公开(公告)号：US20220223522A1

公开(公告)日：2022-07-14

申请号：US17145871

申请日：2021-01-11

Applicant: CISCO TECHNOLOGY, INC.

Inventor： Stephen Aubrey Scearce ,  Louis Smidt ,  Kadin Stephens ,  Victor Liu ,  Joel Richard Goergen

IPC: H01L23/528 ,  H01L23/50 ,  H01L23/538 ,  H01L23/367

Abstract: In one embodiment, an apparatus includes a connecting member configured for positioning on an upper surface of an integrated circuit package and a cable comprising a first end attached to the connecting member and a second end configured for electrically coupling with a power supply component. The connecting member is operable to position the cable for connection to the upper surface of the integrated circuit package to deliver power from the power supply component to the integrated circuit package with the power supply component and the integrated circuit package mounted on an upper surface of a printed circuit board. A method is also disclosed herein.

公开(公告)号：US12107047B2

公开(公告)日：2024-10-01

申请号：US17145871

申请日：2021-01-11

Applicant: CISCO TECHNOLOGY, INC.

Inventor： Stephen Aubrey Scearce ,  Louis Smidt ,  Kadin Stephens ,  Victor Liu ,  Joel Richard Goergen

IPC: H01L23/528 ,  H01L23/367 ,  H01L23/50 ,  H01L23/538

CPC classification number: H01L23/5286 ,  H01L23/367 ,  H01L23/50 ,  H01L23/5386

Abstract: In one embodiment, an apparatus includes a connecting member configured for positioning on an upper surface of an integrated circuit package and a cable comprising a first end attached to the connecting member and a second end configured for electrically coupling with a power supply component. The connecting member is operable to position the cable for connection to the upper surface of the integrated circuit package to deliver power from the power supply component to the integrated circuit package with the power supply component and the integrated circuit package mounted on an upper surface of a printed circuit board. A method is also disclosed herein.