公开(公告)号：US20230066170A1

公开(公告)日：2023-03-02

申请号：US18045100

申请日：2022-10-07

Applicant: Amazon Technologies, Inc.

Inventor： Roey Rivnay ,  Brendan Cully ,  William Mark Megarity ,  Ryan F. Conroy ,  Andrew Kent Warfield ,  Priti Choudhary

IPC: G06F1/18

Abstract: A device includes an interposer card that includes a processor, such as a system on a chip (SoC), and memory devices. The interposer card mounts to a mass storage device and has a shape that corresponds to a size of an end of the mass storage device to which the interposer card is mounted. The SoC of the interposer card is configured to implement an individual server for the mass storage device to which the interposer card is mounted. In some embodiments, a data storage system includes multiple mass storage devices mounted in a chassis and coupled to one or more backplanes, wherein interposer cards are connected between the mass storage devices and the one or more backplanes.

公开(公告)号：US11467636B1

公开(公告)日：2022-10-11

申请号：US17037520

申请日：2020-09-29

Applicant: Amazon Technologies, Inc.

Inventor： Roey Rivnay ,  Brendan Cully ,  William Mark Megarity ,  Ryan F Conroy ,  Andrew Kent Warfield ,  Priti Choudhary

IPC: G06F1/18

Abstract: A device includes an interposer card that includes a processor, such as a system on a chip (SoC), and memory devices. The interposer card mounts to a mass storage device and has a shape that corresponds to a size of an end of the mass storage device to which the interposer card is mounted. The SoC of the interposer card is configured to implement an individual server for the mass storage device to which the interposer card is mounted. In some embodiments, a data storage system includes multiple mass storage devices mounted in a chassis and coupled to one or more backplanes, wherein interposer cards are connected between the mass storage devices and the one or more backplanes.