公开(公告)号：US20240222093A1

公开(公告)日：2024-07-04

申请号：US18093138

申请日：2023-01-04

Applicant: Applied Materials, Inc.

Inventor： Yaoying ZHONG ,  Siew Kit HOI ,  Bridger Earl HOERNER

IPC: H01J37/32 ,  C23C14/14 ,  C23C14/34 ,  C23C14/50 ,  C23C14/54

CPC classification number: H01J37/32724 ,  C23C14/14 ,  C23C14/34 ,  C23C14/50 ,  C23C14/54 ,  H01J2237/002 ,  H01J2237/2007 ,  H01J2237/24585 ,  H01J2237/332

Abstract: Methods, systems, and apparatus for controlling substrate temperature include: monitoring a temperature in each zone of a plurality of zones of a substrate support, the substrate support having a support surface for supporting a substrate, wherein the support surface is opposed to a sputtering target for depositing material onto the substrate; depositing material from the sputtering target on the substrate; and independently controlling fluid flowing in a plurality of separate fluid channels in the substrate support, each fluid channel corresponding to one zone of the plurality of zones, wherein fluid flow is controlled based on a target life and the temperature in each zone.

公开(公告)号：US20240068086A1

公开(公告)日：2024-02-29

申请号：US18074363

申请日：2022-12-02

Applicant: Applied Materials, Inc.

Inventor： Sundarapandian Ramalinga Vijayalakshmi REDDY ,  Kirankumar Neelasandra SAVANDAIAH ,  Junqi WEI ,  Bridger Earl HOERNER ,  Kelvin Tai Ming BOH ,  Madan Kumar SHIMOGA MYLARAPPA

IPC: C23C14/34

CPC classification number: C23C14/3414

Abstract: Target assemblies for PVD chambers are provided herein. In some embodiments, a target assembly for a PVD chamber includes: a backing plate; and a target coupled to the backing plate and having a substrate facing surface opposite the backing plate, wherein a peripheral portion of the target includes an angled surface extending radially outward and toward the backing plate, wherein an annular portion of the angled surface has a surface roughness greater than a surface roughness of a remainder of the substrate facing surface of the target.

公开(公告)号：US20240222198A1

公开(公告)日：2024-07-04

申请号：US18093139

申请日：2023-01-04

Applicant: Applied Materials, Inc.

Inventor： Yaoying ZHONG ,  Siew Kit HOI ,  Bridger Earl HOERNER

IPC: H01L21/66 ,  H01L21/285

CPC classification number: H01L22/12 ,  H01L21/2855 ,  H01L22/26

Abstract: Methods and apparatus for controlling substrate temperature includes: measuring a substrate that has undergone a deposition process; analyzing measurements of the substrate to detect a defect of the substrate; and sending a feedback signal to modify a temperature control parameter of a temperature controller used in controlling a temperature of the substrate in the deposition process based on the analyzing if a defect is detected, and not sending a feedback signal to modify the temperature control parameter if a defect is not detected.

公开(公告)号：US20240218499A1

公开(公告)日：2024-07-04

申请号：US18093141

申请日：2023-01-04

Applicant: Applied Materials, Inc.

Inventor： Yaoying ZHONG ,  Siew Kit HOI ,  Bridger Earl HOERNER

IPC: C23C14/54 ,  C23C14/14 ,  C23C14/34 ,  C23C14/50 ,  G05D23/19

CPC classification number: C23C14/541 ,  C23C14/14 ,  C23C14/34 ,  C23C14/50 ,  G05D23/1931

Abstract: Methods and apparatus for controlling substrate temperature, comprising: monitoring a temperature in each zone of a plurality of zones of a substrate support, the substrate support having a support surface for supporting a substrate, wherein the support surface is opposed to a sputtering target for depositing material onto the substrate; depositing material from the sputtering target on a substrate; and independently controlling a plurality of heaters in the substrate support, each heater corresponding to one zone of the plurality of zones, wherein each heater is controlled based on a target life and the temperature in each zone.

公开(公告)号：US20230416906A1

公开(公告)日：2023-12-28

申请号：US17851620

申请日：2022-06-28

Applicant: Applied Materials, Inc.

Inventor： Yaoying ZHONG ,  Siew Kit HOI ,  John KLOCKE ,  Bridger Earl HOERNER

IPC: C23C14/54 ,  C23C16/52 ,  H01L21/66 ,  G06T7/00

CPC classification number: C23C14/54 ,  C23C16/52 ,  H01L22/12 ,  G06T7/0008 ,  G06T2207/30148

Abstract: Methods and apparatus for processing a substrate are provided herein. For example, a method comprises in a process chamber, processing a substrate in a presence of an electric field, subsequently capturing an image of the substrate, determining whether substrate arcing occurred based upon analysis of the captured image, and one of continuing processing of the substrate when no arcing is determined or stopping processing of the substrate when arcing is determined.