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公开(公告)号：US09485862B2
公开(公告)日：2016-11-01
申请号：US14472223
申请日：2014-08-28
Applicant: Apple Inc.
Inventor： Ibuki Kamei , Timothy J. Rasmussen , Trent K. Do
CPC classification number: H05K1/0393 , H05K1/028 , H05K1/097 , H05K1/111 , H05K1/118 , H05K3/041 , H05K3/28 , H05K3/361 , H05K3/4007 , H05K2201/026 , H05K2201/05 , H05K2203/0759
Abstract: An electronic device has structures such as substrates and internal housing structures. The substrates may be rigid substrates such as rigid printed circuit boards and flexible substrates such as flexible printed circuits, flexible touch sensor substrates, and flexible display substrates. Carbon nanotubes may be patterned to form carbon nanotube signal paths on the substrates. The signal paths may resist cracking when bent. A flexible structure such as a flexible printed circuit may have carbon nanotube signal paths interposed between polymer layers. Openings in a polymer layer may expose metal solder pads on the carbon nanotube signal paths. A stiffener may be provided under the metal solder pads. Polymer materials in the flexible structure may be molded to form bends. Bends may be formed along edges of a touch sensor or display or may be formed in a flexible printed circuit.
Abstract translation: 电子设备具有诸如基板和内部壳体结构的结构。 基板可以是刚性基板，例如刚性印刷电路板和柔性基板，例如柔性印刷电路，柔性触摸传感器基板和柔性显示基板。 碳纳米管可以被图案化以在基底上形成碳纳米管信号路径。 当弯曲时，信号路径可能会抗开裂。 诸如柔性印刷电路的柔性结构可以具有夹在聚合物层之间的碳纳米管信号路径。 聚合物层中的开口可能会暴露碳纳米管信号路径上的金属焊盘。 可以在金属焊盘下设置加强件。 柔性结构中的聚合物材料可以被模制以形成弯曲。 弯曲部可以沿着触摸传感器或显示器的边缘形成，或者可以形成在柔性印刷电路中。
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公开(公告)号：US20140170905A1
公开(公告)日：2014-06-19
申请号：US14185133
申请日：2014-02-20
Applicant: Apple Inc.
Inventor： Fletcher R. Rothkopf , Anna-Katrina Shedletsky , Ian P. Colahan , Daniele De Iuliis , Trent K. Do
IPC: H01R24/58
CPC classification number: H01R24/58 , H01R13/187 , Y10T29/49208
Abstract: Split jack assemblies are constructed with a tubeless pin block. Elimination (or split) of the tube, or more particularly, a tube that is an integrally formed part of the pin block form the pin block allows for the use of a tubeless pin block design that results in a jack assembly having smaller overall dimensions than a conventional jack assembly constructed to accommodate a plug of the same dimensions. The tubeless pin block can be used in conjunction with a tube sleeve or with a curved surface of a housing for an electronic device, or both to provide a plug receptacle of the split jack assembly.
Abstract translation: 分体式千斤顶组件采用无内孔的针座构成。 管的排除（或分裂），或更具体地，作为销块的整体形成部分的管形成销块允许使用无内筒销块设计，其导致千斤顶组件具有比 构造成容纳相同尺寸的插头的常规千斤顶组件。 无内胎销块可以与管套筒或用于电子设备的壳体的曲面结合使用，或者两者都提供分体插座组件的插头插座。
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公开(公告)号：US20140094066A1
公开(公告)日：2014-04-03
申请号：US13631659
申请日：2012-09-28
Applicant: APPLE INC.
Inventor： Trent K. Do
IPC: H01R24/30
CPC classification number: H01R13/6485 , H01R13/658 , H01R13/6583 , H01R13/6599 , H01R43/205 , H01R43/26 , H01R2201/06 , Y10T29/49147 , Y10T29/49204
Abstract: An improved electronic receptacle connector with portions thereof formed from an electrically conductive polymer is disclosed. A conductive polymer front face enables improved device aesthetics and can discharge electrostatic energy from a plug before it is mated with the connector. A conductive polymer housing with internal ground structures may provide electromagnetic interference shielding and improved data transfer speed.
Abstract translation: 公开了一种改进的电子插座连接器，其一部分由导电聚合物形成。 导电聚合物正面可以改善设备美观性，并且可以在与插头配合之前从插头中释放静电能量。 具有内部接地结构的导电聚合物外壳可提供电磁干扰屏蔽和改善的数据传输速度。
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公开(公告)号：US09899757B2
公开(公告)日：2018-02-20
申请号：US14845084
申请日：2015-09-03
Applicant: APPLE INC.
Inventor： Trent K. Do
CPC classification number: H01R13/42 , H01R13/08 , H01R13/2428 , H01R13/521
Abstract: Contact structures for devices, where contacts in the contact structures provide a proper normal force while consuming a minimal amount of surface area, depth, and volume in a device and where the contact structures prevent or limit the ingress of fluid or debris into the device. On example may provide a contact structure having a frame. The frame may be arranged to be placed in an opening in a device enclosure for an electronic device or the frame may be part of the electronic device. The frame may include a number of passages, each passage for a contact of the contact structure. Each contact may be held to the frame by a pliable membrane. Each contact may connect to a board in the electronic device via a compliant conductive path.
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公开(公告)号：US09876307B2
公开(公告)日：2018-01-23
申请号：US15274176
申请日：2016-09-23
Applicant: Apple Inc.
Inventor： Daniel C. Wagman , Eric S. Jol , Trent K. Do
CPC classification number: H01R13/521 , H01R4/02 , H01R12/53 , H01R12/714 , H01R13/08 , H01R13/15 , H01R13/2428 , H01R13/2478
Abstract: Contact structures for devices, where contacts in the contact structures may provide a sufficient normal force to provide a good electrical connection with corresponding contacts while consuming a minimal amount of surface area, depth, and volume in a device, and where the contact structures may prevent or limit the ingress of fluid or debris into the device. On example may provide a contact structure having a frame. The frame may be arranged to be placed in an opening in a device enclosure for an electronic device or the frame may be part of the electronic device. The frame may include a number of passages, each passage for a contact of the contact structure. Each contact may be held to the frame by a pliable membrane. Each contact may connect to a board in the electronic device via a compliant conductive path.
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Patent Agency Ranking
公开(公告)号：US20160065703A1
公开(公告)日：2016-03-03
申请号：US14473781
申请日：2014-08-29
Applicant: Apple Inc.
Inventor： Matthew P. Rao , Stefan C. Mag , Trent K. Do
IPC: H04M1/02 , H04B1/3888
CPC classification number: H04M1/0274 , H04B1/3888 , H04B2001/3894
Abstract: An electronic device enclosure that includes a housing and a frame and an integrally formed connector shell. The connector shell includes a first portion integrally formed with the housing and a second portion integrally formed with the frame. The first and second portions of the connector shell are joined at first and second mating surfaces, respectively, forming a cavity therebetween in which a plurality of receptacle connector contacts are positioned.
Abstract translation: 一种包括壳体和框架以及整体形成的连接器壳体的电子设备外壳。 连接器壳体包括与壳体一体形成的第一部分和与框架一体形成的第二部分。 连接器壳体的第一和第二部分分别在第一和第二配合表面处连接，在其间形成有多个插座连接器触点的腔室。
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公开(公告)号：US20150140868A1
公开(公告)日：2015-05-21
申请号：US14480571
申请日：2014-09-08
Applicant: Apple Inc.
Inventor： Trent K. Do , Jason S. Sloey
CPC classification number: H01R24/62 , H01R4/64 , H01R12/724 , H01R13/5202 , H01R13/6581 , H01R2107/00
Abstract: Connector receptacles having a contoured form factor that allows their use in stylized enclosures. These receptacles may also be contoured to avoid circuitry internal to the device enclosure. The contoured form factor may also simplify the assembly of the connector receptacle.
Abstract translation: 连接器插座具有轮廓形状因子，允许它们在风格化的外壳中使用。 这些插座也可以是轮廓，以避免设备外壳内部的电路。 轮廓形状因素也可以简化连接器插座的组装。
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公开(公告)号：US20180069342A1
公开(公告)日：2018-03-08
申请号：US15471697
申请日：2017-03-28
Applicant: APPLE INC.
Inventor： Darshan R. Kasar , Craig M. Stanley , David B. Flamholz , Phillip Qian , Matthew E. Lang , Ferdinand S. Toting , Eric S. Jol , Trent K. Do , Joel C. Yamasaki , Hani Esmaeili , Nathan A. Van Nortwick , Richard J. Blanco , Jonathan C. Lorman , Daniel Wagman , Edward S. Huo
CPC classification number: H01R13/5219 , H01R13/521 , H01R13/5227 , H01R13/631 , H01R13/6683 , H01R13/6691 , H01R13/717 , H01R24/00 , H01R24/28 , H01R24/60 , H01R24/62 , H01R24/76 , H01R2107/00
Abstract: A plug connector for an electronic device has a deformable seal positioned on it such that when the plug connector is mated to the electronic device a liquid-tight seal is formed between the plug connector and the electronic device. A seal may also be positioned within a receptacle connector cavity of the electronic device such that it forms a liquid-tight seal to a plug connector when the plug connector is mated to the electronic device.
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公开(公告)号：US09666967B2
公开(公告)日：2017-05-30
申请号：US14444424
申请日：2014-07-28
Applicant: Apple Inc.
Inventor： Nathan P. Bosscher , Craig M. Stanley , Trent K. Do , John J. Baker , Phillip M. Hobson , Brad G. Boozer
CPC classification number: H01R12/732 , H01R12/722 , H01R35/04 , H05K1/038 , H05K1/14 , H05K1/148 , H05K3/36 , H05K2201/09027 , H05K2201/10189
Abstract: A mesh network of printed circuit boards (PCBs) including a first PCB coupled to a second rigid PCB by way of an interlocking connection is provided. The interlocking connection has a degree of freedom that allows the first and second PCBs to form a twist angle between each other; the interlocking connector configured to provide electrical coupling between active components disposed in each of the first and second PCBs. A method of forming a substrate fabric including a mesh network as above is also provided. Further provided is a method of activating the mesh network of printed circuit boards as above.
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公开(公告)号：US20160308294A1
公开(公告)日：2016-10-20
申请号：US15194134
申请日：2016-06-27
Applicant: Apple Inc.
Inventor： Trent K. Do , Brian S. Lau , Robert Scritzky , Aaron N. Miletich , George Tziviskos , Makiko Kawamura Brzezinski
CPC classification number: H01R12/716 , H01R12/7005 , H01R12/7082
Abstract: Board-to-board connectors are disclosed. The board to board connectors include a plurality of external connection structures, and a plurality of receptacle contacts. Each receptacle contact may be coupled to a corresponding external connection structure. Each receptacle contact may include an opening for receiving a plug contact for a corresponding plug side board-to-board connector, and an engaging feature where at least a portion of the engaging feature extends into a portion of the opening. The opening may have a receptacle alignment feature designed to correspond with a plug alignment feature on the plug side board-to-board connector.
Abstract translation: 公开了板对板连接器。 板对板连接器包括多个外部连接结构和多个插座触点。 每个插座触点可以耦合到对应的外部连接结构。 每个插座触点可以包括用于接收用于相应的插头侧板对板连接器的插头触点的开口，以及接合特征，其中接合特征的至少一部分延伸到开口的一部分中。 开口可以具有设计成对应于插头侧板对板连接器上的插头对准特征的插座对准功能。
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