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公开(公告)号：US20230066170A1
公开(公告)日：2023-03-02
申请号：US18045100
申请日：2022-10-07
Applicant: Amazon Technologies, Inc.
Inventor： Roey Rivnay , Brendan Cully , William Mark Megarity , Ryan F. Conroy , Andrew Kent Warfield , Priti Choudhary
IPC: G06F1/18
Abstract: A device includes an interposer card that includes a processor, such as a system on a chip (SoC), and memory devices. The interposer card mounts to a mass storage device and has a shape that corresponds to a size of an end of the mass storage device to which the interposer card is mounted. The SoC of the interposer card is configured to implement an individual server for the mass storage device to which the interposer card is mounted. In some embodiments, a data storage system includes multiple mass storage devices mounted in a chassis and coupled to one or more backplanes, wherein interposer cards are connected between the mass storage devices and the one or more backplanes.
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公开(公告)号：US11751354B1
公开(公告)日：2023-09-05
申请号：US17359033
申请日：2021-06-25
Applicant: Amazon Technologies, Inc.
Inventor： Noah Thomas Kelly , Ryan F. Conroy , Christopher Mario Gil , Ali Elashri , Munish Sharma
CPC classification number: H05K7/1489 , H05K7/1487 , H05K7/18
Abstract: A computing equipment box assembly can include a chassis base and a tray. The chassis base can include a bottom panel, an opening through the bottom panel, and a rim defined around the opening. The tray can include a body configured for supporting computing components, a frame section of the body sized to be supported atop the rim of the chassis base; and a downwardly embossed portion of the body extending downwardly from the rim and sized to fit within the opening of the chassis base when the frame section is supported atop the rim of the chassis base.
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Patent Agency Ranking
公开(公告)号：US11553627B1
公开(公告)日：2023-01-10
申请号：US16363264
申请日：2019-03-25
Applicant: Amazon Technologies, Inc.
Inventor： Luke Thomas Gregory , Ryan F. Conroy , Felipe Enrique Ortega Gutierrez
IPC: H05K7/20 , G05B19/406 , H02H7/20 , H05K7/14
Abstract: A sensor may detect a coolant leak at or near an appliance that is slidable between a seated position and an ejected position relative to a rack. In the seated position, a coolant supply line may be coupled with a conduit of the appliance to convey coolant past the appliance. A biaser can bias the appliance toward the ejected position, and a latch may secure the appliance in a seated position against the biaser. A releaser can release the latch in response to coolant leak detection by the sensor and permit the biaser to move the appliance toward the ejected position, for example, which may cause the conduit to become disconnected from the coolant supply line to cut off flow to the leak.
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公开(公告)号：US10863652B1
公开(公告)日：2020-12-08
申请号：US16903799
申请日：2020-06-17
Applicant: Amazon Technologies, Inc.
Inventor： Ryan F. Conroy , Felipe Enrique Ortega Gutierrez , Luke Thomas Gregory
IPC: H05K7/20 , F16L21/00 , F16K25/00 , F16L33/16 , F16L17/025
Abstract: A self-installing connector for a liquid cooling system of a datacenter component rack system. A datacenter component rack may include manifolds for conveying coolant to or from one or more datacenter electronic components for liquid cooling components of the datacenter electronic component. The self-installing connector provides a fluid connection between the manifold and a liquid cooling system of a datacenter electronic component. The self-installing connector may puncture the manifold at the time the datacenter electronic component is installed. The self-installing connector may form an opening in the manifold and secure one end of the self-installing connector into the opening upon installation of the datacenter electronic component into the datacenter component rack. The self-installing connector can separate at a dripless quick-disconnect coupling for datacenter electronic component maintenance.
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公开(公告)号：US20250138602A1
公开(公告)日：2025-05-01
申请号：US19009398
申请日：2025-01-03
Applicant: Amazon Technologies, Inc.
Inventor： Ali Elashri , William Mark Megarity , Ryan F. Conroy , Chetan Sanjay Agarwal , Priti Choudhary
Abstract: Various mounting systems for mounting heat sink apparatus to bare die processors are disclosed. The mounting systems include an upper plate, which may include a heat transfer portion, positioned in proximity to the upper surface of bare die processors to provide heat conduction away from the processors. The disclosed mounting systems secure the upper plate to the processors with balanced and centralized forces to inhibit tilting of the upper plate and reduce the risk of damaging the processors.
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公开(公告)号：US10750632B1
公开(公告)日：2020-08-18
申请号：US16368572
申请日：2019-03-28
Applicant: Amazon Technologies, Inc.
Inventor： Ryan F. Conroy , Ryan Monaghan , Christopher Strickland Beall , Darin Frink
Abstract: A datacenter component rack may be used to mount electronic components. The datacenter component rack may include support surfaces which are evenly spaced on each side of the component rack. The support surfaces may form uniform slots for receiving the electronic components. The electronic components may include flanges for mounting the electronic components in the uniform slots. The flanges may be on each side of the electronic component and engage the support surfaces in the datacenter component rack. The flanges may support the electronic component after they have engaged with the support surfaces.
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公开(公告)号：US10701838B1
公开(公告)日：2020-06-30
申请号：US16363165
申请日：2019-03-25
Applicant: Amazon Technologies, Inc.
Inventor： Ryan F. Conroy , Felipe Enrique Ortega Gutierrez , Luke Thomas Gregory
Abstract: A self-installing connector for a liquid cooling system of a datacenter component rack system. A datacenter component rack may include manifolds for conveying coolant to or from one or more datacenter electronic components for liquid cooling components of the datacenter electronic component. The self-installing connector provides a fluid connection between the manifold and a liquid cooling system of a datacenter electronic component. The self-installing connector may puncture the manifold at the time the datacenter electronic component is installed. The self-installing connector may form an opening in the manifold and secure one end of the self-installing connector into the opening upon installation of the datacenter electronic component into the datacenter component rack. The self-installing connector can separate at a dripless quick-disconnect coupling for datacenter electronic component maintenance.
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