounted on an upper surface of a printed circuit board. A method is also disclosed herein.
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公开(公告)号：US20220386452A1
公开(公告)日：2022-12-01
申请号：US17335591
申请日：2021-06-01
Applicant: Cisco Technology, Inc.
Inventor： Shadi Ebrahimi Asl , Stephen Aubrey Scearce , Quinn Gaumer , Linda W. Scott
Abstract: A multilayer printed circuit board having a stackup including an upper half of the stackup and a lower half of the stackup, the multilayer printed circuit board having a top exposed surface and a bottom exposed surface, a first trace and via structure, having one portion disposed on the top exposed surface and another portion disposed within the upper half of the stackup, a second trace and via structure, having one portion disposed on the top exposed surface and another portion disposed within the upper half of the stackup, and first electrical components and second electrical components disposed on the top exposed surface of the multilayer printed circuit board and associated, respectively, with the first trace and via structure and the second trace and via structure, wherein the first electrical components are mounted orthogonally with respect to the second electrical components.
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