公开(公告)号：US20250014878A1

公开(公告)日：2025-01-09

申请号：US18218579

申请日：2023-07-05

Applicant: Applied Materials, Inc.

Inventor： Andreas SCHMID ,  Sahiti NALLAGONDA ,  Peter MURAOKA ,  Michael T. NICHOLS ,  Denis Martin KOOSAU ,  Stephen D. PROUTY ,  Sunil SRINIVASAN ,  Pranav BADOLE

IPC: H01J37/34

Abstract: Embodiments described herein generally related to a substrate processing apparatus. In one embodiment, a process kit for a substrate processing chamber disclosed herein. The process kit includes a ring having a first ring component and a second ring component, a sliding ring, and an actuating mechanism. The first ring component is interfaced with the second ring component such that the second ring component is movable relative to the first ring component forming a gap therebetween. The sliding ring is positioned beneath the ring and contacts a bottom surface of the second ring component. A top surface of the sliding ring contacts the second ring component. The actuating mechanism is interfaced with the bottom surface of the sliding ring. The actuating mechanism is configured to actuate the sliding ring such that the gap between the first ring component and the second ring component varies.

公开(公告)号：US20240178035A1

公开(公告)日：2024-05-30

申请号：US18435175

申请日：2024-02-07

Applicant: Applied Materials, Inc.

Inventor： Andrew MYLES ,  Denis Martin KOOSAU ,  Peter MURAOKA ,  Phillip CRIMINALE

IPC: H01L21/68 ,  H01J37/32 ,  H01L21/687

CPC classification number: H01L21/68 ,  H01J37/32642 ,  H01J37/3288 ,  H01J37/32908 ,  H01J37/32935 ,  H01J37/3299 ,  H01L21/681 ,  H01L21/68721 ,  H01L21/68735 ,  H01L21/68742

Abstract: Apparatus and methods for calibrating a height-adjustable edge ring are described herein. In one example, a calibration jig for positioning an edge ring relative to a reference surface is provided that includes a transparent plate, a plurality of sensors coupled to a first side of the transparent plate, and a plurality of contact pads coupled to an opposing second side of the transparent plate.

公开(公告)号：US20210254957A1

公开(公告)日：2021-08-19

申请号：US17161271

申请日：2021-01-28

Applicant: Applied Materials, Inc.

Inventor： Sathyendra GHANTASALA ,  Leonid DORF ,  Evgeny KAMENETSKIY ,  Peter MURAOKA ,  Denis M. KOOSAU ,  Rajinder DHINDSA ,  Andreas SCHMID

IPC: G01B7/06 ,  H01L21/67 ,  H01L21/687 ,  H01J37/32

Abstract: Disclosed herein is a method and apparatus for controlling surface characteristics by measuring capacitance of a process kit ring. The method includes interfacing a ring with a jig assembly for measuring capacitance in at least a first location of the ring. The ring has that includes a top surface, a bottom surface, and an inner surface opposite an outer surface. At least the bottom surface has an external coating placed thereon. The method further includes contacting a measuring device to the first location on the outer surface proximate the bottom surface. The measuring device contacts an opening in the external coating to the body. The measuring device contacts a first conductive member that is electrically coupled to the ring. A capacitance is measured on the measuring device. The capacitance across the top surface is measured.

公开(公告)号：US20190385880A1

公开(公告)日：2019-12-19

申请号：US16407520

申请日：2019-05-09

Applicant: Applied Materials, Inc.

Inventor： Andrew MYLES ,  Denis M. KOOSAU ,  Peter MURAOKA ,  Phillip A. CRIMINALE

IPC: H01L21/68 ,  H01L21/687 ,  H01L23/544

Abstract: Apparatus and methods for calibrating a height-adjustable edge ring are described herein. In one example, a calibration jig for positioning an edge ring relative to a reference surface is provided that includes a transparent plate, a plurality of sensors coupled to a first side of the transparent plate, and a plurality of contact pads coupled to an opposing second side of the transparent plate.

公开(公告)号：US20240429089A1

公开(公告)日：2024-12-26

申请号：US18212672

申请日：2023-06-21

Applicant: Applied Materials, Inc.

Inventor： Peter MURAOKA ,  Sumanth BANDA ,  Andreas SCHMID ,  Sunil SRINIVASAN ,  Paul Z. WIRTH

IPC: H01L21/687 ,  G05B15/02 ,  H01J37/32 ,  H01L21/3065

Abstract: Embodiments described herein generally related to a substrate processing chamber and a method of processing substrate in a processing chamber. In one embodiment, a method of using a process kit for a substrate processing chamber disclosed herein. The method begins by positioning the substrate on a substrate support disposed in the substrate processing chamber. A plasma is formed above the substrate and a tilt and height of an edge ring is adjusted with a controller. The controller is coupled to a movement assembly having one of three linear actuators for tilting a sliding ring interfaced with the edge ring to change a direction of ions at one edge of the substrate.

公开(公告)号：US20230280150A1

公开(公告)日：2023-09-07

申请号：US18317776

申请日：2023-05-15

Applicant: Applied Materials, Inc.

Inventor： Sathyendra GHANTASALA ,  Leonid DORF ,  Evgeny KAMENETSKIY ,  Peter MURAOKA ,  Denis Martin KOOSAU ,  Rajinder DHINDSA ,  Andreas SCHMID

IPC: G01B7/06 ,  H01L21/67 ,  H01J37/32 ,  H01L21/687

CPC classification number: G01B7/08 ,  H01L21/67069 ,  H01J37/32642 ,  H01L21/68721 ,  H01J2237/24564

Abstract: Disclosed herein is a method and apparatus for controlling surface characteristics by measuring capacitance of a process kit ring. The method includes interfacing a ring with a jig assembly for measuring capacitance in at least a first location of the ring. The ring has that includes a top surface, a bottom surface, and an inner surface opposite an outer surface. At least the bottom surface has an external coating placed thereon. The method further includes contacting a measuring device to the first location on the outer surface proximate the bottom surface. The measuring device contacts an opening in the external coating to the body. The measuring device contacts a first conductive member that is electrically coupled to the ring. A capacitance is measured on the measuring device. The capacitance across the top surface is measured.