Invention Application
- Patent Title: Apparatus for Temperature Control in a Substrate Processing Chamber
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Application No.: US17508493Application Date: 2021-10-22
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Publication No.: US20230128611A1Publication Date: 2023-04-27
- Inventor: Vishwas Kumar PANDEY , Colin John DICKINSON , Dinkesh HUDERI SOMANNA , Ala MORADIAN , Kartik Bhupendra SHAH
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Main IPC: H01J37/34
- IPC: H01J37/34 ; H01J37/32 ; C23C14/50 ; C23C14/34

Abstract:
An adapter for a deposition chamber includes an adapter body extending longitudinally about a central axis between an upper side and lower side opposite the upper side. The adapter body has a central opening about the central axis. The adapter body has a radially outer portion having a connection surface on the lower side and a radially inner portion having a coolant channel and a stepped surface on the lower side. At least a portion of the coolant channel is spaced radially inwardly from a radially inner end of the connection surface. At least the portion of the coolant channel is disposed longitudinally below the connection surface between the connection surface and the stepped surface.
Public/Granted literature
- US12183559B2 Apparatus for temperature control in a substrate processing chamber Public/Granted day:2024-12-31
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