UTILIZE PATTERN RECOGNITION TO IMPROVE SEM CONTOUR MEASUREMENT ACCURACY AND STABILITY AUTOMATICALLY

    公开(公告)号:US20210263426A1

    公开(公告)日:2021-08-26

    申请号:US17256332

    申请日:2019-06-21

    Abstract: A method for improving a process model by measuring a feature on a printed design that was constructed based in part on a target design is disclosed. The method includes obtaining a) an image of the printed design from an image capture device and b) contours based on shapes in the image. The method also includes identifying, by a pattern recognition program, patterns on the target design that include the feature and determining coordinates, on the contours, that correspond to the feature. The method further includes improving the process model by at least a) providing a measurement of the feature based on the coordinates and b) calibrating the process model based on a comparison of the measurement with a corresponding feature in the target design.

    SYSTEMS AND METHODS FOR DEFECT LOCATION BINNING IN CHARGED-PARTICLE SYSTEMS

    公开(公告)号:US20250166166A1

    公开(公告)日:2025-05-22

    申请号:US18838459

    申请日:2023-01-19

    Abstract: Apparatuses, systems, and methods for providing beams for defect detection and defect location binning associated with a sample of charged particle beam systems. A method of image analysis may include obtaining an image of a sample, identifying a feature captured in the image of the sample, generating a template image from a design layout of the identified feature, comparing 5 the image of the sample with the template image, and processing the image based on the comparison. In some embodiments, a method of image analysis may include obtaining an image of a sample, identifying a feature captured in the obtained image of the sample, mapping the obtained image to a template image generated from a design layout of the identified feature, and analyzing the image based on the mapping.

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