公开(公告)号：US11716827B1

公开(公告)日：2023-08-01

申请号：US17487478

申请日：2021-09-28

Applicant: Amazon Technologies, Inc.

Inventor： Ryan F Conroy ,  Christopher Mario Gil

IPC: H05K7/14

CPC classification number: H05K7/1489 ,  H05K7/14 ,  H05K7/1485 ,  H05K7/1488

Abstract: A computing equipment box assembly can include a mechanical chassis component, which can include a support sheet configured for supporting computing components. A plurality of passages can be formed through the support sheet. A mechanical cable can be routable down through at least one of the passages and up through at least one other of the passages. A tensioner can be couplable with the cable and adjustable to modify an amount of tension in the cable so as to alter an amount of pre-bow or pre-bend present in the mechanical chassis component. For example, the mechanical cable may be tensioned to apply a force to the support sheet and counteract an upward pre-bend or pre-bow so that the computing components are prevented from protruding into an adjacent upper volume for an upper computer server overhead and from sagging into an adjacent lower volume for a lower computer server underneath.

公开(公告)号：US12222776B1

公开(公告)日：2025-02-11

申请号：US17547919

申请日：2021-12-10

Applicant: Amazon Technologies, Inc.

Inventor： Ali Elashri ,  William Mark Megarity ,  Ryan F Conroy ,  Chetan Sanjay Agarwal ,  Priti Choudhary

IPC: G06F1/18 ,  G06F1/20 ,  H05K7/20

Abstract: Various mounting systems for mounting heat sink apparatus to bare die processors are disclosed. The mounting systems include an upper plate, which may include a heat transfer portion, positioned in proximity to the upper surface of bare die processors to provide heat conduction away from the processors. The disclosed mounting systems secure the upper plate to the processors with balanced and centralized forces to inhibit tilting of the upper plate and reduce the risk of damaging the processors.

公开(公告)号：US11467636B1

公开(公告)日：2022-10-11

申请号：US17037520

申请日：2020-09-29

Applicant: Amazon Technologies, Inc.

Inventor： Roey Rivnay ,  Brendan Cully ,  William Mark Megarity ,  Ryan F Conroy ,  Andrew Kent Warfield ,  Priti Choudhary

IPC: G06F1/18

Abstract: A device includes an interposer card that includes a processor, such as a system on a chip (SoC), and memory devices. The interposer card mounts to a mass storage device and has a shape that corresponds to a size of an end of the mass storage device to which the interposer card is mounted. The SoC of the interposer card is configured to implement an individual server for the mass storage device to which the interposer card is mounted. In some embodiments, a data storage system includes multiple mass storage devices mounted in a chassis and coupled to one or more backplanes, wherein interposer cards are connected between the mass storage devices and the one or more backplanes.