公开(公告)号：US10750632B1

公开(公告)日：2020-08-18

申请号：US16368572

申请日：2019-03-28

Applicant: Amazon Technologies, Inc.

Inventor： Ryan F. Conroy ,  Ryan Monaghan ,  Christopher Strickland Beall ,  Darin Frink

IPC: H05K7/14 ,  A47B88/40 ,  A47B57/30

Abstract: A datacenter component rack may be used to mount electronic components. The datacenter component rack may include support surfaces which are evenly spaced on each side of the component rack. The support surfaces may form uniform slots for receiving the electronic components. The electronic components may include flanges for mounting the electronic components in the uniform slots. The flanges may be on each side of the electronic component and engage the support surfaces in the datacenter component rack. The flanges may support the electronic component after they have engaged with the support surfaces.