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公开(公告)号:US11576281B1
公开(公告)日:2023-02-07
申请号:US17109472
申请日:2020-12-02
Applicant: Amazon Technologies, Inc.
Inventor: Rick Chun Kit Cheung , Luke Thomas Gregory
Abstract: A system and method for cooling an electronic datacenter component using a two-phase thermal management system with dynamic thermoelectric regulation. The system includes a thermoelectric cooler to transfer heat to a hot conduit of the thermal management system and initialize or maintain a natural convective flow of working fluid by maintaining a temperature difference between a hot and cold conduit.
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公开(公告)号:US10701838B1
公开(公告)日:2020-06-30
申请号:US16363165
申请日:2019-03-25
Applicant: Amazon Technologies, Inc.
Inventor: Ryan F. Conroy , Felipe Enrique Ortega Gutierrez , Luke Thomas Gregory
Abstract: A self-installing connector for a liquid cooling system of a datacenter component rack system. A datacenter component rack may include manifolds for conveying coolant to or from one or more datacenter electronic components for liquid cooling components of the datacenter electronic component. The self-installing connector provides a fluid connection between the manifold and a liquid cooling system of a datacenter electronic component. The self-installing connector may puncture the manifold at the time the datacenter electronic component is installed. The self-installing connector may form an opening in the manifold and secure one end of the self-installing connector into the opening upon installation of the datacenter electronic component into the datacenter component rack. The self-installing connector can separate at a dripless quick-disconnect coupling for datacenter electronic component maintenance.
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公开(公告)号:US11553627B1
公开(公告)日:2023-01-10
申请号:US16363264
申请日:2019-03-25
Applicant: Amazon Technologies, Inc.
Inventor: Luke Thomas Gregory , Ryan F. Conroy , Felipe Enrique Ortega Gutierrez
IPC: H05K7/20 , G05B19/406 , H02H7/20 , H05K7/14
Abstract: A sensor may detect a coolant leak at or near an appliance that is slidable between a seated position and an ejected position relative to a rack. In the seated position, a coolant supply line may be coupled with a conduit of the appliance to convey coolant past the appliance. A biaser can bias the appliance toward the ejected position, and a latch may secure the appliance in a seated position against the biaser. A releaser can release the latch in response to coolant leak detection by the sensor and permit the biaser to move the appliance toward the ejected position, for example, which may cause the conduit to become disconnected from the coolant supply line to cut off flow to the leak.
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公开(公告)号:US10863652B1
公开(公告)日:2020-12-08
申请号:US16903799
申请日:2020-06-17
Applicant: Amazon Technologies, Inc.
Inventor: Ryan F. Conroy , Felipe Enrique Ortega Gutierrez , Luke Thomas Gregory
IPC: H05K7/20 , F16L21/00 , F16K25/00 , F16L33/16 , F16L17/025
Abstract: A self-installing connector for a liquid cooling system of a datacenter component rack system. A datacenter component rack may include manifolds for conveying coolant to or from one or more datacenter electronic components for liquid cooling components of the datacenter electronic component. The self-installing connector provides a fluid connection between the manifold and a liquid cooling system of a datacenter electronic component. The self-installing connector may puncture the manifold at the time the datacenter electronic component is installed. The self-installing connector may form an opening in the manifold and secure one end of the self-installing connector into the opening upon installation of the datacenter electronic component into the datacenter component rack. The self-installing connector can separate at a dripless quick-disconnect coupling for datacenter electronic component maintenance.
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公开(公告)号:US11594261B1
公开(公告)日:2023-02-28
申请号:US17203635
申请日:2021-03-16
Applicant: Amazon Technologies, Inc.
Inventor: Rick Chun Kit Cheung , Luke Thomas Gregory , Priti Choudhary , Brandyn Giroux
Abstract: A modular data storage tape library includes a modular frame having a form factor similar to other types of computing racks. The modular data storage tape library includes a hermetically sealed enclosure within the modular frame and a cooling portion within the modular frame. Data storage tapes, data storage drives and robotics for moving the data storage tapes are included within the hermetically sealed enclosure. A heat exchanger transfers heat from the hermetically sealed enclosure to the cooling portion outside of the sealed enclosure through a boundary of the hermetically sealed enclosure without introducing air from the data center into the hermetically sealed enclosure. Because air is neither introduced nor removed from the hermetically sealed enclosure, humidity fluctuations are minimal, if existent, and contaminants are prevented from entering the hermetically sealed enclosure, thus increasing the life spans of the data storage tapes included in the hermetically sealed enclosure.
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公开(公告)号:US11910566B1
公开(公告)日:2024-02-20
申请号:US17206023
申请日:2021-03-18
Applicant: Amazon Technologies, Inc.
Inventor: Luke Thomas Gregory , Darin Lee Frink , Rick Chun Kit Cheung , Nafea Bshara , Kenny Kiet Huynh , Noah Kelly , Priti Choudhary , Ali Elashri
CPC classification number: H05K7/20281 , H05K7/2039 , H05K7/20263
Abstract: A commonly designed processor heat exchanger decouples the mounting hardware used to mount the heat exchanger to a processor from the heat exchanger itself. This allows a single heat exchanger design to be mounted to various different types of processors using processor customized mounting brackets that engage with flanges extending out from a body of the heat exchanger.
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公开(公告)号:US11665865B1
公开(公告)日:2023-05-30
申请号:US17109482
申请日:2020-12-02
Applicant: Amazon Technologies, Inc.
Inventor: Luke Thomas Gregory , Rick Chun Kit Cheung
CPC classification number: H05K7/20836 , F25B21/04 , H05K7/208 , H05K7/20309 , H05K7/20318 , H05K7/20381
Abstract: A system and method for controlling a cooling system for an electronic datacenter component using a two-phase thermal management system with dynamic thermoelectric regulation. The system includes a thermoelectric cooler to transfer heat to a hot conduit of the thermal management system and initialize or maintain a natural convective flow of working fluid by maintaining a temperature difference between a hot and cold conduit.
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