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公开(公告)号:US20250033156A1
公开(公告)日:2025-01-30
申请号:US18784593
申请日:2024-07-25
Applicant: Applied Materials, Inc.
Inventor: Upendra UMMETHALA , Praveen CHORAGUDI , Kaushik ALAYAVALLI , Bhawesh AGRAWAL
Abstract: A swapper assembly of a cluster tool includes a housing, at least two swappers, and a motor assembly. The at least two swappers are at least partially disposed within and rotatable relative to the housing. Each swapper includes a body, a first arm, and a second arm. The first arm and second arm are rotatable relative to the body. The motor assembly includes at least one motor, and the motor assembly is configured to operate the at least two swappers simultaneously to change the position of the first arm and second arm.
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公开(公告)号:US20250038021A1
公开(公告)日:2025-01-30
申请号:US18752292
申请日:2024-06-24
Applicant: Applied Materials, Inc.
Inventor: Upendra UMMETHALA , Tuan Anh NGUYEN , Kaushik ALAYAVALLI
IPC: H01L21/67 , H01L21/677 , H01L21/687
Abstract: A cluster tool includes: a factory interface including a first robot with an end effector; a first processing mainframe coupled to the factory interface, including: a first processing chamber; a first load lock including a first opening facing the factory interface configured to receive the end effector of the first robot, the first load lock further including a first slit valve configured to selectively open and close the first opening; at least one first LCF sensor disposed between the factory interface and the first slit valve; and a swapper assembly disposed between the first load lock and the first processing chamber, wherein the swapper assembly includes a first swapper configured to swap substrates between the first processing chamber and the first load lock along a first trajectory.
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公开(公告)号:US20250136386A1
公开(公告)日:2025-05-01
申请号:US18928578
申请日:2024-10-28
Applicant: Applied Materials, Inc.
Inventor: Upendra UMMETHALA , Kaushik ALAYAVALLI , Ralph LINDENBERG , Tuan Anh NGUYEN , Amit HATTANGADI
Abstract: A cluster tool for fabricating substrates includes a factory interface; a first processing mainframe coupled to the factory interface, including: a processing chamber monolithic structure including four processing chambers in the same housing; four load locks coupled to the processing chamber monolithic structure, each load lock including a heater assembly configured to increase the temperature of a substrate disposed in the load lock; and a swapper assembly disposed between the four load locks and the processing chamber monolithic structure, wherein the swapper assembly includes four swappers, each swapper configured to swap substrates between one processing chamber and one load lock along a linear trajectory.
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