Abstract:
Electron beam-confining electromagnets of an electron beam generator are aligned with an electron beam axis, each of the electromagnets being folded to define a main section and a pair of angled wing sections disposed at respective angles relative to said main section, and a conductor wound around the edge.
Abstract:
In a plasma reactor for processing a workpiece, an electron beam is employed as the plasma source, and a remote radical source is incorporated with the process chamber.
Abstract:
Transistors and their methods of formation are described. Low dielectric constant material (e.g. a void) is placed between an elongated gate and a contact to increase the attainable switching speed of the gate of the device. An elongated structural slab of silicon nitride is temporarily positioned on both sides of the gate. Silicon oxide is formed over the silicon nitride slabs and the gate. Contacts are formed through the silicon oxide. The silicon oxide is selectively etched back to expose the silicon nitride slab. A portion or all the silicon nitride slab is removed and replaced with low-K dielectric or any dielectric with an air-gap to enable higher switching speed of the transistor. The highly-selective silicon nitride etch uses remotely excited fluorine and a very low electron temperature in the substrate processing region.
Abstract:
Electron beam-confining electromagnets of an electron beam generator are aligned with an electron beam axis, each of the electromagnets being folded to define a main section and a pair of angled wing sections disposed at respective angles relative to said main section, and a conductor wound around the edge.
Abstract:
In a plasma reactor for processing a workpiece, an electron beam is employed as the plasma source, and a remote radical source is incorporated with the process chamber.