公开(公告)号：US11576281B1

公开(公告)日：2023-02-07

申请号：US17109472

申请日：2020-12-02

Applicant: Amazon Technologies, Inc.

Inventor： Rick Chun Kit Cheung ,  Luke Thomas Gregory

IPC: H05K7/20 ,  F28D15/02

Abstract: A system and method for cooling an electronic datacenter component using a two-phase thermal management system with dynamic thermoelectric regulation. The system includes a thermoelectric cooler to transfer heat to a hot conduit of the thermal management system and initialize or maintain a natural convective flow of working fluid by maintaining a temperature difference between a hot and cold conduit.

公开(公告)号：US11910566B1

公开(公告)日：2024-02-20

申请号：US17206023

申请日：2021-03-18

Applicant: Amazon Technologies, Inc.

Inventor： Luke Thomas Gregory ,  Darin Lee Frink ,  Rick Chun Kit Cheung ,  Nafea Bshara ,  Kenny Kiet Huynh ,  Noah Kelly ,  Priti Choudhary ,  Ali Elashri

IPC: H01L23/40 ,  H05K7/20

CPC classification number: H05K7/20281 ,  H05K7/2039 ,  H05K7/20263

Abstract: A commonly designed processor heat exchanger decouples the mounting hardware used to mount the heat exchanger to a processor from the heat exchanger itself. This allows a single heat exchanger design to be mounted to various different types of processors using processor customized mounting brackets that engage with flanges extending out from a body of the heat exchanger.

公开(公告)号：US11665865B1

公开(公告)日：2023-05-30

申请号：US17109482

申请日：2020-12-02

Applicant: Amazon Technologies, Inc.

Inventor： Luke Thomas Gregory ,  Rick Chun Kit Cheung

IPC: H05K7/20 ,  F25B21/04

CPC classification number: H05K7/20836 ,  F25B21/04 ,  H05K7/208 ,  H05K7/20309 ,  H05K7/20318 ,  H05K7/20381

Abstract: A system and method for controlling a cooling system for an electronic datacenter component using a two-phase thermal management system with dynamic thermoelectric regulation. The system includes a thermoelectric cooler to transfer heat to a hot conduit of the thermal management system and initialize or maintain a natural convective flow of working fluid by maintaining a temperature difference between a hot and cold conduit.

公开(公告)号：US11594261B1

公开(公告)日：2023-02-28

申请号：US17203635

申请日：2021-03-16

Applicant: Amazon Technologies, Inc.

Inventor： Rick Chun Kit Cheung ,  Luke Thomas Gregory ,  Priti Choudhary ,  Brandyn Giroux

IPC: G11B33/14 ,  G11B5/008 ,  G11B15/68

Abstract: A modular data storage tape library includes a modular frame having a form factor similar to other types of computing racks. The modular data storage tape library includes a hermetically sealed enclosure within the modular frame and a cooling portion within the modular frame. Data storage tapes, data storage drives and robotics for moving the data storage tapes are included within the hermetically sealed enclosure. A heat exchanger transfers heat from the hermetically sealed enclosure to the cooling portion outside of the sealed enclosure through a boundary of the hermetically sealed enclosure without introducing air from the data center into the hermetically sealed enclosure. Because air is neither introduced nor removed from the hermetically sealed enclosure, humidity fluctuations are minimal, if existent, and contaminants are prevented from entering the hermetically sealed enclosure, thus increasing the life spans of the data storage tapes included in the hermetically sealed enclosure.