公开(公告)号：US20230223354A1

公开(公告)日：2023-07-13

申请号：US18121568

申请日：2023-03-14

申请人： Advanced Semiconductor Engineering, Inc.

发明人： Wei Da LIN ,  Meng-Jen WANG ,  Hung Chen KUO ,  Wen Jin HUANG

IPC分类号： H01L23/552 ,  H01L21/56 ,  H01L23/04 ,  H01L21/3213 ,  H01L23/31

CPC分类号： H01L23/552 ,  H01L21/565 ,  H01L21/561 ,  H01L23/04 ,  H01L21/32131 ,  H01L23/3114 ,  H01L21/563

摘要： A semiconductor device package includes a substrate having a surface, a conductive element disposed on the surface of the substrate, and an encapsulant disposed on the surface of the substrate and covering the conductive element. The conductive element has an upper surface facing away from the substrate and exposed from the encapsulant. Further, a roughness of the upper surface of the conductive element is greater than a roughness of a side surface of the conductive element.

公开(公告)号：US20180294247A1

公开(公告)日：2018-10-11

申请号：US15918906

申请日：2018-03-12

申请人： Advanced Semiconductor Engineering, Inc.

发明人： Chih-Ming HUNG ,  Meng-Jen WANG ,  Tsung-Yueh TSAI ,  Jen-Kai OU

IPC分类号： H01L23/00 ,  H01L27/146 ,  H01L21/56

摘要： A surface mount structure includes a substrate, a sensor, an electrical contact and a package body. The substrate has a first surface and a second surface opposite to the first surface. The sensor is disposed adjacent to the second surface of the substrate. The electrical contact is disposed on the first surface of the substrate. The package body covers the first surface and the second surface of the substrate, a portion of the sensor and a first portion of the electrical contact.

公开(公告)号：US20220077326A1

公开(公告)日：2022-03-10

申请号：US17013350

申请日：2020-09-04

申请人： Advanced Semiconductor Engineering, Inc.

发明人： Chun Yu KO ,  Tsu-Hsiu WU ,  Meng-Jen WANG

IPC分类号： H01L31/0232 ,  H01L31/02 ,  H01L31/0203 ,  H01L23/00

摘要： A package structure is provided. The package structure includes a substrate, a sensor device, an encapsulant and a signal blocking structure. The substrate has a signal passing area. The sensor device is disposed over the substrate. The sensor device has a first surface, a second surface opposite to the first surface and a sensing area located at the second surface. The second surface of the sensor device faces the substrate. The encapsulant covers the sensor device and the substrate. The signal blocking structure extends from the substrate into the encapsulant.

公开(公告)号：US20180358276A1

公开(公告)日：2018-12-13

申请号：US16107887

申请日：2018-08-21

申请人： Advanced Semiconductor Engineering, Inc.

发明人： Chi-Tsung CHIU ,  Meng-Jen WANG ,  Cheng-Hsi CHUANG ,  Hui-Ying HSIEH ,  Hui Hua LEE

IPC分类号： H01L23/31 ,  H01L23/00 ,  H01L21/78 ,  H01L21/786 ,  H01L23/13 ,  H01L23/14 ,  H01L23/29 ,  H01L23/492 ,  H01L23/495 ,  H01L23/498 ,  H01L23/538 ,  H01L21/56 ,  H01L25/07

CPC分类号： H01L23/3121 ,  H01L21/561 ,  H01L21/78 ,  H01L21/786 ,  H01L23/13 ,  H01L23/14 ,  H01L23/142 ,  H01L23/29 ,  H01L23/3107 ,  H01L23/3142 ,  H01L23/315 ,  H01L23/492 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/49575 ,  H01L23/49582 ,  H01L23/49586 ,  H01L23/49861 ,  H01L23/5389 ,  H01L23/562 ,  H01L24/19 ,  H01L24/24 ,  H01L24/25 ,  H01L24/97 ,  H01L25/074 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/24247 ,  H01L2224/2518 ,  H01L2224/32245 ,  H01L2224/32257 ,  H01L2224/73267 ,  H01L2224/8385 ,  H01L2224/92244 ,  H01L2224/97 ,  H01L2924/15153 ,  H01L2224/83

摘要： A semiconductor device package includes: (1) a conductive base comprising a sidewall, a cavity defined from a first surface of the conductive base, the cavity having a bottom surface and a depth; (2) a semiconductor die disposed on the bottom surface of the cavity, the semiconductor die having a first surface and a second surface opposite the first surface, the second surface of the semiconductor die bonded to the bottom surface of the cavity; and (3) a first insulating material covering the sidewall of the conductive base and extending to a bottom surface of the conductive base.

公开(公告)号：US20170148746A1

公开(公告)日：2017-05-25

申请号：US15250713

申请日：2016-08-29

申请人： Advanced Semiconductor Engineering, Inc.

发明人： Chi-Tsung CHIU ,  Meng-Jen WANG ,  Cheng-Hsi CHUANG ,  Hui-Ying HSIEH ,  Hui Hua LEE

IPC分类号： H01L23/00 ,  H01L21/78 ,  H01L21/48 ,  H01L21/56 ,  H01L23/495 ,  H01L23/31

CPC分类号： H01L23/3121 ,  H01L21/561 ,  H01L21/78 ,  H01L21/786 ,  H01L23/13 ,  H01L23/14 ,  H01L23/142 ,  H01L23/29 ,  H01L23/3107 ,  H01L23/3142 ,  H01L23/315 ,  H01L23/492 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/49575 ,  H01L23/49582 ,  H01L23/49586 ,  H01L23/49861 ,  H01L23/5389 ,  H01L23/562 ,  H01L24/19 ,  H01L24/24 ,  H01L24/25 ,  H01L24/97 ,  H01L25/074 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/24247 ,  H01L2224/2518 ,  H01L2224/32245 ,  H01L2224/32257 ,  H01L2224/73267 ,  H01L2224/8385 ,  H01L2224/92244 ,  H01L2224/97 ,  H01L2924/15153 ,  H01L2224/83

摘要： A semiconductor device package includes a conductive base, and a cavity defined from a first surface of the conductive base, the cavity having a bottom surface and a depth. A semiconductor die is disposed on the bottom surface of the cavity, the semiconductor die having a first surface and a second surface opposite the first surface. The second surface of the semiconductor die is bonded to the bottom surface of the cavity. A distance between the first surface of the semiconductor die and the first surface of the conductive base is about 20% of the depth of the cavity.

公开(公告)号：US20240213222A1

公开(公告)日：2024-06-27

申请号：US18426124

申请日：2024-01-29

申请人： Advanced Semiconductor Engineering, Inc.

发明人： Shang-Ruei WU ,  Chien-Yuan TSENG ,  Meng-Jen WANG ,  Chen-Tsung CHANG ,  Chih-Fang WANG ,  Cheng-Han LI ,  Chien-Hao CHEN ,  An-Chi TSAO ,  Per-Ju CHAO

IPC分类号： H01L25/065 ,  H01L21/02 ,  H01L21/768 ,  H01L23/31

CPC分类号： H01L25/0657 ,  H01L21/02631 ,  H01L21/76838 ,  H01L23/3121

摘要： A semiconductor device package includes a substrate, a connection structure, a first package body and a first electronic component. The substrate has a first surface and a second surface opposite to the first surface. The connection structure is disposed on the firs surface of the substrate. The first package body is disposed on the first surface of the substrate. The first package body covers the connection structure and exposes a portion of the connection structure. The first electronic component is disposed on the first package body and in contact with the portion of the connection structure exposed by the first package body.

公开(公告)号：US20220028836A1

公开(公告)日：2022-01-27

申请号：US17493709

申请日：2021-10-04

申请人： Advanced Semiconductor Engineering, Inc.

发明人： Shang-Ruei WU ,  Chien-Yuan TSENG ,  Meng-Jen WANG ,  Chen-Tsung CHANG ,  Chih-Fang WANG ,  Cheng-Han LI ,  Chien-Hao CHEN ,  An-Chi TSAO ,  Per-Ju CHAO

IPC分类号： H01L25/065 ,  H01L21/02 ,  H01L21/768 ,  H01L23/31

摘要： A semiconductor device package includes a substrate, a connection structure, a first package body and a first electronic component. The substrate has a first surface and a second surface opposite to the first surface. The connection structure is disposed on the first surface of the substrate. The first package body is disposed on the first surface of the substrate. The first package body covers the connection structure and exposes a portion of the connection structure. The first electronic component is disposed on the first package body and in contact with the portion of the connection structure exposed from the first package body.

公开(公告)号：US20190107897A1

公开(公告)日：2019-04-11

申请号：US15726034

申请日：2017-10-05

申请人： Advanced Semiconductor Engineering, Inc.

发明人： Jen-Kai OU ,  Meng-Jen WANG ,  Tsung-Yueh TSAI ,  Chih-Ming HUNG

IPC分类号： G06F3/02 ,  G06F3/041 ,  H01L41/053 ,  G06F3/01 ,  H01L41/319 ,  H01L41/293 ,  H01L41/23

摘要： An electronic device includes a piezoelectric module, a sensing module and a buffer element. The piezoelectric module includes a substrate and a piezoelectric element. The substrate defines an opening penetrating the substrate. The piezoelectric element is disposed on the substrate and across the opening of the substrate. The sensing module is disposed over the piezoelectric module. The buffer element is disposed between the piezoelectric module and the sensing module.

公开(公告)号：US20220238502A1

公开(公告)日：2022-07-28

申请号：US17719280

申请日：2022-04-12

申请人： Advanced Semiconductor Engineering, Inc.

发明人： Tsung-Yueh TSAI ,  Meng-Jen WANG ,  Yu-Fang TSAI ,  Meng-Jung CHUANG

IPC分类号： H01L25/16 ,  H01L23/31 ,  H01L21/52 ,  H01L23/538 ,  H01L21/48

摘要： An optical device package comprises a carrier having a first surface and a second surface recessed with respect to the first surface and a lid disposed on the second surface of the carrier.

公开(公告)号：US20210327822A1

公开(公告)日：2021-10-21

申请号：US16852256

申请日：2020-04-17

申请人： Advanced Semiconductor Engineering, Inc.

发明人： Wei Da LIN ,  Meng-Jen WANG ,  Hung Chen KUO ,  Wen Jin HUANG

IPC分类号： H01L23/552 ,  H01L23/31 ,  H01L21/56 ,  H01L21/3213 ,  H01L23/04

摘要： A semiconductor device package includes a substrate having a surface, a conductive element disposed on the surface of the substrate, and an encapsulant disposed on the surface of the substrate and covering the conductive element. The conductive element has an upper surface facing away from the substrate and exposed from the encapsulant. Further, a roughness of the upper surface of the conductive element is greater than a roughness of a side surface of the conductive element.