公开(公告)号：US20180076010A1

公开(公告)日：2018-03-15

申请号：US15659617

申请日：2017-07-26

Applicant: Applied Materials, Inc.

Inventor： Gangadhar SHEELAVANT ,  Cariappa Achappa BADUVAMANDA ,  Kaushik VAIDYA ,  Bopanna Ichettira VASANTHA

IPC: H01J37/32 ,  H01J37/34

CPC classification number: H01J37/32853 ,  B33Y80/00 ,  C23C16/4404 ,  C23C16/45565 ,  C23C16/4581 ,  H01J37/32477 ,  H01J37/3488

Abstract: A chamber component for a processing chamber is disclosed herein. In one embodiment, a chamber component for a processing chamber has a base component body. The base component body has an exterior surface configured to face a processing environment of the processing chamber. A textured skin is conformable to the exterior surface. The textured skin has a first side configured to be disposed against the exterior surface and a second side facing away from the first side. The second side has a plurality of engineered features configured to enhance adhesion of material deposited on the textured skin during use of the processing chamber.

公开(公告)号：US20220076971A1

公开(公告)日：2022-03-10

申请号：US17013339

申请日：2020-09-04

Applicant: Applied Materials, Inc.

Inventor： Kirankumar Neelasandra SAVANDAIAH ,  Nitin Bharadwaj SATYAVOLU ,  Kaushik VAIDYA ,  Bhaskar PRASAD ,  Srinivasa Rao YEDLA ,  Aju PHILIP ,  Thomas BREZOCZKY

IPC: H01L21/67 ,  H01L21/677 ,  H01L21/68

Abstract: Embodiments disclosed herein relate to an apparatus for aligning and securing a transferable substrate support. In one embodiment, a substrate support assembly includes a transferable substrate support. The transferable substrate support includes one or more first separable contact terminals disposed on a surface of the transferable substrate support. Each of the first separable contact terminals includes a detachable connection region and an electrical connection region, and the electrical connection region is coupled to an electrical element disposed within the transferable substrate support. The detachable connection region of each of the one or more first separable contact terminals is configured to detachably connect and disconnect with a corresponding pin of one or more pins of a supporting pedestal by repositioning the supporting pedestal relative to the transferable substrate support in a first direction.

公开(公告)号：US20170260618A1

公开(公告)日：2017-09-14

申请号：US15451995

申请日：2017-03-07

Applicant: Applied Materials, Inc.

Inventor： Laksheswar KALITA ,  Prerna A. GORADIA ,  Geetika BAJAJ ,  Yogita PAREEK ,  Yixing LIN ,  Dmitry LUBOMIRSKY ,  Ankur KADAM ,  Bipin THAKUR ,  Kevin A. PAPKE ,  Kaushik VAIDYA

IPC: C23C8/12 ,  C22F1/16 ,  C23C8/16 ,  C25D3/54 ,  C25D5/50

CPC classification number: C23C8/12 ,  C22F1/16 ,  C23C8/02 ,  C23C8/16 ,  C25D3/54 ,  C25D5/18 ,  C25D5/48 ,  C25D5/50 ,  C25D11/08 ,  C25D11/34

Abstract: The present disclosure generally relates to methods of electro-chemically forming yttria or yttrium oxide. The methods may include the optional preparation of a an electrochemical bath, the electrodepositon of yttria or yttrium oxide onto a substrate, removal of solvent form the surface of the substrate, and post treatment of the substrate having the electrodeposited yttria or yttrium oxide thereon.

公开(公告)号：US20170189965A1

公开(公告)日：2017-07-06

申请号：US15398787

申请日：2017-01-05

Applicant: Applied Materials, Inc.

Inventor： Kaushik VAIDYA ,  Simon YAVELBERG ,  Cariappa Achappa BADUVAMANDA

IPC: B22F7/00 ,  B28B1/00 ,  B33Y10/00 ,  B23K26/00 ,  B33Y70/00 ,  B22F3/105 ,  B23K26/342 ,  B23K26/70 ,  B29C67/00 ,  B33Y50/02

CPC classification number: B22F7/008 ,  B22F3/008 ,  B22F3/1055 ,  B22F2003/1057 ,  B22F2301/052 ,  B22F2301/058 ,  B22F2301/30 ,  B22F2302/253 ,  B22F2999/00 ,  B23K26/0876 ,  B23K26/1224 ,  B23K26/125 ,  B23K26/127 ,  B23K26/144 ,  B23K26/147 ,  B23K26/342 ,  B23K2103/04 ,  B23K2103/08 ,  B23K2103/10 ,  B23K2103/12 ,  B23K2103/15 ,  B23K2103/16 ,  B23K2103/52 ,  B28B1/001 ,  B29C64/153 ,  B29C64/336 ,  B29K2105/251 ,  B33Y10/00 ,  B33Y70/00 ,  Y02P10/295 ,  B22F7/02 ,  B22F1/025 ,  B22F1/02 ,  B22F1/0062

Abstract: Implementations described herein generally relate to additive manufacturing. More particularly, implementations disclosed herein relate to formulations and processes for forming articles via a three-dimensional printing (or 3D printing) process. In one implementation, a method of additive manufacturing is provided. The method comprises dispensing a first layer of a feed material over a platen. The feed material includes a powder mixture comprising a plurality of particulates comprising a first material and a plurality of particulates comprising a second material different from the first material. The method further comprises directing a laser beam to heat the feed material at locations specified by data stored in a computer readable medium. The laser beam heats the feed material to a temperature sufficient to fuse at least the second material.