公开(公告)号：US20220064474A1

公开(公告)日：2022-03-03

申请号：US17004114

申请日：2020-08-27

Applicant: Applied Materials, Inc.

Inventor： Srobona SEN ,  Tapashree Roy ,  Prerna Sonthalia Goradia ,  Robert Jan Visser

IPC: C09D127/18 ,  C09D183/08

Abstract: Embodiments described herein relate to flat optical devices and encapsulation materials for flat optical devices. One or more embodiments include a substrate having a first arrangement of a first plurality of pillars formed thereon. The first arrangement of the first plurality of pillars includes pillars having a height h and a lateral distance d. The first arrangement of the first plurality of pillars includes a gap g corresponding to a distance between adjacent pillars of the first plurality of pillars. An aspect ratio of the gap g to the height h is between about 1:1 and about 1:20. A first adhesion-promoting material is disposed over the first arrangement of the first plurality of pillars. A first encapsulation layer is disposed over the first adhesion-promoting material. The first encapsulation layer fills the gap g between adjacent pillars of the first plurality of pillars. The first encapsulation layer includes a fluoropolymer.

公开(公告)号：US20250093780A1

公开(公告)日：2025-03-20

申请号：US18885477

申请日：2024-09-13

Applicant: Applied Materials, Inc.

Inventor： Amit Kumar ROY ,  Srobona SEN ,  Kankona S. ROY ,  Xiaopei DENG ,  Gopi Chandran Ramachandran ,  Robert VISSER

IPC: G03F7/11 ,  G03F7/16

Abstract: Embodiments of the present disclosure generally relate to optical devices, and more specifically, protective coatings for optical devices and methods for preparing protective coatings on optical devices and other devices. In one or more embodiments, a method for protecting a photoresist on a workpiece is provided and includes depositing a photoresist layer on a first surface of a substrate, and depositing a protective coating on the photoresist layer disposed on the first surface, wherein the protective coating contains a water-soluble polymeric material. Thereafter, the method includes exposing a second surface of the substrate to one or more fabrication processes, where the first surface is covered by the photoresist layer and the protective coating, and the second surface is uncovered. Thereafter, the method further includes removing the protective coating by at least partially dissolving the water-soluble polymeric material with a removal solution containing water or an aqueous solution.

公开(公告)号：US20240145242A1

公开(公告)日：2024-05-02

申请号：US18384688

申请日：2023-10-27

Applicant: Applied Materials, Inc.

Inventor： Geetika BAJAJ ,  Srobona SEN ,  Xuebin LI ,  Joe MARGETIS ,  Provas PAL ,  Gopi Chandran RAMACHANDRAN

IPC: H01L21/02 ,  H01L21/3205

CPC classification number: H01L21/02642 ,  H01L21/02052 ,  H01L21/02532 ,  H01L21/32055

Abstract: Implementations described herein generally relate to processes for the fabrication of semiconductor devices in which a blocking layer of molecules is used to achieve selective epitaxial deposition. In one implementation, a method of processing a mixed-surface substrate comprising an exposed dielectric material and an exposed silicon-based material is provided. The method comprises depositing a blocking layer on the exposed dielectric material and epitaxially and selectively depositing a silicon-containing material layer on the exposed silicon-based material at a temperature of 400 degrees Celsius or greater. The method further involves removing the blocking layer from the dielectric material.