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1.发明授权公开(公告)号：US07299105B2
公开(公告)日：2007-11-20
申请号：US11030863
申请日：2005-01-06
Applicant: Andre Holfeld , Jan Raebiger , Lutz Herrmann
Inventor： Andre Holfeld , Jan Raebiger , Lutz Herrmann
IPC: G06F19/00
CPC classification number: H01L22/20 , H01L29/6659
Abstract: Methods and systems are disclosed that allow an adjustment of a product parameter, such as operating speed, of a circuit element, such as a field effect transistor, during the fabrication of the device. A manufacturing process downstream of a first controlled process is controlled by a superior control scheme in response to the measurement data of the first and second processes and on the basis of a sensitivity function, which describes the effect a variation of the product parameter generates in the measurement data. The superior control scheme may provide a compensated target value for the downstream process.
Abstract translation: 公开了在制造装置期间允许调整电路元件（例如场效应晶体管）的乘积参数（诸如工作速度）的方法和系统。 响应于第一和第二过程的测量数据并且基于灵敏度函数，通过优异的控制方案来控制第一受控过程下游的制造过程，该灵敏度函数描述了产品参数的变化在 测量数据。 优越的控制方案可以为下游过程提供补偿的目标值。
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2.发明申请公开(公告)号：US20050192700A1
公开(公告)日：2005-09-01
申请号：US11030863
申请日：2005-01-06
Applicant: Andre Holfeld , Jan Raebiger , Lutz Herrmann
Inventor： Andre Holfeld , Jan Raebiger , Lutz Herrmann
IPC: G06F19/00 , H01L21/336 , H01L21/66
CPC classification number: H01L22/20 , H01L29/6659
Abstract: Methods and systems are disclosed that allow an adjustment of a product parameter, such as operating speed, of a circuit element, such as a field effect transistor, during the fabrication of the device. A manufacturing process downstream of a first controlled process is controlled by a superior control scheme in response to the measurement data of the first and second processes and on the basis of a sensitivity function, which describes the effect a variation of the product parameter generates in the measurement data. The superior control scheme may provide a compensated target value for the downstream process.
Abstract translation: 公开了在制造装置期间允许调整诸如场效应晶体管之类的电路元件的产品参数（诸如工作速度）的方法和系统。 响应于第一和第二过程的测量数据并且基于灵敏度函数，通过优异的控制方案来控制第一受控过程下游的制造过程，该灵敏度函数描述了产品参数的变化在 测量数据。 优越的控制方案可以为下游过程提供补偿的目标值。
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3.发明申请Technique for enhancing accuracy of critical dimensions of a gate electrode by using characteristics of an ARC layer 失效通过使用ARC层的特性提高栅极的临界尺寸的精度的技术公开(公告)号：US20050048417A1
公开(公告)日：2005-03-03
申请号：US10813374
申请日：2004-03-30
Applicant: Jan Raebiger , Andre Holfeld
Inventor： Jan Raebiger , Andre Holfeld
CPC classification number: G03F7/40
Abstract: In an improved technique for adjusting an etch time of a resist trim process, additional measurement data representing an optical characteristic, such as the reflectivity of an anti-reflective coating, is used. Since the initial thickness of the resist mask features may significantly depend on the optical characteristics of the anti-reflective coating, the additional measurement data allow compensation for process variations more efficiently as compared to the conventional approach.
Abstract translation: 在用于调整抗蚀剂修整工艺的蚀刻时间的改进技术中，使用表示光学特性的附加测量数据，例如抗反射涂层的反射率。 由于抗蚀剂掩模特征的初始厚度可能显着取决于抗反射涂层的光学特性，所以与常规方法相比，附加测量数据可以更有效地补偿工艺变化。
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4.发明申请METHOD AND APPARATUS FOR DISPATCHING WORKPIECES TO TOOLS BASED ON PROCESSING AND PERFORMANCE HISTORY 有权基于加工和性能历史分配工具的工具的方法和装置公开(公告)号：US20100249967A1
公开(公告)日：2010-09-30
申请号：US12415258
申请日：2009-03-31
Applicant: Robert Barlovic , Uwe Schulze , Jan Raebiger , Joerg Weigang , Jens Busch , Rolf Seltmann
Inventor： Robert Barlovic , Uwe Schulze , Jan Raebiger , Joerg Weigang , Jens Busch , Rolf Seltmann
IPC: G06F17/00
CPC classification number: G05B19/41865 , G05B2219/31459 , G05B2219/32269 , Y02P90/20 , Y10T83/0457 , Y10T83/155 , Y10T483/1712
Abstract: Metrology data associated with a plurality of workpieces processed at a selected operation in the process flow including a plurality of operations is retrieved. A processing context associated with each of the workpieces is determined. The processing context identifies at least one previous tool used to perform an operation on the associated workpiece prior to the selected operation. A plurality of performance metrics is determined for a plurality of tools capable of performing the selected operation based on the metrology data. Each performance metric is associated with a particular tool and a particular processing context. A set of the performance metrics is identified for the plurality of tools having a processing context matching a processing context of a selected workpiece awaiting performance of the selected operation. The selected workpiece is dispatched for processing in a selected one of the plurality of tools based on the set of performance metrics.
Abstract translation: 检索与在包括多个操作的处理流程中的所选操作处理的多个工件相关联的计量数据。 确定与每个工件相关联的处理上下文。 处理上下文在所选择的操作之前识别用于对相关联的工件执行操作的至少一个先前的工具。 针对能够基于测量数据执行所选择的操作的多个工具确定多个性能度量。 每个性能度量与特定工具和特定的处理环境相关联。 针对具有与所选择的工件等待执行所选择的操作的所选择的工件的处理环境匹配的处理环境的多个工具识别出一组性能度量。 基于所述一组性能度量，在所述多个工具中选择的一个工具中调度所选择的工件以进行处理。
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5.发明授权Method and system for controlling the chemical mechanical polishing of substrates by calculating an overpolishing time and/or a polishing time of a final polishing step 失效通过计算最终抛光步骤的过度抛光时间和/或抛光时间来控制基板的化学机械抛光的方法和系统公开(公告)号：US07268000B2
公开(公告)日：2007-09-11
申请号：US10261612
申请日：2002-09-30
Applicant: Dirk Wollstein , Jan Raebiger , Gerd Marxsen
Inventor： Dirk Wollstein , Jan Raebiger , Gerd Marxsen
CPC classification number: B24B37/042 , B24B49/03
Abstract: A method and a controller for the chemical mechanical polishing (CMP) of substrates and, in particular, for the chemical mechanical polishing of metallization layers is disclosed. In a linear model of the CMP process, the erosion of the metallization layer to be treated is determined by the overpolish time and possibly by an extra polish time on a separate polishing platen for polishing the dielectric layer, wherein the CMP inherent characteristics are represented by sensitivity parameters derived empirically. Moreover, the control operation is designed so that even with a certain inaccuracy of the sensitivity parameters due to subtle process variations, a reasonable controller response is obtained.
Abstract translation: 公开了一种用于衬底的化学机械抛光（CMP）的方法和控制器，特别是用于金属化层的化学机械抛光。 在CMP工艺的线性模型中，要处理的金属化层的侵蚀由过度抛光时间决定，并且可能通过在用于抛光电介质层的单独抛光台上的额外抛光时间来确定，其中CMP固有特性由 灵敏度参数经验性地得出。 此外，控制操作被设计为使得即使由于微妙的处理变化而导致的灵敏度参数的一定的不精确性，也可以获得合理的控制器响应。
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Patent Agency Ranking
6.发明申请Method of operating an advanced process controller by dynamically adapting hierarchy levels 有权通过动态调整层次级别来操作高级过程控制器的方法公开(公告)号：US20060195213A1
公开(公告)日：2006-08-31
申请号：US11248562
申请日：2005-10-12
Applicant: Heiko Wagner , Jan Raebiger
Inventor： Heiko Wagner , Jan Raebiger
IPC: G06F19/00
CPC classification number: G05B19/41845 , G05B2219/35391 , G05B2219/45031 , Y02P90/16
Abstract: By providing a detailed hierarchical structure for an APC algorithm and by dynamically adapting a hierarchical level in this structure, an efficient utilization of controller data is ensured, while at the same time a large number of process conditions may be taken into consideration without requiring a re-design of the hierarchical structure.
Abstract translation: 通过为APC算法提供详细的层次结构，并且通过动态地适应该结构中的层次级别，确保了控制器数据的有效利用，同时可以考虑大量的处理条件而不需要重新生成 - 层次结构的设计。
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7.发明授权Technique for enhancing accuracy of critical dimensions of a gate electrode by using characteristics of an ARC layer 失效通过使用ARC层的特性提高栅极的临界尺寸的精度的技术公开(公告)号：US07041434B2
公开(公告)日：2006-05-09
申请号：US10813374
申请日：2004-03-30
Applicant: Jan Raebiger , André Holfeld
Inventor： Jan Raebiger , André Holfeld
CPC classification number: G03F7/40
Abstract: In an improved technique for adjusting an etch time of a resist trim process, additional measurement data representing an optical characteristic, such as the reflectivity of an anti-reflective coating, is used. Since the initial thickness of the resist mask features may significantly depend on the optical characteristics of the anti-reflective coating, the additional measurement data allow compensation for process variations more efficiently as compared to the conventional approach.
Abstract translation: 在用于调整抗蚀剂修整工艺的蚀刻时间的改进技术中，使用表示光学特性的附加测量数据，例如抗反射涂层的反射率。 由于抗蚀剂掩模特征的初始厚度可能显着取决于抗反射涂层的光学特性，所以与常规方法相比，附加测量数据可以更有效地补偿工艺变化。
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8.发明授权公开(公告)号：US06946411B2
公开(公告)日：2005-09-20
申请号：US10621663
申请日：2003-07-17
Applicant: Uwe Knappe , Jan Raebiger , Uwe Schulze , Rolf Seltmann
Inventor： Uwe Knappe , Jan Raebiger , Uwe Schulze , Rolf Seltmann
CPC classification number: G05B19/19 , G05B2219/45031 , G05B2219/49113 , Y10S438/907
Abstract: A technique is disclosed that allows alignment of substrates on a run-to-run basis by using the position data of one or more previously aligned substrates to determine a setpoint of a pre-alignment process for one or more subsequent substrates. The setpoint may also be determined on the basis of a predefined characteristic of the substrates to be aligned.
Abstract translation: 公开了一种技术，其允许通过使用一个或多个先前对准的基板的位置数据在运行基础上对准基板，以确定一个或多个后续基板的预对准过程的设定点。 也可以基于待对准的基板的预定特性来确定设定点。
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9.发明授权Method and apparatus for dispatching workpieces to tools based on processing and performance history 有权基于加工和性能历史将工件调度到工具的方法和装置公开(公告)号：US08155770B2
公开(公告)日：2012-04-10
申请号：US12415258
申请日：2009-03-31
Applicant: Robert Barlovic , Uwe Schulze , Jan Raebiger , Joerg Weigang , Jens Busch , Rolf Seltmann
Inventor： Robert Barlovic , Uwe Schulze , Jan Raebiger , Joerg Weigang , Jens Busch , Rolf Seltmann
CPC classification number: G05B19/41865 , G05B2219/31459 , G05B2219/32269 , Y02P90/20 , Y10T83/0457 , Y10T83/155 , Y10T483/1712
Abstract: Metrology data associated with a plurality of workpieces processed at a selected operation in the process flow including a plurality of operations is retrieved. A processing context associated with each of the workpieces is determined. The processing context identifies at least one previous tool used to perform an operation on the associated workpiece prior to the selected operation. A plurality of performance metrics is determined for a plurality of tools capable of performing the selected operation based on the metrology data. Each performance metric is associated with a particular tool and a particular processing context. A set of the performance metrics is identified for the plurality of tools having a processing context matching a processing context of a selected workpiece awaiting performance of the selected operation. The selected workpiece is dispatched for processing in a selected one of the plurality of tools based on the set of performance metrics.
Abstract translation: 检索与在包括多个操作的处理流程中的所选操作处理的多个工件相关联的计量数据。 确定与每个工件相关联的处理上下文。 处理上下文在所选择的操作之前识别用于对相关联的工件执行操作的至少一个先前的工具。 针对能够基于测量数据执行所选择的操作的多个工具确定多个性能度量。 每个性能度量与特定工具和特定的处理环境相关联。 针对具有与所选择的工件等待执行所选择的操作的所选择的工件的处理环境匹配的处理环境的多个工具识别出一组性能度量。 基于所述一组性能度量，在所述多个工具中选择的一个工具中调度所选择的工件以进行处理。
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10.发明授权Method and system for improving exposure uniformity in a step and repeat process 有权改善步骤和重复过程中曝光均匀性的方法和系统公开(公告)号：US07006195B2
公开(公告)日：2006-02-28
申请号：US10625451
申请日：2003-07-23
Applicant: Jan Raebiger , Heiko Wagner , Uwe Schulze , Rolf Seltmann
Inventor： Jan Raebiger , Heiko Wagner , Uwe Schulze , Rolf Seltmann
CPC classification number: G03F7/70533 , G03F7/70625
Abstract: An advanced control system for a photolithography tool that receives measurement data relating to inline parameters varying with position on a substrate surface. The position sensitive measurement data is used to establish a position dependent target offset for an exposure map, thereby effectively compensating for substrate non-uniformities. Since the inline measurement data is available significantly earlier in comparison to electrical measurement data of a completed circuit element, a more accurate exposure map may be obtained taking into account the process history of the substrates.
Abstract translation: 一种用于光刻工具的先进控制系统，其接收与基板表面上的位置变化的在线参数相关的测量数据。 位置敏感测量数据用于建立曝光图的位置相关目标偏移量，从而有效补偿衬底不均匀性。 由于与完成的电路元件的电气测量数据相比，在线测量数据显着更早地可用，所以可以考虑衬底的工艺历史来获得更准确的曝光图。
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