公开(公告)号：US20160002780A1

公开(公告)日：2016-01-07

申请号：US14770390

申请日：2013-03-15

Applicant: Applied Materials, Inc.

Inventor： Oliver HEIMEL ,  Ralph LINDENBERG ,  Haraldö WURSTER ,  Claus ZENGEL

IPC: C23C16/458 ,  C23C14/50

CPC classification number: C23C16/4587 ,  C23C14/50

Abstract: A carrier for supporting a substrate in a substrate processing chamber for vacuum processing is described. The carrier includes a substrate fixation assembly, wherein the substrate fixation assembly includes one or more fixation units; a first fixation dement having a first surface configured for contacting a first substrate surface of the substrate; a second fixation element having a second surface configured for contacting a second substrate surface of the substrate; and a force dement for providing a fixation force for the substrate with at least one of the first and the second fixation element.

Abstract translation: 描述了用于在用于真空处理的基板处理室中支撑基板的载体。 载体包括基底固定组件，其中基底固定组件包括一个或多个固定单元; 第一固定物，其具有构造成用于接触所述基底的第一基底表面的第一表面; 第二固定元件，其具有被配置用于接触所述基板的第二基板表面的第二表面; 以及用于利用所述第一和第二固定元件中的至少一个为所述基板提供固定力的力部件。

公开(公告)号：US20250136386A1

公开(公告)日：2025-05-01

申请号：US18928578

申请日：2024-10-28

Applicant: Applied Materials, Inc.

Inventor： Upendra UMMETHALA ,  Kaushik ALAYAVALLI ,  Ralph LINDENBERG ,  Tuan Anh NGUYEN ,  Amit HATTANGADI

IPC: B65G47/26 ,  B65G47/90 ,  H02N13/00

Abstract: A cluster tool for fabricating substrates includes a factory interface; a first processing mainframe coupled to the factory interface, including: a processing chamber monolithic structure including four processing chambers in the same housing; four load locks coupled to the processing chamber monolithic structure, each load lock including a heater assembly configured to increase the temperature of a substrate disposed in the load lock; and a swapper assembly disposed between the four load locks and the processing chamber monolithic structure, wherein the swapper assembly includes four swappers, each swapper configured to swap substrates between one processing chamber and one load lock along a linear trajectory.

公开(公告)号：US20210233783A1

公开(公告)日：2021-07-29

申请号：US15734539

申请日：2018-06-25

Applicant: LINDENBERG Ralph ,  Applied Materials, Inc.

Inventor： Ralph LINDENBERG

IPC: H01L21/673 ,  H01L21/677 ,  H01L21/687

Abstract: A carrier configured for holding and transporting a substrate in a transport direction in a vacuum processing system and a method for carrying a substrate in a transport direction during a deposition process in a deposition chamber with a carrier is described. The carrier includes two side edges opposing each other, a joining structure arranged between the side edges, having a flat structure comprising a plurality of apertures, each exposing the same substrate and an aperture ratio of at least 0.5, and a holding assembly configured for holding the substrate adjacent to the joining structure.