公开(公告)号：US20230290614A1

公开(公告)日：2023-09-14

申请号：US17690644

申请日：2022-03-09

Applicant: Applied Materials, Inc.

Inventor： Dinkesh HUDERI SOMANNA ,  Ala MORADIAN ,  Colin John DICKINSON ,  Manjunath SUBBANNA

IPC: H01J37/32 ,  C23C14/34

CPC classification number: H01J37/32477 ,  C23C14/34 ,  H01J2237/332

Abstract: Embodiments of heat shield assemblies for a processing chamber are provided herein. In some embodiments, a heat shield assembly for a processing chamber includes: a first shield comprising a circular plate; a second shield coupled to the first shield and in a parallel configuration with the first shield, wherein the second shield has an outer diameter greater than an outer diameter of the first shield and the second shield includes a central opening having a diameter smaller than an outer diameter of the first shield; and a third shield coupled to and in a parallel configuration with the second shield, wherein an outer diameter of the third shield is greater than the diameter of the central opening of the second shield.

公开(公告)号：US20220389566A1

公开(公告)日：2022-12-08

申请号：US17337528

申请日：2021-06-03

Applicant: Applied Materials, Inc.

Inventor： Robert HARTWIG ,  Dinkesh HUDERI SOMANNA ,  Brian T. WEST

IPC: C23C14/54 ,  C23C14/34 ,  C23C14/50 ,  H01J37/32 ,  F28F27/02

Abstract: Methods and apparatus for processing a substrate are provided herein. For example, a cooling apparatus for use with a substrate support of a processing chamber comprises a heat exchanger, a manifold assembly comprising a first input configured to connect to an output of the heat exchanger, a second input configured to connect to a first coolant supply configured to supply a first coolant, a first output configured to connect to the substrate support of the processing chamber, and a second output configured to connect to an input of the heat exchanger, a gas input configured to connect to a second coolant supply that is configured to supply a second coolant that is different from the first coolant to the substrate support, a first three-way valve connected between the first output of the manifold assembly and the substrate support and connected between the gas input and the substrate support, and a controller configured to control supplying one of the first coolant or the second coolant during operation.

公开(公告)号：US20200350195A1

公开(公告)日：2020-11-05

申请号：US16447518

申请日：2019-06-20

Applicant: Applied Materials, Inc.

Inventor： Brian T. WEST ,  Soundarrajan JEMBULINGAM ,  Dinkesh HUDERI SOMANNA

IPC: H01L21/683 ,  H01L21/67 ,  H02H7/20

Abstract: Embodiments described herein relate to a substrate support and techniques for controlling a temperature of the same. The substrate support includes a heating element and an over temperature switch disposed therein. The heating element heats the substrate support and a substrate disposed thereon. The over temperature switch controls a temperature of the heating element and the substrate support. The over temperature switch is operable to switch states in response to a temperature of the substrate support exceeding a predefined temperature.

公开(公告)号：US20240412954A1

公开(公告)日：2024-12-12

申请号：US18208736

申请日：2023-06-12

Applicant: Applied Materials, Inc.

Inventor： Dinkesh HUDERI SOMANNA ,  Dan DEYO ,  Vishwas Kumar PANDEY ,  Ala MORADIAN

IPC: H01J37/32 ,  C23C14/00 ,  C23C14/35 ,  C23C14/50 ,  C23C14/54

Abstract: Embodiments of process chambers having cooling plate are provided herein. In some embodiments, a process chamber includes: a chamber body defining an interior volume therein, the chamber body having a view port side having an opening configured as a view port, a pump side having a pump port, and a shutter side opposite the view port side, wherein the port view side, the pump side, and the shutter side are all different sides of the chamber body; a first cooling plate coupled to the view port side and having one or more first coolant channels; a second cooling plate coupled to the pump side and having one or more second coolant channels; and a third cooling plate coupled to the shutter side and having one or more third coolant channels.

公开(公告)号：US20230128611A1

公开(公告)日：2023-04-27

申请号：US17508493

申请日：2021-10-22

Applicant: Applied Materials, Inc.

Inventor： Vishwas Kumar PANDEY ,  Colin John DICKINSON ,  Dinkesh HUDERI SOMANNA ,  Ala MORADIAN ,  Kartik Bhupendra SHAH

IPC: H01J37/34 ,  H01J37/32 ,  C23C14/50 ,  C23C14/34

Abstract: An adapter for a deposition chamber includes an adapter body extending longitudinally about a central axis between an upper side and lower side opposite the upper side. The adapter body has a central opening about the central axis. The adapter body has a radially outer portion having a connection surface on the lower side and a radially inner portion having a coolant channel and a stepped surface on the lower side. At least a portion of the coolant channel is spaced radially inwardly from a radially inner end of the connection surface. At least the portion of the coolant channel is disposed longitudinally below the connection surface between the connection surface and the stepped surface.