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Patent Agency Ranking
公开(公告)号：US11910566B1
公开(公告)日：2024-02-20
申请号：US17206023
申请日：2021-03-18
Applicant: Amazon Technologies, Inc.
Inventor： Luke Thomas Gregory , Darin Lee Frink , Rick Chun Kit Cheung , Nafea Bshara , Kenny Kiet Huynh , Noah Kelly , Priti Choudhary , Ali Elashri
CPC classification number: H05K7/20281 , H05K7/2039 , H05K7/20263
Abstract: A commonly designed processor heat exchanger decouples the mounting hardware used to mount the heat exchanger to a processor from the heat exchanger itself. This allows a single heat exchanger design to be mounted to various different types of processors using processor customized mounting brackets that engage with flanges extending out from a body of the heat exchanger.
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公开(公告)号：US12222776B1
公开(公告)日：2025-02-11
申请号：US17547919
申请日：2021-12-10
Applicant: Amazon Technologies, Inc.
Inventor： Ali Elashri , William Mark Megarity , Ryan F Conroy , Chetan Sanjay Agarwal , Priti Choudhary
Abstract: Various mounting systems for mounting heat sink apparatus to bare die processors are disclosed. The mounting systems include an upper plate, which may include a heat transfer portion, positioned in proximity to the upper surface of bare die processors to provide heat conduction away from the processors. The disclosed mounting systems secure the upper plate to the processors with balanced and centralized forces to inhibit tilting of the upper plate and reduce the risk of damaging the processors.
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公开(公告)号：US11751354B1
公开(公告)日：2023-09-05
申请号：US17359033
申请日：2021-06-25
Applicant: Amazon Technologies, Inc.
Inventor： Noah Thomas Kelly , Ryan F. Conroy , Christopher Mario Gil , Ali Elashri , Munish Sharma
CPC classification number: H05K7/1489 , H05K7/1487 , H05K7/18
Abstract: A computing equipment box assembly can include a chassis base and a tray. The chassis base can include a bottom panel, an opening through the bottom panel, and a rim defined around the opening. The tray can include a body configured for supporting computing components, a frame section of the body sized to be supported atop the rim of the chassis base; and a downwardly embossed portion of the body extending downwardly from the rim and sized to fit within the opening of the chassis base when the frame section is supported atop the rim of the chassis base.
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公开(公告)号：US20250138602A1
公开(公告)日：2025-05-01
申请号：US19009398
申请日：2025-01-03
Applicant: Amazon Technologies, Inc.
Inventor： Ali Elashri , William Mark Megarity , Ryan F. Conroy , Chetan Sanjay Agarwal , Priti Choudhary
Abstract: Various mounting systems for mounting heat sink apparatus to bare die processors are disclosed. The mounting systems include an upper plate, which may include a heat transfer portion, positioned in proximity to the upper surface of bare die processors to provide heat conduction away from the processors. The disclosed mounting systems secure the upper plate to the processors with balanced and centralized forces to inhibit tilting of the upper plate and reduce the risk of damaging the processors.
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公开(公告)号：US12035495B1
公开(公告)日：2024-07-09
申请号：US17361031
申请日：2021-06-28
Applicant: Amazon Technologies, Inc.
Inventor： Shay Madar , Yotam Admon , Ali Elashri , Ziv Harel , Nafea Bshara , Noam Navon
CPC classification number: H05K5/0247 , G01R33/02 , H05K5/0065
Abstract: A computer system includes a chassis comprising location indicating elements, such as springs, magnets, standoffs, or other types of location indicating elements physically attached to the chassis in a configuration that indicates locations in the chassis. Also, the computer system includes multiple printed circuit boards comprising pads configured to interface with the location indicating elements, wherein combinations of sensed or not sensed location indicating elements at the pads of the printed circuit boards provide a physically verified placement location for the printed circuit boards.
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