-
公开(公告)号:US20200042050A1
公开(公告)日:2020-02-06
申请号:US16654793
申请日:2019-10-16
Applicant: Apple Inc.
Inventor: Brett W. DEGNER , Caitlin Elizabeth KALINOWSKI , Richard D. KOSOGLOW , Joshua D. BANKO , David H. NARAJOWSKI , Jonathan L. BERK , Michael E. LECLERC , Michael D. MCBROOM , Asif IQBAL , Paul S. MICHELSEN , Mark K. SIN , Paul A. BAKER , Harold L. SONTAG , Wai Ching YUEN , Matthew P. CASEBOLT , Kevin S. FETTERMAN , Alexander C. CALKINS , Daniel L. MCBROOM
IPC: G06F1/18 , G06F1/20 , H05K7/20 , H01L23/40 , H05K5/03 , H05K1/02 , F21V8/00 , G06F3/00 , G08B5/36 , G08B21/18
Abstract: An internal component and external interface arrangement for a cylindrical compact computing system is described that includes at least a structural heat sink having triangular shape disposed within a cylindrical volume defined by a cylindrical housing. A computing engine having a generally triangular shape is described having internal components that include a graphics processing unit (GPU) board, a central processing unit (CPU) board, an input/output (I/O) interface board, an interconnect board, and a power supply unit (PSU).
-
公开(公告)号:US20170308134A1
公开(公告)日:2017-10-26
申请号:US15637940
申请日:2017-06-29
Applicant: Apple Inc.
Inventor: Brett W. DEGNER , Caitlin Elizabeth KALINOWSKI , Richard D. KOSOGLOW , Joshua D. BANKO , David H. NARAJOWSKI , Jonathan L. BERK , Michael E. LECLERC , Michael D. MCBROOM , Asif IQBAL , Paul S. MICHELSEN , Mark K. SIN , Paul A. BAKER , Harold L. SONTAG , Wai Ching YUEN , Matthew P. CASEBOLT , Kevin S. FETTERMAN , Alexander C. CALKINS , Daniel L. MCBROOM
IPC: G06F1/18 , F21V8/00 , H05K7/20 , H05K5/03 , H05K1/02 , G08B21/18 , G08B5/36 , G06F3/00 , G06F1/20
CPC classification number: G06F1/181 , G02B6/0001 , G02B6/0008 , G02B6/001 , G06F1/182 , G06F1/183 , G06F1/185 , G06F1/188 , G06F1/20 , G06F1/206 , G06F3/00 , G08B5/36 , G08B21/18 , H01L23/4093 , H05K1/0203 , H05K5/03 , H05K7/20009 , H05K7/20145 , H05K7/20154 , H05K7/20163 , H05K7/20172 , H05K7/20209 , H05K7/2039 , H05K7/2049
Abstract: An internal component and external interface arrangement for a cylindrical compact computing system is described that includes at least a structural heat sink having triangular shape disposed within a cylindrical volume defined by a cylindrical housing. A computing engine having a generally triangular shape is described having internal components that include a graphics processing unit (GPU) board, a central processing unit (CPU) board, an input/output (I/O) interface board, an interconnect board, and a power supply unit (PSU).
-
公开(公告)号:US20170269641A1
公开(公告)日:2017-09-21
申请号:US15614354
申请日:2017-06-05
Applicant: Apple Inc.
Inventor: Brett W. DEGNER , Caitlin Elizabeth KALINOWSKI , Richard D. KOSOGLOW , Joshua D. BANKO , David H. NARAJOWSKI , Jonathan L. BERK , Michael E. LECLERC , Michael D. MCBROOM , Asif IQBAL , Paul S. MICHELSEN , Mark K. SIN , Paul A. BAKER , Harold L. SONTAG , Wai Ching YUEN , Matthew P. CASEBOLT , Kevin S. FETTERMAN , Alexander C. CALKINS , Daniel L. MCBROOM
IPC: G06F1/18 , F21V8/00 , G06F1/20 , G06F3/00 , G08B21/18 , G08B5/36 , H05K1/02 , H05K5/03 , H05K7/20
CPC classification number: G06F1/181 , G02B6/0001 , G02B6/0008 , G02B6/001 , G06F1/182 , G06F1/183 , G06F1/185 , G06F1/188 , G06F1/20 , G06F1/206 , G06F3/00 , G08B5/36 , G08B21/18 , H01L23/4093 , H05K1/0203 , H05K5/03 , H05K7/20009 , H05K7/20145 , H05K7/20154 , H05K7/20163 , H05K7/20172 , H05K7/20209 , H05K7/2039 , H05K7/2049
Abstract: An internal component and external interface arrangement for a cylindrical compact computing system is described that includes at least a structural heat sink having triangular shape disposed within a cylindrical volume defined by a cylindrical housing. A computing engine having a generally triangular shape is described having internal components that include a graphics processing unit (GPU) board, a central processing unit (CPU) board, an input/output (I/O) interface board, an interconnect board, and a power supply unit (PSU).
-
公开(公告)号:US20180246548A1
公开(公告)日:2018-08-30
申请号:US15965272
申请日:2018-04-27
Applicant: Apple Inc.
Inventor: Brett W. DEGNER , Caitlin Elizabeth KALINOWSKI , Richard D. KOSOGLOW , Joshua D. BANKO , David H. NARAJOWSKI , Jonathan L. BERK , Michael E. LECLERC , Michael D. MCBROOM , Asif IQBAL , Paul S. MICHELSEN , Mark K. SIN , Paul A. BAKER , Harold L. SONTAG , Wai Ching YUEN , Matthew P. CASEBOLT , Kevin S. FETTERMAN , Alexander C. CALKINS , Daniel L. MCBROOM
IPC: G06F1/18 , F21V8/00 , G06F1/20 , G06F3/00 , G08B5/36 , G08B21/18 , H05K1/02 , H05K5/03 , H05K7/20
CPC classification number: G06F1/181 , G02B6/0001 , G02B6/0008 , G02B6/001 , G06F1/182 , G06F1/183 , G06F1/185 , G06F1/188 , G06F1/20 , G06F1/206 , G06F3/00 , G08B5/36 , G08B21/18 , H01L23/4093 , H05K1/0203 , H05K5/03 , H05K7/20009 , H05K7/20145 , H05K7/20154 , H05K7/20163 , H05K7/20172 , H05K7/20209 , H05K7/2039 , H05K7/2049
Abstract: An internal component and external interface arrangement for a cylindrical compact computing system is described that includes at least a structural heat sink having triangular shape disposed within a cylindrical volume defined by a cylindrical housing. A computing engine having a generally triangular shape is described having internal components that include a graphics processing unit (GPU) board, a central processing unit (CPU) board, an input/output (I/O) interface board, an interconnect board, and a power supply unit (PSU).
-
公开(公告)号:US20180246547A1
公开(公告)日:2018-08-30
申请号:US15964973
申请日:2018-04-27
Applicant: Apple Inc.
Inventor: Brett W. DEGNER , Caitlin Elizabeth KALINOWSKI , Richard D. KOSOGLOW , Joshua D. BANKO , David H. NARAJOWSKI , Jonathan L. BERK , Michael E. LECLERC , Michael D. MCBROOM , Asif IQBAL , Paul S. MICHELSEN , Mark K. SIN , Paul A. BAKER , Harold L. SONTAG , Wai Ching YUEN , Matthew P. CASEBOLT , Kevin S. FETTERMAN , Alexander C. CALKINS , Daniel L. MCBROOM
IPC: G06F1/18 , F21V8/00 , G06F1/20 , G06F3/00 , G08B5/36 , G08B21/18 , H05K1/02 , H05K5/03 , H05K7/20
CPC classification number: G06F1/181 , G02B6/0001 , G02B6/0008 , G02B6/001 , G06F1/182 , G06F1/183 , G06F1/185 , G06F1/188 , G06F1/20 , G06F1/206 , G06F3/00 , G08B5/36 , G08B21/18 , H01L23/4093 , H05K1/0203 , H05K5/03 , H05K7/20009 , H05K7/20145 , H05K7/20154 , H05K7/20163 , H05K7/20172 , H05K7/20209 , H05K7/2039 , H05K7/2049
Abstract: An internal component and external interface arrangement for a cylindrical compact computing system is described that includes at least a structural heat sink having triangular shape disposed within a cylindrical volume defined by a cylindrical housing. A computing engine having a generally triangular shape is described having internal components that include a graphics processing unit (GPU) board, a central processing unit (CPU) board, an input/output (I/O) interface board, an interconnect board, and a power supply unit (PSU).
-
公开(公告)号:US20230251694A1
公开(公告)日:2023-08-10
申请号:US18131983
申请日:2023-04-07
Applicant: APPLE INC.
Inventor: Brett W. DEGNER , Caitlin Elizabeth KALINOWSKI , Richard D. KOSOGLOW , Joshua D. BANKO , David H. NARAJOWSKI , Jonathan L. BERK , Michael E. LECLERC , Michael D. MCBROOM , Asif IQBAL , Paul S. MICHELSEN , Mark K. SIN , Paul A. BAKER , Harold L. SONTAG , Wai Ching YUEN , Matthew P. CASEBOLT , Kevin S. FETTERMAN , Alexander C. CALKINS , Daniel L. MCBROOM
IPC: G06F1/18 , G06F1/20 , H05K7/20 , H01L23/40 , H05K5/03 , H05K1/02 , F21V8/00 , G06F3/00 , G08B5/36 , G08B21/18
CPC classification number: G06F1/181 , G06F1/20 , H05K7/20145 , H05K7/20163 , H05K7/20172 , H05K7/2049 , H01L23/4093 , G06F1/182 , G06F1/183 , G06F1/185 , G06F1/188 , H05K5/03 , H05K1/0203 , G02B6/0001 , G02B6/0008 , G02B6/001 , G06F1/206 , G06F3/00 , G08B5/36 , G08B21/18 , H05K7/20154 , H05K7/20209 , H05K7/2039 , H05K7/20009
Abstract: An internal component and external interface arrangement for a cylindrical compact computing system is described that includes at least a structural heat sink having triangular shape disposed within a cylindrical volume defined by a cylindrical housing. A computing engine having a generally triangular shape is described having internal components that include a graphics processing unit (GPU) board, a central processing unit (CPU) board, an input/output (I/O) interface board, an interconnect board, and a power supply unit (PSU).
-
公开(公告)号:US20220155830A1
公开(公告)日:2022-05-19
申请号:US17649661
申请日:2022-02-01
Applicant: Apple Inc.
Inventor: Brett W. DEGNER , Caitlin Elizabeth KALINOWSKI , Richard D. KOSOGLOW , Joshua D. BANKO , David H. NARAJOWSKI , Jonathan L. BERK , Michael E. LECLERC , Michael D. MCBROOM , Asif IQBAL , Paul S. MICHELSEN , Mark K. SIN , Paul A. BAKER , Harold L. SONTAG , Wai Ching YUEN , Matthew P. CASEBOLT , Kevin S. FETTERMAN , Alexander C. CALKINS , Daniel L. MCBROOM
IPC: G06F1/18 , G06F1/20 , H05K7/20 , H01L23/40 , H05K5/03 , H05K1/02 , F21V8/00 , G06F3/00 , G08B5/36 , G08B21/18
Abstract: An internal component and external interface arrangement for a cylindrical compact computing system is described that includes at least a structural heat sink having triangular shape disposed within a cylindrical volume defined by a cylindrical housing. A computing engine having a generally triangular shape is described having internal components that include a graphics processing unit (GPU) board, a central processing unit (CPU) board, an input/output (I/O) interface board, an interconnect board, and a power supply unit (PSU).
-
公开(公告)号:US20170300095A1
公开(公告)日:2017-10-19
申请号:US15637981
申请日:2017-06-29
Applicant: Apple Inc.
Inventor: Brett W. DEGNER , Caitlin Elizabeth KALINOWSKI , Richard D. KOSOGLOW , Joshua D. BANKO , David H. NARAJOWSKI , Jonathan L. BERK , Michael E. LECLERC , Michael D. MCBROOM , Asif IQBAL , Paul S. MICHELSEN , Mark K. SIN , Paul A. BAKER , Harold L. SONTAG , Wai Ching YUEN , Matthew P. CASEBOLT , Kevin S. FETTERMAN , Alexander C. CALKINS , Daniel L. MCBROOM
CPC classification number: G06F1/181 , G02B6/0001 , G02B6/0008 , G02B6/001 , G06F1/182 , G06F1/183 , G06F1/185 , G06F1/188 , G06F1/20 , G06F1/206 , G06F3/00 , G08B5/36 , G08B21/18 , H01L23/4093 , H05K1/0203 , H05K5/03 , H05K7/20009 , H05K7/20145 , H05K7/20154 , H05K7/20163 , H05K7/20172 , H05K7/20209 , H05K7/2039 , H05K7/2049
Abstract: An internal component and external interface arrangement for a cylindrical compact computing system is described that includes at least a structural heat sink having triangular shape disposed within a cylindrical volume defined by a cylindrical housing. A computing engine having a generally triangular shape is described having internal components that include a graphics processing unit (GPU) board, a central processing unit (CPU) board, an input/output (I/O) interface board, an interconnect board, and a power supply unit (PSU).
-
公开(公告)号:US20230284372A1
公开(公告)日:2023-09-07
申请号:US17653634
申请日:2022-03-04
Applicant: Apple Inc.
Inventor: Kristopher P. LAURENT , Brett W. DEGNER , Jay S. NIGEN , Eric R. PRATHER , David H. NARAJOWSKI
CPC classification number: H05K1/0209 , G06F1/203 , G06F2200/201 , H05K2201/064 , H05K2201/066
Abstract: This application relates to a layout of components within an electronic device. The electronic device includes a circuit board and one or more thermal components located on or proximate to each surface of the circuit board. As a result, thermal energy generated by components of the circuit board are drawn away from the circuit board in a more efficient manner. Additionally, the electronic device may include one or more air movers designed to draw ambient air into the electronic device in a manner that causes the ambient air to cool components upstream from the air movers. Further, the electronic device includes a fin stack that is thermally coupled to the aforementioned thermal components, and further receives air driven in by the air mover(s). Also, the electronic device is designed to receive the ambient air through openings that define a 360-degree air inlet.
-
公开(公告)号:US20170070001A1
公开(公告)日:2017-03-09
申请号:US15256156
申请日:2016-09-02
Applicant: Apple Inc.
Inventor: Brett W. DEGNER , David H. NARAJOWSKI , Oliver C. ROSS , Hao ZHU , Erik A. UTTERMANN , Stephen R. MCCLURE , Melody L. KUNA
IPC: H01R13/62
CPC classification number: H01R13/6205 , H01R13/6315
Abstract: An accessory to device coupling system can include a first magnet array adapted for assembly with respect to a surface of an electronic device and a second magnet array adapted for assembly with respect to a surface of an accessory device, the accessory device configured to interact electrically with the electronic device. The first magnet array can include a first plurality of magnets arranged in a first pattern of alternating polarities, and the second magnet array can include a second plurality of magnets arranged in a second pattern of alternating polarities that corresponds to the first pattern of alternating polarities. The corresponding alternating polarity patterns can cause the second magnet array to couple to the first magnet array with a normalized attraction force only at an intended orientation and alignment, and with less than half of the normalized attraction force at any other orientation and alignment.
Abstract translation: 设备耦合系统的附件可以包括适于相对于电子设备的表面组装的第一磁体阵列和适于相对于附件设备的表面组装的第二磁体阵列,所述辅助设备被配置为与 电子设备。 第一磁体阵列可以包括以交替极性的第一图案布置的第一多个磁体,并且第二磁体阵列可以包括以对应于交替极性的第一图案的交替极性的第二图案布置的第二多个磁体。 相应的交替极性图案可以使得第二磁体阵列仅在预期的取向和对准下以归一化的吸引力耦合到第一磁体阵列,并且在任何其它取向和对准下具有少于归一化吸引力的一半。
-
-
-
-
-
-
-
-
-