公开(公告)号：US11594261B1

公开(公告)日：2023-02-28

申请号：US17203635

申请日：2021-03-16

Applicant: Amazon Technologies, Inc.

Inventor： Rick Chun Kit Cheung ,  Luke Thomas Gregory ,  Priti Choudhary ,  Brandyn Giroux

IPC: G11B33/14 ,  G11B5/008 ,  G11B15/68

Abstract: A modular data storage tape library includes a modular frame having a form factor similar to other types of computing racks. The modular data storage tape library includes a hermetically sealed enclosure within the modular frame and a cooling portion within the modular frame. Data storage tapes, data storage drives and robotics for moving the data storage tapes are included within the hermetically sealed enclosure. A heat exchanger transfers heat from the hermetically sealed enclosure to the cooling portion outside of the sealed enclosure through a boundary of the hermetically sealed enclosure without introducing air from the data center into the hermetically sealed enclosure. Because air is neither introduced nor removed from the hermetically sealed enclosure, humidity fluctuations are minimal, if existent, and contaminants are prevented from entering the hermetically sealed enclosure, thus increasing the life spans of the data storage tapes included in the hermetically sealed enclosure.