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公开(公告)号:US20230298158A1
公开(公告)日:2023-09-21
申请号:US18017646
申请日:2021-07-20
Applicant: ASML NETHERLANDS B.V.
Inventor: Jiao HUANG , Jinze WANG , Hongfei SHI , Mu FENG , Qian ZHAO , Alvin Jianjiang WANG , Yan-Jun XIAO , Liang LIU
CPC classification number: G06T7/001 , G06T7/13 , G06T2207/30168 , G06T2207/30148 , G06T2207/20216 , G06T2207/10061
Abstract: A method for selecting good quality images from raw images of a patterned substrate. The method includes obtaining a plurality of raw images (e.g., SEM images) of a patterned substrate; determining a raw image quality metric (e.g., an image score, an average slope, distance between contours) based on data associated with one or more gauges or one or more contours of one or more features within each image of the plurality of raw images, the raw image quality metric being indicative of a raw image quality; and selecting, based on the raw image quality metric, a sub-set of raw images from the plurality of raw images. The sub-set of raw images can be provided for performing more accurate measurements of the one or more features within an image.
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2.
公开(公告)号:US20230244152A1
公开(公告)日:2023-08-03
申请号:US18008075
申请日:2021-06-17
Applicant: ASML NETHERLANDS B.V.
Inventor: Jen-Shiang WANG , Pengcheng YANG , Jiao HUANG , Yen-Wen LU , Liang LIU , Chen ZHANG
CPC classification number: G03F7/706843 , G03F1/70 , G03F7/705 , G03F7/105
Abstract: A method for determining a likelihood that an assist feature of a mask pattern will print on a substrate. The method includes obtaining (i) a plurality of images of a pattern printed on a substrate and (ii) variance data the plurality of images of the pattern; determining, based on the variance data, a model configured to generate variance data associated with the mask pattern; and determining, based on model-generated variance data for a given mask pattern and a resist image or etch image associated with the given mask pattern, the likelihood that an assist feature of the given mask pattern will be printed on the substrate. The likelihood can be applied to adjust one or more parameters related to a patterning process or a patterning apparatus to reduce the likelihood that the assist feature will print on the substrate.
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