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公开(公告)号：US09810662B1
公开(公告)日：2017-11-07
申请号：US15406809
申请日：2017-01-16
发明人： Chao-Ching Yu , Lin-Ta Chung , Hsi-Ying Yuan , Ke-Pan Liao
IPC分类号： G01N27/414 , H01L21/76 , H01L29/772 , H01L29/00 , H01L21/70 , G01N27/00
CPC分类号： G01N27/4145 , B01L3/502707 , B01L3/502715 , B01L2200/027 , B01L2300/0636 , B01L2300/0645 , B01L2300/0816 , B01L2300/0887 , G01N27/00 , G01N33/48707 , H01L21/70 , H01L21/76 , H01L29/00 , H01L29/772
摘要： The present invention provides a structure for integrating microfluidic devices and electrical biosensors, including: a substrate for carrying an electrical biosensor; a microfluidic channel layer for providing at least a fluid to flow; a cover member for the inflow and outflow of the at least a fluid, and an electrical biosensor, having a biosensing layer and mounted to the cover member in a flip-chip manner; wherein the fluid flows into an inlet, passes the electrical biosensor for sensing and flows out through a fluid outlet.
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公开(公告)号：US20180166390A1
公开(公告)日：2018-06-14
申请号：US15374866
申请日：2016-12-09
发明人： Chao-Ching Yu , Lin-Ta Chung , Hsi-Ying Yuan , Tung-Chuan Wang
IPC分类号： H01L23/538 , H01L23/31 , H01L23/544 , H01L21/768 , H01L21/52 , H01L21/56 , G06K9/00
CPC分类号： H01L23/5389 , G06K9/00053 , H01L21/52 , H01L21/565 , H01L23/3128 , H01L23/5384 , H01L23/544 , H01L24/18 , H01L24/24 , H01L25/065 , H01L2223/54426 , H01L2224/16225 , H01L2224/18 , H01L2224/48091 , H01L2224/48227 , H01L2924/00014
摘要： Provided is a planar package structure and its manufacturing method. The planar package structure totally packages a die to make the die unexposed and to protect the die from impact or scratch. Further, at least one conductive pad of the die is electronically connected to an external electronic circuit through a plurality of wiring patterns and through holes filled with conductive materials. Then, the die may be connected to the external electronic circuit and may be protected from impact or scratch.
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