公开(公告)号：US20240332159A1

公开(公告)日：2024-10-03

申请号：US18733459

申请日：2024-06-04

申请人： Amkor Technology Singapore Holding Pte Ltd.

发明人： Jae Ung Lee ,  Yung Woo Lee ,  EunNaRa Cho ,  Dong Hyun Bang ,  Wook Choi ,  KooWoong Jeong ,  Byong Jin Kim ,  Min Chul Shin ,  Ho Jeong Lim ,  Ji Hyun Kim ,  Chang Hun Kim

IPC分类号： H01L23/498 ,  H01L21/48 ,  H01L23/00 ,  H01L23/13 ,  H01L23/31 ,  H01L23/50 ,  H01L23/538 ,  H01L25/065 ,  H01L25/16

CPC分类号： H01L23/49838 ,  H01L21/4853 ,  H01L21/4857 ,  H01L21/486 ,  H01L23/13 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/5389 ,  H01L25/16 ,  H01L23/3128 ,  H01L23/50 ,  H01L24/13 ,  H01L24/16 ,  H01L25/0655 ,  H01L2224/0401 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/16237 ,  H01L2924/1432 ,  H01L2924/1434 ,  H01L2924/15159 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19103 ,  H01L2924/19106

摘要： A semiconductor package and a method of manufacturing a semiconductor package. As a non-limiting example, various aspects of this disclosure provide a semiconductor package, and method of manufacturing thereof, that comprises a substrate having a first surface and a second surface opposite to the first surface, and comprising at least one first recess portion formed in a direction ranging from the first surface toward the second surface, a plurality of first recess conductive patterns formed in the first recess portion, and a first passive element inserted into the first recess portion of the substrate and having a first electrode and a second electrode electrically connected to the plurality of first recess conductive patterns.

公开(公告)号：US12009289B2

公开(公告)日：2024-06-11

申请号：US17501857

申请日：2021-10-14

申请人： Amkor Technology Singapore Holding Pte Ltd.

发明人： Jae Ung Lee ,  Yung Woo Lee ,  EunNaRa Cho ,  Dong Hyun Bang ,  Wook Choi ,  KooWoong Jeong ,  Byong Jin Kim ,  Min Chul Shin ,  Ho Jeong Lim ,  Ji Hyun Kim ,  Chang Hun Kim

IPC分类号： H01L23/498 ,  H01L21/48 ,  H01L23/00 ,  H01L23/13 ,  H01L23/31 ,  H01L23/50 ,  H01L23/538 ,  H01L25/065 ,  H01L25/16

CPC分类号： H01L23/49838 ,  H01L21/4853 ,  H01L21/4857 ,  H01L21/486 ,  H01L23/13 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/5389 ,  H01L25/16 ,  H01L23/3128 ,  H01L23/50 ,  H01L24/13 ,  H01L24/16 ,  H01L25/0655 ,  H01L2224/0401 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/16237 ,  H01L2924/1432 ,  H01L2924/1434 ,  H01L2924/15159 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19103 ,  H01L2924/19106 ,  H01L2224/131 ,  H01L2924/014 ,  H01L2924/00014

摘要： A semiconductor package and a method of manufacturing a semiconductor package. As a non-limiting example, various aspects of this disclosure provide a semiconductor package, and method of manufacturing thereof, that comprises a substrate having a first surface and a second surface opposite to the first surface, and comprising at least one first recess portion formed in a direction ranging from the first surface toward the second surface, a plurality of first recess conductive patterns formed in the first recess portion, and a first passive element inserted into the first recess portion of the substrate and having a first electrode and a second electrode electrically connected to the plurality of first recess conductive patterns.