公开(公告)号：US20220077364A1

公开(公告)日：2022-03-10

申请号：US17016034

申请日：2020-09-09

申请人： Advanced Semiconductor Engineering, Inc.

发明人： Wei-Tang CHU ,  Tsu-Hsiu WU ,  Chun Yu KO

IPC分类号： H01L33/60 ,  H01L33/52

摘要： A semiconductor package is provided in the present disclosure. The semiconductor package comprises: a substrate, an electronic device disposed on the substrate, a lid disposed on the substrate and surrounding the electronic device an encapsulant formed over the substrate, encapsulating the electronic device and the lid; and a plurality of fillers in the encapsulant, configured to diffuse light interacting with the electronic device. In this way, through the use of the encapsulant including the fillers distributed therein, additional optical filters and diffusers are not needed. Also, through the use of the lid, undesired stray light can be prevented from being interacting with the electronic device.

公开(公告)号：US20230037713A1

公开(公告)日：2023-02-09

申请号：US17396602

申请日：2021-08-06

申请人： Advanced Semiconductor Engineering, Inc.

发明人： Wei-Tang CHU ,  Tsu-Hsiu WU ,  Chun Yu KO

IPC分类号： H01L31/0216 ,  H01L31/0203 ,  H01L31/02 ,  H01L31/18

摘要： The present disclosure provides an electronic package. The electronic package includes a substrate, a first electronic component, an encapsulant, and a shielding layer. The substrate has a first upper surface, a second upper surface, and a first lateral surface extending between the first upper surface and the second upper surface. The first electronic component is disposed on the substrate. The encapsulant coves the first electronic component and the first lateral surface of the substrate. The shielding layer covers the encapsulant. The shielding layer is spaced apart from the first lateral surface of the substrate.

公开(公告)号：US20220077326A1

公开(公告)日：2022-03-10

申请号：US17013350

申请日：2020-09-04

申请人： Advanced Semiconductor Engineering, Inc.

发明人： Chun Yu KO ,  Tsu-Hsiu WU ,  Meng-Jen WANG

IPC分类号： H01L31/0232 ,  H01L31/02 ,  H01L31/0203 ,  H01L23/00

摘要： A package structure is provided. The package structure includes a substrate, a sensor device, an encapsulant and a signal blocking structure. The substrate has a signal passing area. The sensor device is disposed over the substrate. The sensor device has a first surface, a second surface opposite to the first surface and a sensing area located at the second surface. The second surface of the sensor device faces the substrate. The encapsulant covers the sensor device and the substrate. The signal blocking structure extends from the substrate into the encapsulant.

公开(公告)号：US20210313476A1

公开(公告)日：2021-10-07

申请号：US16838677

申请日：2020-04-02

申请人： Advanced Semiconductor Engineering, Inc.

发明人： Chun Yu KO ,  Tsu-Hsiu WU ,  Wei-Tang CHU

IPC分类号： H01L31/0203 ,  H01L31/02 ,  H01L31/0232 ,  H01L31/167 ,  H01L31/18

摘要： An optical sensor package structure and an optical module structure are provided. The optical sensor package structure includes a substrate, a sensor device and a transparent encapsulant. The sensor device is electrically connected to the substrate, and has a sensing area facing the substrate. The transparent encapsulant covers the sensing area of the sensor device.