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1.
公开(公告)号:US20200012196A1
公开(公告)日:2020-01-09
申请号:US16483452
申请日:2018-02-13
Applicant: ASML NETHERLANDS B.V.
Inventor: Peng LIU , Ya LUO , Yu CAO , Yen-Wen LU
Abstract: A method including: obtaining a characteristic of a portion of a design layout; determining a characteristic of M3D of a patterning device including or forming the portion; and training, by a computer, a neural network using training data including a sample whose feature vector includes the characteristic of the portion and whose supervisory signal includes the characteristic of the M3D. Also disclosed is a method including: obtaining a characteristic of a portion of a design layout; obtaining a characteristic of a lithographic process that uses a patterning device including or forming the portion; determining a characteristic of a result of the lithographic process; training, by a computer, a neural network using training data including a sample whose feature vector includes the characteristic of the portion and the characteristic of the lithographic process, and whose supervisory signal includes the characteristic of the result.
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公开(公告)号:US20220283511A1
公开(公告)日:2022-09-08
申请号:US17751110
申请日:2022-05-23
Applicant: ASML NETHERLANDS B.V.
Inventor: Yen-Wen LU , Xiaorui CHEN , Yang LIN
IPC: G03F7/20 , G05B19/418
Abstract: A method of controlling a computer process for designing or verifying a photolithographic component, the method including building a source tree including nodes of the process, including dependency relationships among the nodes, defining, for some nodes, at least two different process conditions, expanding the source tree to form an expanded tree, including generating a separate node for each different defined process condition, and duplicating dependent nodes having an input relationship to each generated separate node, determining respective computing hardware requirements for processing the node, selecting computer hardware constraints based on capabilities of the host computing system, determining, based on the requirements and constraints and on dependency relations in the expanded tree, an execution sequence for the computer process, and performing the computer process on the computing system.
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3.
公开(公告)号:US20200073260A1
公开(公告)日:2020-03-05
申请号:US16467124
申请日:2017-12-06
Applicant: ASML NETHERLANDS B.V.
Inventor: Yu CAO , Yen-Wen LU , Peng LIU , Rafael C. HOWELL
IPC: G03F7/20
Abstract: A method including: obtaining a thin-mask transmission function of a patterning device and a M3D model for a lithographic process, wherein the thin-mask transmission function represents a continuous transmission mask and the M3D model at least represents a portion of M3D attributable to multiple edges of structures on the patterning device; determining a M3D mask transmission function of the patterning device by using the thin-mask transmission function and the M3D model; and determining an aerial image produced by the patterning device and the lithographic process, by using the M3D mask transmission function.
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公开(公告)号:US20160085905A1
公开(公告)日:2016-03-24
申请号:US14861847
申请日:2015-09-22
Applicant: ASML NETHERLANDS B.V.
Inventor: Frank Gang CHEN , Joseph Werner DE VOCHT , Yuelin DU , Wanyu LI , Yen-Wen LU
IPC: G06F17/50
CPC classification number: G06F17/5081 , G03F7/705 , G03F7/70508 , G03F7/70625 , G03F7/70641 , G03F7/70666
Abstract: Disclosed herein is a computer-implemented method for determining an overlapping process window (OPW) of an area of interest on a portion of a design layout for a device manufacturing process for imaging the portion onto a substrate, the method comprising: obtaining a plurality of features in the area of interest; obtaining a plurality of values of one or more processing parameters of the device manufacturing process; determining existence of defects, probability of the existence of defects, or both in imaging the plurality of features by the device manufacturing process under each of the plurality of values; and determining the OPW of the area of interest from the existence of defects, the probability of the existence of defects, or both.
Abstract translation: 本文公开了一种计算机实现的方法,用于确定用于将部分成像到衬底上的器件制造工艺的设计布局的一部分上的感兴趣区域的重叠处理窗口(OPW),该方法包括:获得多个 特征在感兴趣的领域; 获得装置制造过程的一个或多个处理参数的多个值; 通过在多个值中的每一个值下的设备制造过程来确定存在缺陷,存在缺陷的概率或二者成像多个特征; 从缺陷的存在,存在缺陷的概率或两者确定感兴趣区域的OPW。
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公开(公告)号:US20250021015A1
公开(公告)日:2025-01-16
申请号:US18705509
申请日:2022-10-26
Applicant: ASML NETHERLANDS B.V.
Inventor: Jin CHENG , Feng CHEN , Leiwu ZHENG , Yongfa FAN , Yen-Wen LU , Jen-Shiang WANG , Ziyang MA , Dianwen ZHU , Xi CHEN , Yu ZHAO
Abstract: An etch bias direction is determined based on a curvature of a contour in a substrate pattern. The etch bias direction is configured to be used to enhance an accuracy of a semiconductor patterning process relative to prior patterning processes. In some embodiments, a representation of the substrate pattern is received, which includes the contour in the substrate pattern. The curvature of the contour of the substrate pattern is determined, and an etch bias direction is determined based on the curvature by considering curvatures of adjacent contour portions. A simulation model is used to determine an etch effect based on the etch bias direction for an etching process on the substrate pattern.
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公开(公告)号:US20230044490A1
公开(公告)日:2023-02-09
申请号:US17782741
申请日:2020-11-21
Applicant: ASML NETHERLANDS B.V.
Inventor: Quan ZHANG , Tatung CHOW , Been-Der CHEN , Yen-Wen LU
Abstract: A method of determining a mask pattern for a target pattern to be printed on a substrate. The method includes partitioning a portion of a design layout including the target pattern into a plurality of cells with reference to a given location on the target pattern; assigning a plurality of variables within a particular cell of the plurality of cells, the particular cell including the target pattern or a portion thereof; and determining, based on values of the plurality of variables, the mask pattern for the target pattern such that a performance metric of a patterning process utilizing the mask pattern is within a desired performance range.
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公开(公告)号:US20210208507A1
公开(公告)日:2021-07-08
申请号:US17059771
申请日:2019-05-14
Applicant: ASML NETHERLANDS B.V.
Inventor: Jen-Shiang WANG , Qian Zhao , Yunbo GUO , Yen-Wen LU , Mu FENG , Qiang ZHANG
IPC: G03F7/20
Abstract: A method for improving a process model for a patterning process, the method including obtaining a) a measured contour from an image capture device, and b) a simulated contour generated from a simulation of the process model. The method also includes aligning the measured contour with the simulated contour by determining an offset between the measured contour and the simulated contour. The process model is calibrated to reduce a difference, computed based on the determined offset, between the simulated contour and the measured contour.
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公开(公告)号:US20170357911A1
公开(公告)日:2017-12-14
申请号:US15531321
申请日:2015-11-18
Applicant: ASML Netherlands B.V.
Inventor: Xiaofeng LIU , Yen-Wen LU
CPC classification number: G06N20/00 , G03F1/36 , G03F7/70 , G03F7/70125 , G03F7/70441 , G03F7/705 , G06F17/5068 , G06F17/5081
Abstract: A method to improve a lithographic process for imaging a portion of a design layout onto a substrate using a lithographic projection apparatus, the method including: obtaining a target feature; generating a perturbed target feature from the target feature by applying a perturbation thereto; generating a set of training examples includes the perturbed target feature and an indication as whether the perturbed target feature is deemed the same as the target feature; training a learning model with the set of training examples; classifying features in the portion of the design layout into at least two classes: being deemed the same as the target feature, and being deemed different from the target feature.
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9.
公开(公告)号:US20230244152A1
公开(公告)日:2023-08-03
申请号:US18008075
申请日:2021-06-17
Applicant: ASML NETHERLANDS B.V.
Inventor: Jen-Shiang WANG , Pengcheng YANG , Jiao HUANG , Yen-Wen LU , Liang LIU , Chen ZHANG
CPC classification number: G03F7/706843 , G03F1/70 , G03F7/705 , G03F7/105
Abstract: A method for determining a likelihood that an assist feature of a mask pattern will print on a substrate. The method includes obtaining (i) a plurality of images of a pattern printed on a substrate and (ii) variance data the plurality of images of the pattern; determining, based on the variance data, a model configured to generate variance data associated with the mask pattern; and determining, based on model-generated variance data for a given mask pattern and a resist image or etch image associated with the given mask pattern, the likelihood that an assist feature of the given mask pattern will be printed on the substrate. The likelihood can be applied to adjust one or more parameters related to a patterning process or a patterning apparatus to reduce the likelihood that the assist feature will print on the substrate.
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10.
公开(公告)号:US20230185183A1
公开(公告)日:2023-06-15
申请号:US17924626
申请日:2021-05-07
Applicant: ASML NETHERLANDS B.V.
Inventor: Jiuning HU , Jun YE , Yen-Wen LU
CPC classification number: G03F1/44 , G03F1/36 , G03F1/70 , G03F7/70308 , G03F7/70375 , G03F7/70683
Abstract: A method for improving a design of a patterning device. The method includes (i) obtaining mask points of a design of a mask feature, wherein the mask feature corresponds to a target feature in a target pattern to be printed on a substrate; and (ii) adjusting locations of the mask points to generate a modified design of the mask feature based on the adjusted mask points.
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