摘要:
A tubular structure for transporting heat transfer fluid including at least: i) a layer (1) in contact with the fluid including at least one thermoplastic polymer P1 that is semicrystalline with Tm1 greater than or equal to 160° C., as determined according to the standard 1 1357-3 (2013) or amorphous with Tg1 greater than or equal to 100° C., as determined according to the standard 1 1357-2 (2013), said layer (1) containing no fibers, ii) a layer (2) including at least: (a) a thermoplastic polymer P2 that is semicrystalline, in particular a polyamide with Tm2 greater than or equal to 170° C. or amorphous with Tg2 greater than or equal to 100° C., or a polyolefin with Tm greater than 100° C.; (b) continuous fibers, the polymer P2 being identical to P1 or different from P1 in which case the polymers P1 and P2 adhere at least partially to one another.
摘要:
The invention relates to the use of a layer consisting of a composition comprising a copolyamide of formula X/10.T/Y for transporting a heat transfer fluid in a vapor compression circuit, wherein: X represents either the residues of an aliphatic amino acid comprising between 8 and 18 carbon atoms, or a lactam, or the unit X1.X2 representing the residues resulting from the condensation of an aliphatic diamine comprising between 6 and 18 carbon atoms and a (cyclo)aliphatic diacid comprising between 6 and 18 carbon atoms; 10.T represents the residues resulting from the condensation of a decanediamine and terephthalic acid; and Y represents the residues resulting from the condensation of an aliphatic diamine comprising between 9 and 14 carbon atoms and an aromatic diacid, Y being different from the unit 10.T; the molar proportion of 10.T units being higher than 0%.
摘要:
Provided is a method for heating or cooling a liquid or a body by means of a vapor compression circuit containing a heat transfer fluid. The vapor compression circuit element includes at least one layer that includes copolyamide of formula X/10.T/Y, where the structural variables are described herein.
摘要:
The invention relates to a thermoplastic structure comprising at least one layer consisting of a composition comprising a copolyamide of formula X/10.T/Y, wherein: X represents either the residues of an aliphatic amino acid comprising between 8 and 18 carbon atoms, or a lactam, or the unit X1.X2 representing the residues resulting from the condensation of an aliphatic diamine comprising between 6 and 18 carbon atoms and a (cyclo)aliphatic diacid comprising between 6 and 18 carbon atoms; 10.T represents the residues resulting from the condensation of a decanediamine and terephthalic acid; and Y represents the residues resulting from the condensation of an aliphatic diamine comprising between 9 and 14 carbon atoms and an aromatic diacid, Y being different from the unit 10.T; the molar proportion of 10.T units in the copolyamide being higher than 0%; the molar proportion of Y units in relation to the group of 10.T and Y units being between 0 and 30%; and the proportion of X units being between 0.4 and 0.8 mole for a mole of semi-aromatic units 10.T and Y.