公开(公告)号：US11910566B1

公开(公告)日：2024-02-20

申请号：US17206023

申请日：2021-03-18

Applicant: Amazon Technologies, Inc.

Inventor： Luke Thomas Gregory ,  Darin Lee Frink ,  Rick Chun Kit Cheung ,  Nafea Bshara ,  Kenny Kiet Huynh ,  Noah Kelly ,  Priti Choudhary ,  Ali Elashri

IPC: H01L23/40 ,  H05K7/20

CPC classification number: H05K7/20281 ,  H05K7/2039 ,  H05K7/20263

Abstract: A commonly designed processor heat exchanger decouples the mounting hardware used to mount the heat exchanger to a processor from the heat exchanger itself. This allows a single heat exchanger design to be mounted to various different types of processors using processor customized mounting brackets that engage with flanges extending out from a body of the heat exchanger.