摘要:
Proposed is a universal gripping and suction chuck for use as an interchangeable end effector of a robot arm of a robotic station capable of picking up, transporting, and handling objects having colors and outlines. The chuck housing contains elements of a vacuum system for holding the object by vacuum suction force, a vortex system for holding the objects in a non-contact manner in a state of levitation, and a mechanical edge gripper. The vacuum system, the vortex system, and the mechanical edge gripper can be selectively activated by commands from the central processing system that receives a signal recognition signal, object presence/absence signal and/or object approaching signal from respective sensors and depending on the type of the object recognized by the respective sensor. As a result, the chuck can pick up and handle such different objects as solid semiconductor wafer, paper or fabric interleaves, or small-diameter rings.
摘要:
The invention relates to an apparatus and method for measuring thickness and deviations from the thickness of very thin conductive coatings on various non-conductive substrates, or of very thin non-conductive coatings on conductive substrates. The apparatus consists of an inductive coil having specific parameters, an external AC generator operating on frequencies, e.g., from 50 MHz to 2.5 GHz, preferably from 100 MHz to 200 MHz, and a measuring instrument, such as an oscilloscope, voltmeter, etc. for measuring output of the sensor. The coil has miniature dimensions. The invention is based on the principle that inductive coil of the sensor, active resistance of the coil winding, inherent capacitance of the inductive coil (or a separate capacitor built into the sensor's circuit), and the aforementioned AC generator form a parallel oscillating circuit. The apparatus operates on very high resonance frequencies, preferably within the range of 100 to 200 MHz, at which a capacitive coupling is established between the coil of the oscillating circuit and the thin films being measured. By measuring the parameters of the resonance oscillating circuit, it becomes possible to measure film thickness below 500 Angstroms.
摘要:
Proposed is a universal gripping and suction chuck for use as an interchangeable end effector of a robot arm of a robotic station capable of picking up, transporting, and handling objects having colors and outlines. The chuck housing contains elements of a vacuum system for holding the object by vacuum suction force, a vortex system for holding the objects in a non-contact manner in a state of levitation, and a mechanical edge gripper. The vacuum system, the vortex system, and the mechanical edge gripper can be selectively activated by commands from the central processing system that receives a signal recognition signal, object presence/absence signal and/or object approaching signal from respective sensors and depending on the type of the object recognized by the respective sensor. As a result, the chuck can pick up and handle such different objects as solid semiconductor wafer, paper or fabric interleaves, or small-diameter rings.
摘要:
Devices and methods of the invention can be used in many industries, including: utilities, agriculture, food, textile, pharmaceutical, photovoltaic and semiconductor, medical devices, chemical and petro-chemical, material science, and defense, where monitoring and/or analysis of various properties of materials are desired.
摘要:
A wafer container made from a polymer material with inner walls of the container coated with a thin easily washable wear-resistant and scratch-resistant barrier layer of SiO2 for preventing penetration of products of diffusion of polymers, such as free radicals, into the interior space of the carrier that retains a wafer. The SiO2 coatings on the walls of the container are applied by the PECVD process. The wafer container of the invention can be manufactured at low cost by molding it from a less expensive and lower grade polymer.
摘要:
An industrial wedge-type gripper mechanism for gripping or releasing objects that has a housing with a piston of a pneumatic cylinder moveable in the housing in longitudinal direction of the housing and a plurality of gripper jaw holders that slide in the housing in a radial or transverse direction and that support the gripper jaws. The gripper jaw holders have inclined slots, and the piston of the pneumatic cylinder is associated with a member that supports rolling bearings rolling and sliding in the inclined slots so that with reciprocations of the piston the rolling bearings exert a camming or wedging action on the walls of the inclined slots and thus cause the gripper jaw holders and thus the gripper jaws to perform gripping or releasing action on the objects.
摘要:
Devices and methods of the invention can be used in many industries, including, but not limited to, utilities, agriculture, food, textile, pharmaceutical, photovoltaic and semiconductor, medical devices, chemical and petro-chemical, material science, and defense, where monitoring and/or analysis of various properties of materials are desired. Sensors and methods of using same are provided for measuring at least one impedance of an object under test (or a tested object) at a predetermined frequency and/or a predetermined frequency range, particularly where resonance conditions are provided for such measurement.
摘要:
A wafer gripping mechanism of the invention comprises a thin flat body having one linearly moveable and rotating finger for gripping an edge of the flat object and a pair of soft withdrawable object supporting pads. A distinguishing feature of the mechanism of the invention is that the wafer supporting pads are withdrawable for placing the pads into position where they do not project beyond the outlines of the external surface of the insertable portion of the gripper. The absence of elements projecting from the surface of the gripper portion insertable into narrow spaces with high speed protects the gripping mechanism, wafer, chuck, etc. from damage due to possible collision. All the drive and actuation mechanisms that are used for rotation and axial movement of the gripping finger, as well as for rotation of the withdrawable pads are enclosed in a thin hollow casing made from a thin and light-weight sheet metal.
摘要:
The system of the invention for measuring characteristics of thin conductive and non-conductive material, such as bulk material or films, is based on the use of a resonance oscillating circuit that incorporates at least two components selected from the group consisting of an inductive coil and a capacitor, which in combination form a sensor that could be approached close to the surface to be measured. The measurement of the film or material characteristics, such as film resistance (film thickness) or a dielectric constant (film thickness) of a non-conductive material, is based on the principle that the sensor is approached to the measured surface at a distance, at which the inductance and capacitance of the sensor generate in the measured material a virtual coil and an additional capacitance, which strongly depend on the characteristics of the measured material. As the sensor approached towards the surface to be measured, the sensor-material system generates a series of resonances having different values of power. One of these resonances can be defined as the so-called full resonance, which is characterized by the maximum value of the power, and hence provides the most accurate measurement and can be used for precisely determining the measurement distance. By comparing the results of measurements with those known from measuring the precalibrated films or materials under the same conditions, it becomes possible to determine the target characteristics of the films or materials.
摘要:
The invention describes an apparatus for preventing gripping of objects having wrong dimensions or orientation. The apparatus comprises a part handler, e.g., a holder for parts to be treated in a chemical reactor, where the parts has to be transferred from a working position to a temporary storage. The holder may have different shapes, e.g., rectangular, elliptical, or circular, and is provided with positioning openings or recesses for engagement with pins or semispherical elements on the engaging surface of the part handler. The apparatus is provided with at least two through beam optical sensor units with adjustable divergence of the light beams emitted from the light emitting to the light-receiving element. The sensor units are located near the edge area of the holder. Position of the holder for aligning with the part handler is determined by combined interaction of the holder edge with the sensor units so that, depending on overlapping of one or two sensors and on the position of the overlapped zone, the apparatus determines whether or not the holder is aligned with the part handler or the gripping operation has to be rejected. In another embodiment the apparatus is equipped with three optical sensors, which simplify the control operation.